The XC2S200-6FGG723C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Xilinx FPGA Spartan-II family. Designed for demanding industrial, commercial, and embedded applications, this 200K system gate FPGA delivers exceptional performance with its -6 speed grade rating—the fastest available in the Spartan-II lineup.

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XC2S200-6FGG723C Key Features and Benefits

The XC2S200-6FGG723C FPGA offers engineers and designers a powerful combination of logic resources, memory capabilities, and I/O flexibility. This device serves as a superior alternative to mask-programmed ASICs, eliminating initial costs, lengthy development cycles, and the inherent risks associated with conventional ASIC designs.

Why Choose the XC2S200-6FGG723C FPGA

The programmability of the XC2S200-6FGG723C permits design upgrades in the field with no hardware replacement necessary—a capability impossible with traditional ASICs. Engineers benefit from fast, predictable interconnect architecture that ensures successive design iterations continue to meet timing requirements.

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XC2S200-6FGG723C Technical Specifications

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XC2S200-6FGG723C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG723C features 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB contains four logic cells (LCs), with each logic cell comprising a 4-input function generator, storage element, and carry logic. This architecture provides four direct feedthrough paths per CLB, offering extra data input lines or additional local routing without consuming logic resources.

Block RAM Memory Architecture

The XC2S200-6FGG723C incorporates 14 dedicated Block RAM blocks totaling 56 Kbits of on-chip memory. Each block RAM cell is a fully synchronous dual-ported 4096-bit RAM with independent control signals for each port. The data widths of the two ports can be configured independently, providing built-in width conversion capabilities.

Block RAM Port Aspect Ratios:

Distributed RAM Resources

In addition to Block RAM, the XC2S200-6FGG723C provides 75,264 bits of distributed RAM implemented within the CLB lookup tables (LUTs). This distributed memory complements the Block RAM, enabling designers to implement shallow memory structures efficiently throughout the device.

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XC2S200-6FGG723C Clock Management

Four Delay-Locked Loops (DLLs)

The XC2S200-6FGG723C features four Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide essential clock management functions including clock de-skewing across the device and board-level clock distribution. The DLL can operate as a clock mirror—by driving the output from a DLL off-chip and back on again, the DLL can deskew a board-level clock among multiple Spartan-II FPGAs.

Global Clock Distribution Network

Four primary global clock nets and four secondary global networks ensure reliable clock distribution throughout the XC2S200-6FGG723C. The primary global nets may only be driven by global buffers, providing low-skew, high-fanout clock distribution essential for high-performance synchronous designs.

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XC2S200-6FGG723C I/O Capabilities

Flexible I/O Standards Support

The XC2S200-6FGG723C supports 16 selectable I/O standards, enabling direct interface with various memory types, bus architectures, and peripheral devices. Each Input/Output Block (IOB) contains three registers that can function as D-type edge-triggered flip-flops or level-sensitive latches, with dedicated clock enable signals for each register.

I/O Banking Architecture

The device I/O pins are organized into banks, allowing different voltage standards to be used simultaneously on the same device. This banking structure provides flexibility when interfacing with multiple voltage domains in complex system designs.

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XC2S200-6FGG723C Configuration Options

The XC2S200-6FGG723C supports multiple configuration modes for maximum design flexibility:

The device requires approximately 1,335,840 configuration bits for complete programming. JTAG Boundary-Scan support (IEEE 1149.1 compliant) enables both configuration and in-system debugging capabilities.

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XC2S200-6FGG723C Speed Grade Advantages

The -6 speed grade designation indicates the XC2S200-6FGG723C operates at the highest performance level within the Spartan-II family. This speed grade is exclusively available in the Commercial temperature range (0°C to +85°C), offering system frequencies up to 200 MHz and beyond for demanding applications.

Performance Optimization

The Spartan-II routing architecture and place-and-route software were jointly optimized to minimize long-path delays, yielding the best system performance. This joint optimization also reduces design compilation times because the architecture is inherently software-friendly, correspondingly reducing design iteration times.

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XC2S200-6FGG723C Package Information

FBGA Package Details

The FGG (Fine-pitch Ball Grid Array, Pb-Free) package provides excellent thermal and electrical performance characteristics. The Pb-free designation (indicated by the “G” in the package code) ensures full RoHS compliance for environmentally conscious designs.

Part Number Breakdown

XC2S200-6FGG723C decodes as follows:

• XC2S200: Spartan-II device, 200K system gates
• -6: Speed grade (fastest performance)
• FGG: Fine-pitch Ball Grid Array, Pb-Free
• 723: Pin count
• C: Commercial temperature range (0°C to +85°C)

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XC2S200-6FGG723C Application Areas

The XC2S200-6FGG723C FPGA excels in numerous applications including:

• Industrial automation and control systems
• Digital signal processing (DSP) implementations
• Telecommunications equipment
• Medical instrumentation
• Video and image processing
• Embedded computing platforms
• Test and measurement equipment
• Aerospace and defense systems
• Consumer electronics prototyping
• High-volume production applications

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XC2S200-6FGG723C Development Tools Support

ISE Design Suite Compatibility

The XC2S200-6FGG723C is fully supported by Xilinx ISE Design Suite, providing comprehensive synthesis, implementation, and verification capabilities. The development environment includes:

• HDL synthesis (Verilog, VHDL)
• Floor planning and placement tools
• Timing analysis and optimization
• Simulation and verification
• ChipScope Pro in-system debugging

Configuration Solutions

Multiple configuration options are available including Platform Flash PROMs, serial configuration PROMs, and third-party flash memory solutions. The device supports daisy-chain configuration for multi-FPGA systems.

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XC2S200-6FGG723C Ordering Information

When ordering the XC2S200-6FGG723C, verify the following specifications meet your design requirements:

• Part Number: XC2S200-6FGG723C
• Family: Spartan-II
• Package: FGG (Pb-Free FBGA)
• Speed: -6 (Commercial grade only)
• Temperature: Commercial (0°C to +85°C)

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Conclusion: XC2S200-6FGG723C FPGA Summary

The XC2S200-6FGG723C represents a proven, cost-effective solution for engineers requiring reliable, high-performance FPGA capabilities. With 200,000 system gates, 56K of Block RAM, 75,264 bits of distributed RAM, and the fastest -6 speed grade, this Spartan-II FPGA delivers exceptional value for industrial, commercial, and embedded applications. The Pb-free FGG package ensures RoHS compliance while the comprehensive development tool support simplifies the design process from concept to production.

For additional technical documentation, application notes, and design resources, consult the official Spartan-II FPGA Family Data Sheet (DS001).