The XC2S200-6FGG719C is a versatile Field Programmable Gate Array (FPGA) from AMD Xilinx’s acclaimed Spartan-II family. This programmable logic device delivers exceptional performance with 200,000 system gates, making it an ideal solution for telecommunications, industrial automation, and embedded systems applications. Engineers worldwide trust this reliable FPGA for cost-effective digital design implementations.
XC2S200-6FGG719C Overview and Key Features
The XC2S200-6FGG719C belongs to the Spartan-II series, which represents a superior alternative to mask-programmed ASICs. This FPGA eliminates lengthy development cycles and reduces initial costs while offering field-upgradable programmability. Consequently, design modifications can be implemented without hardware replacement.
Core Specifications at a Glance
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm CMOS |
| Speed Grade |
-6 (Commercial) |
| Package Type |
FGG (Pb-Free Fine-Pitch BGA) |
Technical Architecture of the XC2S200-6FGG719C
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG719C features a regular and flexible programmable architecture. At its core, the device contains 1,176 Configurable Logic Blocks arranged in a 28 × 42 matrix. Each CLB includes four logic cells with 4-input function generators, storage elements, and dedicated carry logic. Additionally, every CLB provides four direct feedthrough paths for enhanced routing flexibility.
Input/Output Block Architecture
Surrounding the CLB array is a perimeter of programmable Input/Output Blocks (IOBs). These IOBs support 16 different I/O signaling standards, including LVTTL, LVCMOS, PCI, GTL, HSTL, SSTL, and LVDS interfaces. Furthermore, the three registers within each IOB can function as either D-type edge-triggered flip-flops or level-sensitive latches.
Block RAM Memory Resources
The XC2S200-6FGG719C integrates 56 Kbits of dedicated block RAM organized in columns along each vertical edge. Each 4,096-bit memory block operates as a fully synchronous dual-ported RAM with independent control signals for each port. Moreover, the data widths can be configured independently, providing built-in width conversion capabilities.
Delay-Locked Loop (DLL) Technology
Four Delay-Locked Loops occupy each corner of the die, enabling precise clock management. The DLLs can eliminate clock distribution delays and multiply or divide incoming clock frequencies. As a result, the XC2S200-6FGG719C achieves optimal timing performance for high-speed digital applications.
XC2S200-6FGG719C Package Information
FGG719 Pb-Free Fine-Pitch Ball Grid Array
The XC2S200-6FGG719C utilizes an RoHS-compliant Pb-free Fine-Pitch Ball Grid Array (FGG) package. The “G” designation indicates lead-free solder ball composition, meeting modern environmental regulations. This package type offers excellent thermal performance and superior signal integrity characteristics.
Package Characteristics
| Feature |
Value |
| Pin Count |
719 |
| Package Type |
Fine-Pitch BGA |
| Ball Pitch |
1.0 mm |
| RoHS Compliance |
Yes (Pb-Free) |
| Moisture Sensitivity |
MSL-3 |
Speed Grade and Performance
-6 Speed Grade Specifications
The “-6” speed designation indicates this device operates in the commercial temperature range (0°C to +85°C). This speed grade delivers reliable performance for standard industrial and commercial applications. The XC2S200-6FGG719C supports clock frequencies exceeding 200 MHz for demanding digital designs.
Routing Architecture Performance
The Spartan-II routing architecture includes a powerful hierarchy of versatile routing channels. Long lines span the full height or width of the device, while hex lines provide intermediate routing resources. Consequently, the XC2S200-6FGG719C maintains predictable timing characteristics across successive design iterations.
Applications for the XC2S200-6FGG719C
Telecommunications Equipment
The XC2S200-6FGG719C excels in telecommunications infrastructure, including base station controllers, network switches, and protocol conversion equipment. The abundant logic resources and multiple I/O standards enable seamless integration with various communication protocols.
Industrial Automation Systems
Manufacturing and process control systems benefit from the FPGA’s real-time processing capabilities. The XC2S200-6FGG719C handles motor control algorithms, sensor interface processing, and industrial network communications efficiently.
Embedded Computing Platforms
Developers choose this Xilinx FPGA for embedded applications requiring custom peripheral interfaces and hardware acceleration. The device’s reprogrammability allows firmware updates throughout the product lifecycle.
Video and Image Processing
With substantial block RAM resources and parallel processing capability, the XC2S200-6FGG719C supports video frame buffering, image filtering, and display controller implementations.
Configuration Methods for XC2S200-6FGG719C
Supported Configuration Modes
The XC2S200-6FGG719C supports multiple configuration options for design flexibility.
| Mode |
Data Width |
CCLK Direction |
| Master Serial |
1-bit |
Output |
| Slave Serial |
1-bit |
Input |
| Slave Parallel |
8-bit |
Input |
| Boundary-Scan (JTAG) |
1-bit |
N/A |
Configuration Data Requirements
The XC2S200 requires approximately 1,335,840 configuration bits. After power-on, all I/O pins remain in high-impedance state until configuration completes. The Boundary-Scan interface enables in-system programming and device testing.
Development Tools and Software Support
Xilinx ISE Design Suite
The XC2S200-6FGG719C is fully supported by Xilinx ISE Design Suite for synthesis, implementation, and timing analysis. This comprehensive toolchain includes simulation capabilities and programming utilities.
Third-Party EDA Tool Compatibility
Major electronic design automation vendors provide synthesis and verification support for Spartan-II devices. Consequently, engineers can integrate the XC2S200-6FGG719C into existing design workflows seamlessly.
Ordering Information
Part Number Breakdown
| Segment |
Meaning |
| XC2S200 |
Spartan-II 200K Gate Device |
| -6 |
Speed Grade (Commercial) |
| FGG |
Pb-Free Fine-Pitch BGA |
| 719 |
Pin Count |
| C |
Commercial Temperature Range |
Quality and Reliability
AMD Xilinx manufactures the XC2S200-6FGG719C following stringent quality standards. The device undergoes comprehensive testing to ensure reliable operation in commercial environments. Standard packaging includes ESD-safe containers suitable for automated assembly processes.
Why Choose the XC2S200-6FGG719C?
Cost-Effective Programmable Logic
The Spartan-II family delivers more system gates, I/O capabilities, and features per dollar than competing solutions. Therefore, the XC2S200-6FGG719C provides exceptional value for high-volume production applications.
Proven Architecture
Built on the foundation of Xilinx’s higher-end Virtex series, the Spartan-II architecture offers proven reliability. The XC2S200-6FGG719C inherits advanced features while maintaining cost-effectiveness.
Future-Proof Design
Field programmability enables design updates without hardware changes. As application requirements evolve, the XC2S200-6FGG719C can adapt through firmware modifications, extending product lifecycles significantly.
Technical Documentation and Resources
Engineers can access comprehensive documentation through AMD’s technical information portal:
- Complete datasheet with DC and AC specifications
- User guides covering implementation best practices
- Application notes for specific design challenges
- Package drawings and thermal characteristics
- PCB layout recommendations
Conclusion
The XC2S200-6FGG719C represents an excellent choice for engineers seeking a balance of performance, flexibility, and cost-effectiveness. With 200,000 system gates, 56 Kbits of block RAM, and support for 16 I/O standards, this Spartan-II FPGA addresses diverse application requirements. The Pb-free FGG719 package ensures environmental compliance while delivering robust mechanical and thermal characteristics. Whether developing telecommunications equipment, industrial controllers, or embedded computing platforms, the XC2S200-6FGG719C provides the programmable logic foundation for successful product development.
