The XC2S200-6FGG717C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. This versatile programmable logic device delivers exceptional performance, making it an ideal solution for digital signal processing, industrial automation, telecommunications equipment, and embedded system applications. With its superior alternative to mask-programmed ASICs, the XC2S200-6FGG717C offers unlimited reprogrammability, faster time-to-market, and significant cost savings for high-volume production.

XC2S200-6FGG717C Key Features and Benefits

The XC2S200-6FGG717C combines advanced programmable logic capabilities with robust architectural features, providing engineers with a powerful platform for implementing complex digital designs.

High-Density Logic Resources

The XC2S200-6FGG717C features an impressive array of configurable logic elements:

• 200,000 System Gates: Provides ample resources for complex digital designs
• 5,292 Logic Cells: Each logic cell contains a 4-input look-up table (LUT) and storage element
• 1,176 Configurable Logic Blocks (CLBs): Organized in a 28 x 42 array architecture
• 284 Maximum User I/O Pins: Supporting extensive connectivity options
• Four Delay-Locked Loops (DLLs): For advanced clock management and zero-delay clock distribution

XC2S200-6FGG717C Flexible Memory Architecture

The SelectRAM hierarchical memory system in the XC2S200-6FGG717C provides versatile on-chip memory solutions:

• 56 Kilobits Block RAM: Fourteen dual-port 4,096-bit RAM blocks with independent control signals
• 75,264 Bits Distributed RAM: Implemented using 16-bit LUT-based RAM
• Configurable Data Widths: Block RAM supports 1, 2, 4, 8, and 16-bit configurations
• Dual-Port Capability: Enables simultaneous read and write operations with independent clocks

XC2S200-6FGG717C Technical Specifications

XC2S200-6FGG717C I/O Standards Support

The XC2S200-6FGG717C supports sixteen high-performance interface standards, enabling seamless integration with various system architectures:

Supported I/O Standards

XC2S200-6FGG717C Architecture Overview

Configurable Logic Block (CLB) Structure

Each XC2S200-6FGG717C CLB contains four logic cells organized in two identical slices. The CLB architecture includes:

• 4-Input Look-Up Tables (LUTs): Function generators capable of implementing any 4-input Boolean function
• Storage Elements: Edge-triggered D-type flip-flops or level-sensitive latches with enable, set, and reset
• Dedicated Carry Logic: High-speed arithmetic operations with two carry chains per CLB
• F5/F6 Multiplexers: Enable implementation of 5 or 6-input functions
• BUFT Elements: Two 3-state drivers per CLB for on-chip bus implementation

Input/Output Block (IOB) Features

The XC2S200-6FGG717C IOBs provide flexible interface capabilities:

• Three Registers per IOB: Input, output, and 3-state control flip-flops
• Programmable Output Drive: Up to 24 mA source and 48 mA sink capability
• Slew Rate Control: Minimizes bus transients
• Optional Pull-up/Pull-down Resistors: Configurable weak keeper circuits
• 5V Tolerance: Compatible with legacy systems (for selected standards)

XC2S200-6FGG717C Clock Management

Delay-Locked Loop (DLL) Capabilities

The four DLLs in the XC2S200-6FGG717C provide advanced clock management features:

• Zero-Delay Clock Distribution: Eliminates on-chip clock propagation delay
• Clock Multiplication: 2× clock frequency doubling capability
• Clock Division: Divide by 1.5, 2, 2.5, 3, 4, 5, 8, or 16
• Quadrature Phase Outputs: CLK0, CLK90, CLK180, CLK270 phases
• Board-Level Clock Deskewing: Clock mirror functionality for multi-device synchronization
• System Clock Rates: Support up to 200 MHz operation

Global Clock Distribution

• Four Primary Global Nets: Dedicated low-skew clock distribution
• Four Global Clock Buffers: One for each global network
• 24 Secondary Backbone Lines: Additional routing for high-fanout signals

XC2S200-6FGG717C Configuration Options

The XC2S200-6FGG717C supports multiple configuration modes for flexible system implementation:

Configuration Specifications

• Configuration File Size: 1,335,840 bits
• Maximum CCLK Frequency: 66 MHz
• IEEE 1149.1 Boundary-Scan: Full JTAG support with EXTEST, SAMPLE/PRELOAD, and BYPASS instructions
• In-System Reprogrammability: Unlimited configuration cycles

XC2S200-6FGG717C Applications

The XC2S200-6FGG717C is ideally suited for a wide range of applications:

Industrial and Automation

• Programmable Logic Controllers (PLCs)
• Motor control systems
• Industrial networking equipment
• Factory automation interfaces

Telecommunications

• Protocol converters
• Channel interface cards
• Data multiplexing equipment
• Network bridge implementations

Consumer Electronics

• Digital set-top boxes
• Video processing systems
• Audio/video encoding and decoding
• Display controllers

Embedded Systems

• System-on-chip prototyping
• ASIC replacement and emulation
• Custom peripheral interfaces
• Rapid product development platforms

XC2S200-6FGG717C Ordering Information

Part Number Breakdown

XC2S200 - 6 F GG 717 C
   │      │ │  │  │   └── Temperature Range: C = Commercial (0°C to +85°C)
   │      │ │  │  └────── Pin Count: 717 pins
   │      │ │  └───────── Package Material: GG = Pb-free (RoHS Compliant)
   │      │ └──────────── Package Type: F = Fine-pitch BGA
   │      └────────────── Speed Grade: -6 (Higher Performance)
   └───────────────────── Device: Spartan-II 200K system gates

Available Speed Grades

XC2S200-6FGG717C Development Support

Design Tools Compatibility

The XC2S200-6FGG717C is fully supported by the Xilinx ISE Design Suite, providing:

• HDL Synthesis: VHDL and Verilog support
• Schematic Entry: Graphical design capture
• Timing-Driven Place and Route: Automated implementation optimization
• Static Timing Analysis: Comprehensive timing verification
• In-Circuit Debugging: Real-time design verification capabilities
• EDIF Interface: Industry-standard file format support

Documentation Resources

• Spartan-II Family Data Sheet (DS001)
• Application Notes for configuration and implementation
• Reference designs and IP cores
• Pinout tables and package specifications

Why Choose XC2S200-6FGG717C

The XC2S200-6FGG717C offers significant advantages over traditional ASIC implementations:

1. Eliminates NRE Costs: No expensive mask tooling required
2. Shortened Development Cycles: Rapid prototyping and iteration
3. Field Upgradability: In-system reprogramming without hardware changes
4. Risk Mitigation: Design changes possible after production
5. Proven Technology: Mature 0.18 µm process with excellent reliability
6. RoHS Compliance: Pb-free packaging meets environmental regulations

Where to Buy XC2S200-6FGG717C

For purchasing the XC2S200-6FGG717C and exploring additional Spartan-II family devices, visit authorized distributors or contact Xilinx FPGA suppliers for competitive pricing and availability information.

Related Products

Engineers working with the XC2S200-6FGG717C may also consider these Spartan-II family alternatives:

The XC2S200-6FGG717C represents the pinnacle of the Spartan-II FPGA family, delivering the highest gate density and maximum I/O capability in a reliable, Pb-free package for demanding commercial applications.