Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG726C: High-Performance Xilinx Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG726C is a premier field-programmable gate array (FPGA) from the renowned Xilinx Spartan-II family. This powerful programmable logic device delivers exceptional performance, extensive I/O capabilities, and cost-effective implementation for demanding embedded system designs. Engineers seeking reliable digital signal processing and control solutions will find the XC2S200-6FGG726C an ideal component for high-volume applications.

Key Features of the XC2S200-6FGG726C Spartan-II FPGA

The XC2S200-6FGG726C combines advanced semiconductor technology with a flexible architecture to achieve outstanding system performance. This Xilinx FPGA offers designers a superior alternative to mask-programmed ASICs while avoiding initial costs, lengthy development cycles, and inherent risks of conventional application-specific integrated circuits.

Advanced Logic Resources and System Gates

The XC2S200-6FGG726C provides substantial programmable logic resources suitable for complex digital designs:

Specification Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Maximum User I/O 284

Distributed and Block RAM Memory

Memory resources in the XC2S200-6FGG726C support both distributed and block RAM configurations:

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Block RAM Configuration Dual-port/Single-port synchronous

XC2S200-6FGG726C Technical Specifications

Core Voltage and Power Requirements

The XC2S200-6FGG726C operates with efficient power management suitable for industrial applications:

Parameter Specification
Core Voltage (VCCINT) 2.5V
I/O Voltage (VCCO) 1.5V, 2.5V, or 3.3V
Process Technology 0.18µm
Maximum System Frequency Up to 200 MHz

Package Information

Package Detail Specification
Package Type Fine Pitch Ball Grid Array (FGG)
Pin Count 726
Speed Grade -6 (Commercial)
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Pb-free (Lead-free)

Spartan-II FPGA Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG726C architecture features a regular, programmable array of Configurable Logic Blocks surrounded by programmable Input/Output Blocks (IOBs). Each CLB contains four Logic Cells (LCs) organized in two slices, providing flexible implementation of custom digital circuits.

CLB Key Characteristics

  • Four-input look-up tables (LUTs) per Logic Cell
  • D-type flip-flops configurable as edge-triggered or level-sensitive latches
  • Fast carry logic for arithmetic operations
  • Programmable set and reset on all flip-flops
  • Direct feedthrough paths for additional routing flexibility

Input/Output Block (IOB) Features

The IOB architecture of the XC2S200-6FGG726C supports multiple I/O signaling standards essential for modern interface designs:

Supported I/O Standards

Standard Category Supported Protocols
LVTTL/LVCMOS LVTTL, LVCMOS2, LVCMOS18, LVCMOS15
High-Speed GTL, GTL+, HSTL (Class I, II, III, IV)
Differential SSTL2 (Class I, II), SSTL3 (Class I, II)
Bus Interface PCI 3.3V (5V tolerant)

Delay-Locked Loop (DLL) Technology

The XC2S200-6FGG726C incorporates four fully digital Delay-Locked Loops positioned at each corner of the die, providing advanced clock management capabilities:

  • Zero propagation delay clock distribution
  • Low clock skew between output clock signals
  • Clock multiplication and division (1.5x, 2x, 2.5x, 3x, 4x, 5x, 8x, 16x)
  • Four quadrature phase outputs
  • Board-level clock deskewing via clock mirror functionality

Applications for the XC2S200-6FGG726C FPGA

Industrial Control Systems

The XC2S200-6FGG726C excels in industrial automation applications requiring real-time processing and reliable operation. Its extensive I/O count and flexible logic resources make it ideal for motor control, process automation, and programmable logic controller (PLC) implementations.

Digital Signal Processing

With 200,000 system gates and dedicated block RAM, the XC2S200-6FGG726C handles demanding DSP algorithms including filtering, signal conditioning, and data acquisition systems. The fast carry logic enables efficient implementation of arithmetic-intensive operations.

Communications Equipment

The XC2S200-6FGG726C supports various communication protocols and interface standards, making it suitable for networking equipment, protocol converters, and telecommunications infrastructure applications.

Embedded Systems

Designers utilize the XC2S200-6FGG726C for embedded computing platforms requiring custom peripheral interfaces, hardware acceleration, and reconfigurable logic capabilities.

Development Tools and Software Support

Xilinx ISE Design Suite Compatibility

The XC2S200-6FGG726C is fully supported by the Xilinx ISE development environment, providing:

  • Fully automatic mapping, placement, and routing
  • Integrated simulation and timing analysis
  • Hardware debugging capabilities
  • IP core integration support

Configuration Options

Multiple configuration modes ensure flexible system integration:

Mode Description
Master Serial FPGA generates CCLK, reads from serial PROM
Slave Serial External controller provides CCLK and data
Slave Parallel 8-bit parallel data interface
Boundary Scan JTAG-based configuration

Why Choose the XC2S200-6FGG726C for Your Design

Cost-Effective ASIC Alternative

The XC2S200-6FGG726C eliminates non-recurring engineering (NRE) costs associated with ASIC development while providing comparable performance for high-volume applications. Field programmability enables design upgrades without hardware replacement.

Reliable Performance

Built on proven 0.18µm process technology, the XC2S200-6FGG726C delivers consistent performance with system clock rates up to 200 MHz. Fast, predictable interconnect ensures successive design iterations continue meeting timing requirements.

Comprehensive I/O Flexibility

Supporting 16 different I/O standards with 284 maximum user I/O pins, the XC2S200-6FGG726C interfaces seamlessly with diverse system components including memories, processors, and communication peripherals.

Ordering Information

Part Number Description
XC2S200-6FGG726C Spartan-II FPGA, 200K System Gates, -6 Speed Grade, 726-Pin FGG Package, Commercial Temperature, Pb-free

The “G” designation in the part number indicates RoHS-compliant Pb-free (lead-free) packaging, meeting environmental regulatory requirements for electronic components.

Technical Documentation and Resources

Engineers working with the XC2S200-6FGG726C can access comprehensive technical documentation including:

  • Complete datasheet (DS001) with electrical specifications
  • Pinout tables and package drawings
  • Application notes for design implementation
  • Configuration and programming guides
  • Development board schematics and reference designs

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.