The XC2S200-6FGG727C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. This versatile programmable logic device delivers exceptional performance, reliability, and cost-effectiveness for demanding embedded applications. Featuring 200,000 system gates, advanced memory architecture, and industry-leading clock management, the XC2S200-6FGG727C represents a superior alternative to mask-programmed ASICs.
XC2S200-6FGG727C Key Features and Benefits
The XC2S200-6FGG727C combines robust architecture with flexible programmability, making it an excellent choice for engineers developing complex digital systems. This device offers significant advantages over traditional ASIC solutions, including lower initial costs, shorter development cycles, and field-upgradeable designs.
Spartan-II Architecture Overview
The Spartan-II architecture features a regular, flexible, programmable structure composed of multiple functional elements. The XC2S200-6FGG727C incorporates Input/Output Blocks (IOBs), Configurable Logic Blocks (CLBs), and dedicated Block RAM arranged in an efficient array configuration. Four Delay-Locked Loops (DLLs) are positioned at each corner of the die, providing advanced clock management capabilities.
High-Speed -6 Speed Grade Performance
The “-6” designation indicates the fastest commercial speed grade available for the Spartan-II family. This speed grade enables the XC2S200-6FGG727C to achieve system clock rates exceeding 200 MHz, making it suitable for high-speed digital signal processing, telecommunications equipment, and real-time control applications.
XC2S200-6FGG727C Technical Specifications
Understanding the complete technical specifications of the XC2S200-6FGG727C helps engineers make informed design decisions and maximize device utilization.
Logic Resources and Gate Count
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
XC2S200-6FGG727C Memory Configuration
The XC2S200-6FGG727C provides flexible memory options to accommodate diverse application requirements:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Total RAM Bits |
131,264 bits |
Each block RAM cell is a fully synchronous dual-ported 4,096-bit RAM with independent control signals for each port. The data widths can be configured independently, enabling efficient data buffering and storage implementations.
Electrical Characteristics
| Parameter |
Value |
| Core Voltage |
2.5V (2.375V – 2.625V) |
| Process Technology |
0.18μm CMOS |
| Operating Frequency |
Up to 263 MHz |
| Operating Temperature |
0°C to +85°C (Commercial) |
FGG727C Package Information
The “FGG727C” package designation provides essential information about the XC2S200-6FGG727C physical configuration and compatibility.
Package Breakdown
- FG: Fine-pitch Ball Grid Array (FBGA)
- G: Pb-free (Lead-free) RoHS compliant packaging
- 727: Total ball count (727 pins)
- C: Commercial temperature range (0°C to +85°C)
BGA Package Advantages
The 727-pin fine-pitch BGA package offers numerous benefits for high-density PCB designs:
- Excellent thermal performance and heat dissipation
- Superior electrical characteristics with reduced parasitic inductance
- High pin density in compact footprint
- Reliable solder joint connections
- Compatible with standard surface-mount assembly processes
XC2S200-6FGG727C I/O Standards and Features
Supported I/O Standards
The XC2S200-6FGG727C supports 16 selectable I/O standards, providing seamless integration with various system interfaces:
- LVTTL and LVCMOS (3.3V and 2.5V)
- GTL and GTL+
- HSTL (Class I, III, IV)
- SSTL2 and SSTL3 (Class I and II)
- PCI compliant interfaces
- LVDS and LVPECL differential signaling
Delay-Locked Loop (DLL) Features
Four on-chip DLLs provide advanced clock management capabilities:
- Zero propagation delay clock distribution
- Clock multiplication and division
- Phase shifting capabilities
- Board-level clock deskewing
- Low clock skew between output signals
XC2S200-6FGG727C Applications
The versatility and performance of the XC2S200-6FGG727C make it suitable for numerous industrial and commercial applications.
Telecommunications and Networking
- Network routers and switches
- Base station equipment
- Protocol conversion bridges
- Data encryption modules
Industrial Automation
- Motor control systems
- PLC expansion modules
- Machine vision interfaces
- Industrial IoT gateways
Consumer Electronics
- Video processing systems
- Audio equipment
- Gaming peripherals
- Display controllers
Automotive Systems
- ADAS sensor interfaces
- Infotainment modules
- Vehicle communication buses
- Diagnostic equipment
Development Tools and Support for XC2S200-6FGG727C
Design Software Compatibility
The XC2S200-6FGG727C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can utilize:
- VHDL and Verilog HDL support
- Schematic capture tools
- IP core integration
- Timing analysis and simulation
- In-circuit debugging with ChipScope
Configuration Options
The Spartan-II family supports multiple configuration modes:
- Master Serial mode
- Slave Serial mode
- Slave Parallel mode
- Boundary-Scan (JTAG) mode
Why Choose XC2S200-6FGG727C Over ASICs
The Xilinx FPGA technology offers compelling advantages compared to traditional mask-programmed ASICs:
Cost-Effective Development
- Eliminates expensive NRE (Non-Recurring Engineering) costs
- No minimum order quantities for prototype production
- Reduced time-to-market with parallel hardware/software development
Field Upgradeable Designs
- In-system reprogrammability enables feature updates
- Bug fixes deployed without hardware recalls
- Design optimization post-deployment
Risk Mitigation
- Prototype validation before volume production
- Design changes without mask revisions
- Proven silicon eliminates fabrication risk
XC2S200-6FGG727C Ordering Information
When ordering the XC2S200-6FGG727C, the part number structure indicates:
| Code |
Meaning |
| XC2S200 |
Spartan-II, 200K system gates |
| -6 |
Fastest speed grade (Commercial only) |
| FGG |
Fine-pitch BGA, Pb-free |
| 727 |
727-ball package |
| C |
Commercial temperature (0°C to +85°C) |
Summary
The XC2S200-6FGG727C delivers an exceptional combination of high performance, flexible architecture, and cost-effectiveness for programmable logic applications. With 200,000 system gates, 5,292 logic cells, 56KB block RAM, and 727-pin BGA packaging, this Spartan-II FPGA provides the resources needed for sophisticated digital designs. The fastest -6 speed grade ensures maximum performance, while Pb-free packaging meets modern environmental standards.
For engineers seeking a reliable, high-performance programmable logic solution, the XC2S200-6FGG727C offers proven Xilinx quality backed by comprehensive development tools and worldwide technical support.
