Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG730C: High-Performance Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG730C is a powerful field-programmable gate array (FPGA) from the renowned Xilinx Spartan-II family. Engineered with advanced 0.18µm CMOS technology, this programmable logic device delivers exceptional performance for cost-sensitive embedded system designs. With 200,000 system gates and the fastest -6 speed grade, the XC2S200-6FGG730C provides the ideal balance of processing capability and energy efficiency.

Key Features of the XC2S200-6FGG730C FPGA

The XC2S200-6FGG730C stands out among programmable logic devices with its impressive feature set. This Xilinx FPGA combines high-density logic resources with flexible I/O capabilities, making it suitable for demanding digital design applications.

Logic Resources and Processing Capability

Specification Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Distributed RAM 75,264 bits
Block RAM 56 Kbits

Electrical and Package Specifications

Parameter Specification
Core Voltage 2.5V
Package Type Fine-Pitch BGA (Pb-Free)
Pin Count 730
Maximum User I/O 284
Speed Grade -6 (Fastest)
Operating Temperature 0°C to +85°C (Commercial)
Process Technology 0.18µm CMOS
RoHS Compliance Yes

Detailed Technical Specifications

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG730C features 1,176 configurable logic blocks arranged in a 28×42 array. Each CLB contains four logic cells (LCs), providing flexibility for implementing complex digital functions. The architecture supports both combinatorial logic and sequential elements through integrated flip-flops.

On-Chip Memory Architecture

This Spartan-II FPGA integrates two types of memory resources:

  • Distributed RAM: 75,264 bits of distributed memory implemented using look-up tables (LUTs), enabling fast, localized storage for state machines and small buffers
  • Block RAM: 56 Kbits of dedicated dual-port block RAM organized in columns, ideal for FIFO buffers, data caching, and memory-intensive applications

Input/Output Block (IOB) Features

The XC2S200-6FGG730C provides up to 284 user-configurable I/O pins supporting multiple I/O standards:

  • LVTTL and LVCMOS (3.3V and 2.5V)
  • PCI compliant interfaces
  • GTL and GTL+ signaling
  • SSTL3 for DDR memory interfaces
  • HSTL for high-speed signaling

Clock Management Resources

Four dedicated Delay-Locked Loops (DLLs) provide clock conditioning and distribution:

  • Clock deskewing and phase adjustment
  • Frequency synthesis capabilities
  • Low-jitter clock distribution
  • Support for multiple clock domains

XC2S200-6FGG730C Applications

Telecommunications Equipment

The XC2S200-6FGG730C excels in telecommunications infrastructure, including base stations, network switches, and protocol conversion equipment. Its high-speed I/O capabilities and substantial logic resources support complex signal processing algorithms.

Industrial Automation Systems

Manufacturing and process control applications benefit from the FPGA’s deterministic timing and parallel processing capabilities. The XC2S200-6FGG730C handles motor control, sensor interfaces, and real-time monitoring with precision.

Consumer Electronics

Cost-effective programmability makes this Spartan-II device ideal for consumer products requiring custom digital logic, including set-top boxes, display controllers, and audio/video processing equipment.

Automotive Electronics

With commercial-grade temperature specifications, the XC2S200-6FGG730C serves in automotive infotainment systems, advanced driver-assistance systems (ADAS), and vehicle networking applications.

Design Benefits and Advantages

Superior Alternative to ASICs

The XC2S200-6FGG730C eliminates the high non-recurring engineering (NRE) costs associated with application-specific integrated circuits. Designers can iterate rapidly through prototyping phases without expensive mask changes.

Field Upgradability

Unlike fixed-function devices, this FPGA supports in-system reprogramming. Product enhancements and bug fixes deploy through firmware updates without hardware modifications.

Accelerated Time-to-Market

Programmable logic significantly reduces development cycles compared to custom silicon solutions. The XC2S200-6FGG730C enables teams to meet aggressive project schedules while maintaining design flexibility.

Design Migration Path

Pin-compatible package options within the Spartan-II family allow seamless migration between device densities. Designs can scale from lower-density variants to the XC2S200-6FGG730C without PCB modifications.

Configuration and Programming

Supported Configuration Modes

The XC2S200-6FGG730C supports multiple configuration interfaces:

  • Master Serial Mode: Sequential configuration from serial PROMs
  • Slave Serial Mode: Configuration controlled by external processor
  • Master Parallel Mode: 8-bit parallel configuration from parallel PROMs
  • Slave Parallel Mode: Processor-driven parallel configuration
  • Boundary Scan (JTAG): IEEE 1149.1 compliant programming and debugging

Configuration Storage Options

Compatible configuration storage devices include Xilinx Platform Flash PROMs and standard serial/parallel EEPROMs. The configuration bitstream size for the XC2S200-6FGG730C requires appropriate storage capacity planning.

Development Tool Support

ISE Design Suite Compatibility

The XC2S200-6FGG730C is fully supported by Xilinx ISE Design Suite, providing:

  • HDL synthesis (Verilog and VHDL)
  • Schematic capture and simulation
  • Place-and-route optimization
  • Timing analysis and constraint management
  • In-circuit debugging with ChipScope

Third-Party Tool Integration

Major EDA vendors provide synthesis and simulation tools compatible with Spartan-II devices, ensuring designers can leverage existing toolchains and workflows.

Ordering Information

Part Number Breakdown

XC2S200-6FGG730C

Code Description
XC2S200 Spartan-II 200K gate device
-6 Fastest speed grade
FG Fine-pitch BGA package
G Pb-free (RoHS compliant)
730 Pin count
C Commercial temperature (0°C to +85°C)

Quality and Compliance

The XC2S200-6FGG730C meets stringent quality standards:

  • RoHS Compliance: Lead-free packaging (Pb-free)
  • MSL Rating: Moisture Sensitivity Level per IPC/JEDEC standards
  • ESD Protection: Human Body Model (HBM) and Charged Device Model (CDM) compliant

Summary

The XC2S200-6FGG730C delivers exceptional value for mid-density FPGA applications. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O support, this Spartan-II device addresses diverse design requirements from telecommunications to industrial automation. The fastest -6 speed grade ensures optimal performance, while the Pb-free BGA package meets modern environmental regulations.

Whether replacing costly ASICs or implementing custom digital logic, the XC2S200-6FGG730C provides the programmable foundation for successful product development.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.