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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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XC2S200-6FGG728C | Xilinx Spartan-II FPGA 200K System Gates

Product Details

The XC2S200-6FGG728C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. Engineered with 200,000 system gates and advanced 0.18-micron CMOS technology, this Xilinx FPGA delivers exceptional flexibility and cost-effectiveness for demanding digital design applications. Whether you are developing industrial control systems, telecommunications equipment, or consumer electronics, the XC2S200-6FGG728C provides the logic density and performance required for modern embedded designs.


XC2S200-6FGG728C Technical Specifications

The XC2S200-6FGG728C combines robust architecture with versatile I/O capabilities, making it suitable for a wide range of applications requiring programmable logic solutions.

Core Logic Resources

Parameter Specification
Part Number XC2S200-6FGG728C
Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Number of CLBs 1,176
Speed Grade -6 (Fastest)
Process Technology 0.18 µm CMOS

XC2S200-6FGG728C Memory Architecture

Memory Type Capacity
Block RAM 56 Kbits
Distributed RAM 75,264 bits
Total RAM Bits 57,344
SelectRAM Configuration 16 bits/LUT distributed + 4K-bit block RAM

I/O and Package Information

Specification Value
Maximum User I/O 284
Package Type Fine-Pitch BGA (FBGA)
Pin Count 728
I/O Standards Supported 16
Supply Voltage (Core) 2.375V – 2.625V (Nominal 2.5V)
I/O Voltage Support 1.5V, 2.5V, 3.3V
Operating Temperature 0°C to +85°C (Commercial)
Mounting Type Surface Mount
RoHS Compliance Lead-Free (Pb-Free)

XC2S200-6FGG728C Key Features and Benefits

High-Performance Spartan-II Architecture

The XC2S200-6FGG728C leverages the proven Spartan-II FPGA architecture, which is derived from the industry-leading Virtex platform. This second-generation ASIC replacement technology delivers streamlined features optimized for high-volume, cost-sensitive applications while maintaining exceptional performance capabilities.

Advanced Clock Management with DLL

This device integrates four dedicated Delay-Locked Loops (DLLs), positioned at each corner of the die for optimal clock distribution. The DLL features include:

  • Zero propagation delay clock distribution
  • Low clock skew across all flip-flops and block RAM
  • Clock multiplication and division capabilities (divide by 1.5, 2, 2.5, 3, 4, 5, 8, or 16)
  • Four quadrature phase outputs
  • Board-level clock deskewing through clock mirroring functionality

Flexible SelectRAM Hierarchical Memory

The XC2S200-6FGG728C offers a sophisticated memory hierarchy through Xilinx’s SelectRAM technology:

  • Distributed RAM: 16 bits per Look-Up Table (LUT) for fine-grained storage
  • Block RAM: Configurable 4K-bit true dual-port RAM modules organized in columns
  • Synchronous Operation: Both single-port and dual-port configurations supported
  • Independent Port Control: Each block RAM port features independent clock, write enable, and address signals

Versatile I/O Standards Support

The 284 user I/O pins support 16 different signaling standards, enabling seamless integration with various interface protocols:

  • LVTTL and LVCMOS (3.3V, 2.5V, 1.5V)
  • PCI 3.3V compliant
  • GTL and GTL+
  • SSTL3 Class I and II
  • SSTL2 Class I and II
  • HSTL Class I, III, and IV
  • CTT
  • AGP-2X

XC2S200-6FGG728C Functional Block Diagram

The internal architecture consists of five primary configurable elements working in harmony:

  1. Configurable Logic Blocks (CLBs): Form the main programmable logic fabric with direct access to all routing resources
  2. Input/Output Blocks (IOBs): Surround the CLB array and provide programmable interfacing to external devices
  3. Block RAM Columns: Two dedicated columns along the vertical edges for high-speed memory access
  4. Delay-Locked Loops (DLLs): Four circuits at each corner for precise clock management
  5. Versatile Routing Architecture: Hierarchical interconnect channels enabling efficient signal routing

XC2S200-6FGG728C Application Areas

Industrial Automation and Control

The XC2S200-6FGG728C excels in factory automation systems, motor control applications, programmable logic controllers (PLCs), and smart sensor interfaces. Its robust temperature range and reliable operation make it ideal for demanding industrial environments.

Telecommunications and Networking

Deploy this FPGA in base stations, network switches, routers, and protocol converters where high-speed data processing and flexible interface protocols are essential. The DLL-based clock management ensures precise timing for communication standards.

Consumer Electronics

From smart TVs and gaming peripherals to home automation hubs, the XC2S200-6FGG728C provides cost-effective programmable logic for video processing, audio systems, and control applications.

Automotive Electronics

Suitable for infotainment systems, advanced driver assistance systems (ADAS), and sensor fusion applications. The field-programmable nature allows over-the-air updates as automotive standards evolve.

Embedded Systems and IoT

The combination of low power consumption, high logic density, and multi-voltage I/O support makes this device perfect for Internet of Things (IoT) gateways and embedded processing platforms.


XC2S200-6FGG728C Part Number Breakdown

Understanding the part number helps identify the exact device configuration:

Segment Value Description
XC2S XC2S Xilinx Spartan-II Family
200 200 200,000 System Gates
-6 -6 Speed Grade (Fastest)
FGG FGG Fine-Pitch BGA, Pb-Free
728 728 728-Pin Package
C C Commercial Temperature (0°C to +85°C)

Why Choose the XC2S200-6FGG728C FPGA?

Cost-Effective ASIC Alternative

The XC2S200-6FGG728C eliminates the high NRE (Non-Recurring Engineering) costs, lengthy development cycles, and inherent risks associated with traditional mask-programmed ASICs. Engineers benefit from unlimited reprogrammability throughout the product lifecycle.

Field-Upgradable Design

Unlike fixed-function ASICs, this FPGA enables in-field design updates without hardware replacement. This flexibility significantly extends product lifespan and allows rapid response to changing requirements or standards.

Comprehensive Development Support

Xilinx provides extensive design tools through the ISE Design Suite, offering automated mapping, placement, and routing capabilities. The mature toolchain ensures rapid time-to-market for new designs.

Package Migration Path

The Spartan-II family shares common package footprints across different density options, enabling seamless migration between XC2S50, XC2S100, XC2S150, and XC2S200 devices without PCB redesign.


XC2S200-6FGG728C Configuration Options

The device supports multiple configuration modes for maximum flexibility:

  • Master Serial Mode: Configuration data loaded from external serial PROM
  • Slave Serial Mode: External controller provides configuration clocking
  • Slave Parallel Mode: Byte-wide configuration for faster programming
  • Boundary Scan (JTAG): IEEE 1149.1 compliant for testing and configuration

Xilinx Platform Flash in-system programmable PROMs provide a cost-effective and reliable configuration storage solution.


Order XC2S200-6FGG728C Today

The XC2S200-6FGG728C Spartan-II FPGA represents an optimal balance of performance, flexibility, and cost for high-volume programmable logic applications. With its 200,000 system gates, comprehensive memory resources, and versatile I/O capabilities, this device addresses the needs of modern digital system designers across industrial, telecommunications, automotive, and consumer markets.

Contact us for current stock availability, competitive pricing, and volume discounts on the XC2S200-6FGG728C and other Xilinx Spartan-II family devices.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.