Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG713C: High-Performance Spartan-II FPGA for Industrial and Commercial Applications

Product Details

The XC2S200-6FGG713C is a versatile Field Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family, engineered to deliver exceptional performance and reliability for demanding digital design applications. This RoHS-compliant, Pb-free device combines 200,000 system gates with advanced programmable logic capabilities, making it an ideal solution for engineers seeking cost-effective, high-density programmable logic in telecommunications, industrial automation, and embedded systems.


XC2S200-6FGG713C Key Features and Benefits

The XC2S200-6FGG713C stands out as a superior alternative to traditional mask-programmed ASICs. This programmable device eliminates initial tooling costs, reduces development cycles, and offers unlimited reprogrammability for field upgrades without hardware replacement.

Core Architecture Specifications

The XC2S200-6FGG713C is built on Xilinx’s proven Spartan-II architecture, featuring a regular and flexible programmable structure of Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs).

Specification Value
Logic Cells 5,292
System Gates 200,000
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56 Kbits
DLLs (Delay-Locked Loops) 4

Speed Grade and Operating Conditions

The -6 speed grade designation indicates this XC2S200-6FGG713C operates at the highest performance tier within the Spartan-II family, delivering maximum clock frequencies up to 263 MHz. This speed grade is exclusively available in the Commercial temperature range (0°C to +85°C), ensuring reliable operation across typical industrial environments.


XC2S200-6FGG713C Technical Specifications

Memory Resources

The XC2S200-6FGG713C provides a hierarchical SelectRAM memory architecture that enables flexible on-chip storage solutions:

  • Distributed RAM: 75,264 bits organized as 16 bits per Look-Up Table (LUT), perfect for small, fast memory buffers
  • Dedicated Block RAM: 56 Kbits configured as seven 4,096-bit blocks, ideal for larger data buffers, FIFOs, and dual-port memory applications
  • Fast interfaces to external RAM support high-bandwidth memory expansion

Advanced Clock Management

Four dedicated Delay-Locked Loops (DLLs) positioned at each corner of the die provide advanced clock control capabilities:

  • Clock deskew and phase shifting
  • Clock multiplication and division
  • Four primary low-skew global clock distribution networks
  • Zero hold time simplifies system timing design

Versatile I/O Standards Support

The XC2S200-6FGG713C supports 16 high-performance interface standards, enabling seamless integration with diverse system components:

  • Core Logic: Powered at 2.5V for optimal performance
  • I/O Banks: Configurable for 1.5V, 2.5V, or 3.3V operation
  • Full PCI compliance for standard bus interfaces
  • Hot-swap Compact PCI friendly design

XC2S200-6FGG713C Package Information

FGG713 Fine-Pitch Ball Grid Array Package

The “FGG” designation indicates this device uses a Fine-pitch Ball Grid Array (FBGA) package with Pb-free (RoHS compliant) solder balls. The 713-ball configuration provides:

  • High pin density for complex routing requirements
  • Excellent thermal dissipation characteristics
  • Reliable BGA interconnection technology
  • Compact footprint for space-constrained PCB designs

Part Number Breakdown

Understanding the XC2S200-6FGG713C ordering code:

Code Element Meaning
XC2S Xilinx Spartan-II Family
200 200,000 System Gates
-6 Speed Grade (Highest Performance)
FG Fine-pitch BGA Package
G Pb-Free (RoHS Compliant)
713 Number of Package Balls
C Commercial Temperature (0°C to +85°C)

XC2S200-6FGG713C Application Areas

The XC2S200-6FGG713C excels in high-volume applications where programmable flexibility provides significant advantages over fixed-function devices.

Telecommunications and Networking

The high gate density and fast signal processing capabilities make this Xilinx FPGA ideal for:

  • Network routers and switches
  • Protocol conversion bridges
  • Base station controllers
  • SDH/SONET interfaces

Industrial Automation and Control

The robust commercial temperature rating and reliable operation support:

  • Motor control systems
  • Process automation equipment
  • Industrial IoT gateways
  • Machine vision preprocessing

Embedded Systems Development

The cost-effective reprogrammability benefits:

  • Rapid prototyping platforms
  • Software-defined hardware implementations
  • Custom peripheral controllers
  • Legacy system upgrades

XC2S200-6FGG713C Design Support and Development Tools

Xilinx ISE Design Suite

The XC2S200-6FGG713C is fully supported by Xilinx ISE development software, providing:

  • Fully automatic mapping, placement, and routing
  • Comprehensive synthesis and implementation tools
  • Built-in simulation and timing analysis
  • VHDL and Verilog HDL support

Configuration Options

Multiple configuration modes accommodate diverse system architectures:

Configuration Mode Data Width CCLK Direction
Master Serial 1-bit Output
Slave Serial 1-bit Input
Slave Parallel 8-bit Input
Boundary-Scan (JTAG) 1-bit N/A

IEEE 1149.1 Boundary Scan

Full JTAG compliance enables:

  • In-system programming and configuration
  • Board-level testing and debugging
  • Production test integration
  • Full readback capability for verification

XC2S200-6FGG713C Logic Architecture Details

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG713C contains:

  • Four logic cells with 4-input Look-Up Tables (LUTs)
  • Dedicated carry logic for high-speed arithmetic operations
  • Efficient multiplier support for DSP applications
  • Cascade chain for wide-input function implementation
  • Abundant registers and latches with enable, set, and reset capabilities

Input/Output Block Features

The programmable IOBs provide:

  • Bidirectional I/O with three-state control
  • Programmable slew rate control
  • Weak pull-up and pull-down resistors
  • Input delay elements for setup time optimization
  • DDR (Double Data Rate) support

Why Choose the XC2S200-6FGG713C Spartan-II FPGA

Cost-Effectiveness

The Spartan-II family delivers premium FPGA functionality at an economical price point, leveraging cost-effective 0.18-micron CMOS process technology to maximize value for high-volume production.

Proven Reliability

Based on the established Virtex FPGA architecture, the XC2S200-6FGG713C inherits proven design techniques and manufacturing processes that ensure long-term reliability.

Design Flexibility

Unlimited reprogrammability allows:

  • Field updates without hardware changes
  • Design iterations without NRE costs
  • Multi-configuration capabilities
  • Extended product lifecycle support

Low-Power Operation

The segmented routing architecture minimizes power consumption while maintaining high performance, making the XC2S200-6FGG713C suitable for power-sensitive applications.


XC2S200-6FGG713C Ordering Information

When specifying the XC2S200-6FGG713C for procurement, verify:

  • Lead-Free Compliance: The “G” in the part number confirms RoHS-compliant Pb-free packaging
  • Temperature Grade: “C” suffix indicates Commercial grade (0°C to +85°C)
  • Speed Grade: -6 provides highest performance for timing-critical designs

For volume pricing, technical support, and availability, contact authorized Xilinx distributors or AMD representatives.


Conclusion

The XC2S200-6FGG713C represents an optimal balance of performance, flexibility, and cost-effectiveness for modern digital design challenges. With its 200,000 system gates, 5,292 logic cells, comprehensive memory resources, and robust I/O capabilities, this Spartan-II FPGA delivers the programmable logic foundation needed for successful telecommunications, industrial, and embedded system implementations.

Whether you’re developing new products or upgrading existing designs, the XC2S200-6FGG713C provides the reprogrammability and performance required to accelerate time-to-market while reducing development risk.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.