The XC2S200-6FGG722C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family. This advanced programmable logic device delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it an ideal solution for complex digital design implementations. Engineers seeking reliable, cost-effective FPGA solutions will find the XC2S200-6FGG722C perfectly suited for demanding industrial, telecommunications, and embedded system applications.
XC2S200-6FGG722C Technical Specifications Overview
The XC2S200-6FGG722C combines cutting-edge programmable logic architecture with robust performance characteristics. Built on proven 0.18μm CMOS process technology, this Xilinx FPGA delivers the perfect balance of speed, power efficiency, and design flexibility that modern electronic systems demand.
Core Logic Architecture
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
Performance and Electrical Characteristics
| Parameter |
Specification |
| Speed Grade |
-6 (Highest Performance) |
| Maximum Frequency |
263 MHz |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Process Technology |
0.18μm CMOS |
| Temperature Range |
Commercial (0°C to +85°C) |
Package Information
| Attribute |
Detail |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| Package Code |
FGG722 |
| Total Pins |
722 |
| RoHS Compliance |
Yes (Pb-Free) |
| Moisture Sensitivity Level |
MSL-3 |
Key Features of XC2S200-6FGG722C Spartan-II FPGA
Advanced Configurable Logic Blocks (CLBs)
The XC2S200-6FGG722C features 1,176 Configurable Logic Blocks arranged in a 28×42 matrix. Each CLB contains four logic cells with independent carry logic, enabling efficient implementation of arithmetic functions, counters, and complex combinational logic circuits.
Flexible Input/Output Blocks (IOBs)
With up to 284 user-configurable I/O pins, this Spartan-II FPGA supports multiple I/O standards including LVTTL, LVCMOS, PCI, and GTL+. The programmable IOBs feature adjustable slew rate control and selectable pull-up/pull-down resistors for optimal signal integrity.
Dual-Port Block RAM Memory
The XC2S200-6FGG722C incorporates 56 Kbits of dedicated block RAM organized in synchronous dual-port memory blocks. Each 4,096-bit RAM block operates independently with separate read/write ports, ideal for FIFO buffers, lookup tables, and data storage applications.
Four Delay-Locked Loops (DLLs)
Integrated DLL circuits at each corner of the die provide precise clock management capabilities. These DLLs eliminate clock distribution delays, enable clock multiplication/division, and support board-level clock deskewing for multi-FPGA systems.
Distributed RAM Architecture
Beyond block RAM, the XC2S200-6FGG722C offers 75,264 bits of distributed RAM within the CLB fabric. This distributed memory provides single-cycle access for implementing shift registers, small FIFOs, and local data storage with minimal routing overhead.
XC2S200-6FGG722C Applications and Use Cases
Telecommunications Equipment
The high gate count and fast processing speed make the XC2S200-6FGG722C excellent for implementing protocol converters, channel encoders/decoders, and baseband signal processing units in networking and telecom infrastructure.
Industrial Automation Systems
Motor control algorithms, PLC co-processors, and sensor interface modules benefit from the XC2S200-6FGG722C’s abundant I/O resources and deterministic timing characteristics essential for real-time control applications.
Digital Signal Processing (DSP)
The combination of 5,292 logic cells and 56K block RAM enables efficient implementation of FIR/IIR filters, FFT engines, and custom DSP algorithms requiring parallel processing architectures.
Embedded Computing Platforms
System-on-chip designs incorporating soft processor cores, peripheral controllers, and custom accelerators leverage the XC2S200-6FGG722C’s flexible architecture for application-specific embedded solutions.
Prototyping and Development
ASIC prototyping teams utilize the XC2S200-6FGG722C to validate complex digital designs before committing to expensive mask-programmed silicon, reducing development risk and time-to-market.
Why Choose the XC2S200-6FGG722C Over Mask-Programmed ASICs?
The Spartan-II XC2S200-6FGG722C offers significant advantages compared to traditional ASIC development:
Reduced Development Costs
Eliminates expensive mask charges and NRE (non-recurring engineering) fees associated with custom ASIC fabrication. Design iterations require only new configuration files rather than physical mask revisions.
Faster Time-to-Market
FPGA-based designs can progress from concept to working hardware in weeks rather than the months required for ASIC tape-out, fabrication, and packaging cycles.
Field Upgradability
Unlike fixed-function ASICs, the XC2S200-6FGG722C supports in-system reprogramming, allowing feature updates, bug fixes, and performance optimizations after product deployment without hardware changes.
Design Flexibility
Reconfigurable logic enables rapid architectural exploration and algorithm optimization during development, with the freedom to modify functionality even in production systems.
XC2S200-6FGG722C Part Number Decoder
Understanding the part number structure helps ensure correct component selection:
| Code Segment |
Meaning |
| XC2S |
Xilinx Spartan-II Family |
| 200 |
200K System Gate Density |
| -6 |
Speed Grade (Fastest) |
| FGG |
Fine-Pitch BGA, Pb-Free |
| 722 |
Total Package Pin Count |
| C |
Commercial Temperature Range |
Design Resources and Development Tools
Supported Software
The XC2S200-6FGG722C is fully supported by Xilinx ISE Design Suite (version 14.7 and earlier), providing comprehensive synthesis, implementation, and verification tools for FPGA development.
Configuration Options
Multiple configuration modes ensure flexible system integration including Master Serial, Slave Serial, Master SelectMAP, Slave SelectMAP, and JTAG Boundary Scan programming interfaces.
Documentation Available
Engineers can access complete technical documentation including the Spartan-II Data Sheet (DS001), package drawings, PCB footprint specifications, and application notes through official AMD/Xilinx documentation portals.
Ordering Information for XC2S200-6FGG722C
When sourcing the XC2S200-6FGG722C, verify the following specifications match your project requirements:
- Full part number includes speed grade (-6), package type (FGG722), and temperature grade (C)
- Confirm Pb-free/RoHS compliance requirements for your application
- Check moisture sensitivity handling and storage specifications
- Verify supply chain authenticity when purchasing from distribution
Summary: XC2S200-6FGG722C Spartan-II FPGA
The XC2S200-6FGG722C represents a proven, reliable solution for engineers requiring high-performance programmable logic in a feature-rich package. With 200,000 system gates, 284 user I/Os, 56K block RAM, and integrated DLLs, this Spartan-II FPGA delivers the processing power and design flexibility needed for telecommunications, industrial, DSP, and embedded computing applications. The combination of mature silicon, comprehensive tool support, and excellent cost-performance ratio makes the XC2S200-6FGG722C an outstanding choice for both new designs and legacy system upgrades.
