Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG731C: High-Performance Xilinx Spartan-II FPGA for Cost-Effective Design Solutions

Product Details

The XC2S200-6FGG731C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family, designed to deliver exceptional value for engineers seeking a powerful yet cost-effective programmable logic solution. This Xilinx FPGA offers 200,000 system gates, 5292 logic cells, and operates at frequencies up to 263MHz, making it an ideal choice for a wide range of embedded and industrial applications.


XC2S200-6FGG731C Key Features and Specifications

The XC2S200-6FGG731C combines advanced architectural features with reliable performance characteristics. Below are the comprehensive technical specifications that make this FPGA stand out in its class.

Logic Resources and Gate Count

Parameter Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284

Memory Configuration

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56K bits
Total RAM 57,344 bits

Electrical Characteristics

Parameter Value
Core Voltage Supply 2.5V (2.375V – 2.625V)
I/O Voltage Supports multiple standards
Speed Grade -6 (High Performance)
Maximum Frequency 263MHz

XC2S200-6FGG731C Package Information

731-Ball Fine Pitch BGA Package Details

The XC2S200-6FGG731C utilizes a 731-ball Fine Pitch Ball Grid Array (FBGA) package, providing excellent signal integrity and thermal performance for demanding applications.

Package Specification Value
Package Type 731-FBGA
Mounting Type Surface Mount (SMD)
RoHS Compliance Yes (Pb-Free)
Lead-Free Status Lead-Free / Green

Operating Conditions

Parameter Range
Operating Temperature 0°C to +85°C (Commercial)
Storage Temperature -65°C to +150°C
Junction Temperature TJ Max: 85°C

Why Choose XC2S200-6FGG731C for Your FPGA Design

Superior ASIC Alternative

The XC2S200-6FGG731C offers significant advantages over traditional mask-programmed ASICs. Engineers benefit from eliminating high initial costs, reducing lengthy development cycles, and mitigating the inherent risks associated with conventional ASIC development.

Field Programmability

One of the most compelling features of the XC2S200-6FGG731C is its unlimited reprogrammability. Design upgrades can be implemented in the field without any hardware replacement—a capability impossible with ASICs. This flexibility translates to reduced time-to-market and lower total cost of ownership.

Cost-Effective 0.18 Micron Technology

Built on a proven 0.18-micron CMOS process technology, the XC2S200-6FGG731C delivers an optimal balance between performance, power consumption, and manufacturing cost. This mature fabrication process ensures high yields and reliable component availability.


XC2S200-6FGG731C Architecture Overview

Configurable Logic Blocks (CLBs)

The Spartan-II architecture features a regular, flexible array of Configurable Logic Blocks arranged in a 28 × 42 matrix. Each CLB contains multiple slices with look-up tables (LUTs), flip-flops, and carry logic for implementing complex digital functions.

Input/Output Blocks (IOBs)

The XC2S200-6FGG731C provides up to 284 programmable I/O pins supporting multiple I/O standards for seamless interfacing with various system components. The IOBs surround the CLB array and offer configurable drive strength and slew rate control.

Delay-Locked Loops (DLLs)

Four Delay-Locked Loops, positioned at each corner of the die, enable precise clock management. DLLs can eliminate clock distribution delays and generate phase-shifted clock outputs for advanced timing control.

Block RAM Architecture

Two dedicated columns of Block RAM provide 56K bits of synchronous dual-port memory. This on-chip memory is ideal for implementing FIFOs, register files, and small lookup tables without consuming valuable logic resources.


XC2S200-6FGG731C Application Areas

The versatility of the XC2S200-6FGG731C makes it suitable for numerous industry applications.

Telecommunications and Networking

The high-speed performance and extensive I/O capabilities make the XC2S200-6FGG731C ideal for implementing network routers, switches, and protocol converters. Its 263MHz operation supports demanding data processing requirements.

Industrial Control Systems

For factory automation, motor control, and process monitoring applications, the XC2S200-6FGG731C provides the reliability and real-time performance essential for industrial environments.

Consumer Electronics

Cost-sensitive consumer applications benefit from the XC2S200-6FGG731C’s competitive pricing without sacrificing performance. Typical implementations include video processing, audio equipment, and smart home devices.

Medical Equipment

The commercial temperature range and proven reliability make this FPGA appropriate for diagnostic equipment, patient monitoring systems, and laboratory instruments.

Automotive and Transportation

Advanced driver-assistance systems (ADAS), infotainment units, and vehicle control modules leverage the XC2S200-6FGG731C’s processing capabilities and environmental resilience.


Development Tools and Software Support

Xilinx ISE Design Suite

The XC2S200-6FGG731C is fully supported by the Xilinx ISE development environment, providing comprehensive tools for design entry, synthesis, implementation, and verification.

Design Features Include

  • Automatic mapping, placement, and routing
  • Timing-driven optimization
  • Bitstream generation and device programming
  • Comprehensive simulation support
  • Constraint-driven implementation

XC2S200-6FGG731C Ordering Information

Part Number Breakdown

Code Element Meaning
XC2S200 Spartan-II 200K gate device
-6 Speed grade (highest performance)
FGG Fine-pitch BGA, Pb-free (Green)
731 731-ball package
C Commercial temperature (0°C to 85°C)

Quality and Compliance

  • RoHS 2 Compliant (Directive 2011/65/EU)
  • REACH Compliant
  • Lead-Free / Pb-Free Assembly Compatible
  • Moisture Sensitivity Level (MSL): Per JEDEC J-STD-020

Frequently Asked Questions About XC2S200-6FGG731C

What is the maximum clock frequency of the XC2S200-6FGG731C?

The XC2S200-6FGG731C supports clock frequencies up to 263MHz, enabling high-throughput digital signal processing and data manipulation tasks.

Is the XC2S200-6FGG731C RoHS compliant?

Yes, the “G” designation in FGG indicates this is a Pb-free (lead-free) package that complies with RoHS environmental regulations.

What voltage does the XC2S200-6FGG731C require?

The device operates on a 2.5V core supply voltage with a tolerance range of 2.375V to 2.625V. I/O banks support multiple voltage standards for flexible system integration.

Can the XC2S200-6FGG731C be used in industrial applications?

Yes, the commercial temperature range (0°C to +85°C) supports many industrial applications. For extended temperature requirements, contact suppliers for industrial-grade variants.


Technical Resources and Documentation

Engineers working with the XC2S200-6FGG731C can access comprehensive documentation including complete datasheets, user guides, application notes covering design best practices, reference designs for common applications, and IBIS models for signal integrity analysis.


Summary

The XC2S200-6FGG731C represents an excellent choice for engineers requiring a balance of performance, flexibility, and cost-effectiveness in their FPGA designs. With 200,000 system gates, 5292 logic cells, and support for operating frequencies up to 263MHz, this Spartan-II family member delivers the capabilities needed for telecommunications, industrial, consumer, and embedded applications.

The RoHS-compliant 731-ball FBGA package ensures environmental compliance while providing robust mechanical and electrical connections. Combined with comprehensive development tool support and proven reliability, the XC2S200-6FGG731C stands as a dependable foundation for your next programmable logic design.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.