The XC2S200-6FGG730C is a powerful field-programmable gate array (FPGA) from the renowned Xilinx Spartan-II family. Engineered with advanced 0.18µm CMOS technology, this programmable logic device delivers exceptional performance for cost-sensitive embedded system designs. With 200,000 system gates and the fastest -6 speed grade, the XC2S200-6FGG730C provides the ideal balance of processing capability and energy efficiency.
Key Features of the XC2S200-6FGG730C FPGA
The XC2S200-6FGG730C stands out among programmable logic devices with its impressive feature set. This Xilinx FPGA combines high-density logic resources with flexible I/O capabilities, making it suitable for demanding digital design applications.
Logic Resources and Processing Capability
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
Electrical and Package Specifications
| Parameter |
Specification |
| Core Voltage |
2.5V |
| Package Type |
Fine-Pitch BGA (Pb-Free) |
| Pin Count |
730 |
| Maximum User I/O |
284 |
| Speed Grade |
-6 (Fastest) |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Process Technology |
0.18µm CMOS |
| RoHS Compliance |
Yes |
Detailed Technical Specifications
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG730C features 1,176 configurable logic blocks arranged in a 28×42 array. Each CLB contains four logic cells (LCs), providing flexibility for implementing complex digital functions. The architecture supports both combinatorial logic and sequential elements through integrated flip-flops.
On-Chip Memory Architecture
This Spartan-II FPGA integrates two types of memory resources:
- Distributed RAM: 75,264 bits of distributed memory implemented using look-up tables (LUTs), enabling fast, localized storage for state machines and small buffers
- Block RAM: 56 Kbits of dedicated dual-port block RAM organized in columns, ideal for FIFO buffers, data caching, and memory-intensive applications
Input/Output Block (IOB) Features
The XC2S200-6FGG730C provides up to 284 user-configurable I/O pins supporting multiple I/O standards:
- LVTTL and LVCMOS (3.3V and 2.5V)
- PCI compliant interfaces
- GTL and GTL+ signaling
- SSTL3 for DDR memory interfaces
- HSTL for high-speed signaling
Clock Management Resources
Four dedicated Delay-Locked Loops (DLLs) provide clock conditioning and distribution:
- Clock deskewing and phase adjustment
- Frequency synthesis capabilities
- Low-jitter clock distribution
- Support for multiple clock domains
XC2S200-6FGG730C Applications
Telecommunications Equipment
The XC2S200-6FGG730C excels in telecommunications infrastructure, including base stations, network switches, and protocol conversion equipment. Its high-speed I/O capabilities and substantial logic resources support complex signal processing algorithms.
Industrial Automation Systems
Manufacturing and process control applications benefit from the FPGA’s deterministic timing and parallel processing capabilities. The XC2S200-6FGG730C handles motor control, sensor interfaces, and real-time monitoring with precision.
Consumer Electronics
Cost-effective programmability makes this Spartan-II device ideal for consumer products requiring custom digital logic, including set-top boxes, display controllers, and audio/video processing equipment.
Automotive Electronics
With commercial-grade temperature specifications, the XC2S200-6FGG730C serves in automotive infotainment systems, advanced driver-assistance systems (ADAS), and vehicle networking applications.
Design Benefits and Advantages
Superior Alternative to ASICs
The XC2S200-6FGG730C eliminates the high non-recurring engineering (NRE) costs associated with application-specific integrated circuits. Designers can iterate rapidly through prototyping phases without expensive mask changes.
Field Upgradability
Unlike fixed-function devices, this FPGA supports in-system reprogramming. Product enhancements and bug fixes deploy through firmware updates without hardware modifications.
Accelerated Time-to-Market
Programmable logic significantly reduces development cycles compared to custom silicon solutions. The XC2S200-6FGG730C enables teams to meet aggressive project schedules while maintaining design flexibility.
Design Migration Path
Pin-compatible package options within the Spartan-II family allow seamless migration between device densities. Designs can scale from lower-density variants to the XC2S200-6FGG730C without PCB modifications.
Configuration and Programming
Supported Configuration Modes
The XC2S200-6FGG730C supports multiple configuration interfaces:
- Master Serial Mode: Sequential configuration from serial PROMs
- Slave Serial Mode: Configuration controlled by external processor
- Master Parallel Mode: 8-bit parallel configuration from parallel PROMs
- Slave Parallel Mode: Processor-driven parallel configuration
- Boundary Scan (JTAG): IEEE 1149.1 compliant programming and debugging
Configuration Storage Options
Compatible configuration storage devices include Xilinx Platform Flash PROMs and standard serial/parallel EEPROMs. The configuration bitstream size for the XC2S200-6FGG730C requires appropriate storage capacity planning.
Development Tool Support
ISE Design Suite Compatibility
The XC2S200-6FGG730C is fully supported by Xilinx ISE Design Suite, providing:
- HDL synthesis (Verilog and VHDL)
- Schematic capture and simulation
- Place-and-route optimization
- Timing analysis and constraint management
- In-circuit debugging with ChipScope
Third-Party Tool Integration
Major EDA vendors provide synthesis and simulation tools compatible with Spartan-II devices, ensuring designers can leverage existing toolchains and workflows.
Ordering Information
Part Number Breakdown
XC2S200-6FGG730C
| Code |
Description |
| XC2S200 |
Spartan-II 200K gate device |
| -6 |
Fastest speed grade |
| FG |
Fine-pitch BGA package |
| G |
Pb-free (RoHS compliant) |
| 730 |
Pin count |
| C |
Commercial temperature (0°C to +85°C) |
Quality and Compliance
The XC2S200-6FGG730C meets stringent quality standards:
- RoHS Compliance: Lead-free packaging (Pb-free)
- MSL Rating: Moisture Sensitivity Level per IPC/JEDEC standards
- ESD Protection: Human Body Model (HBM) and Charged Device Model (CDM) compliant
Summary
The XC2S200-6FGG730C delivers exceptional value for mid-density FPGA applications. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O support, this Spartan-II device addresses diverse design requirements from telecommunications to industrial automation. The fastest -6 speed grade ensures optimal performance, while the Pb-free BGA package meets modern environmental regulations.
Whether replacing costly ASICs or implementing custom digital logic, the XC2S200-6FGG730C provides the programmable foundation for successful product development.