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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG710C Spartan-II FPGA: High-Performance Programmable Logic Device

Product Details

The XC2S200-6FGG710C is a powerful field-programmable gate array (FPGA) from the renowned Xilinx Spartan-II family, engineered to deliver exceptional performance, flexibility, and cost-effectiveness for a wide range of digital design applications. This advanced programmable logic device combines robust functionality with industry-leading specifications, making it the ideal choice for engineers and designers seeking reliable FPGA solutions for telecommunications, industrial automation, consumer electronics, and embedded systems.


XC2S200-6FGG710C Key Features and Benefits

High-Density Logic Architecture

The XC2S200-6FGG710C delivers outstanding programmable logic capabilities with 200,000 system gates and 5,292 logic cells, providing substantial resources for implementing complex digital designs. The device features a 28 x 42 configurable logic block (CLB) array with 1,176 total CLBs, enabling engineers to develop sophisticated algorithms, state machines, and data processing pipelines with ease.

Advanced Memory Resources

This Xilinx FPGA incorporates comprehensive memory architecture designed for high-performance applications:

Memory Type Capacity Description
Distributed RAM 75,264 bits Flexible LUT-based memory for small, fast storage
Block RAM 56K bits (14 blocks) Dual-port synchronous RAM for larger data buffers
Total Available RAM 131,264+ bits Combined memory resources for diverse applications

Superior Speed Performance (-6 Speed Grade)

The -6 speed grade designation indicates the fastest performance tier available in the Spartan-II family. This XC2S200-6FGG710C FPGA operates at frequencies up to 263 MHz, enabling high-throughput data processing for demanding applications such as digital signal processing, high-speed communications, and real-time control systems.


XC2S200-6FGG710C Technical Specifications

Core Architecture Specifications

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42 (Row x Column)
Total CLBs 1,176
Maximum User I/O 284
Delay-Locked Loops (DLLs) 4
Process Technology 0.18 μm CMOS
Core Voltage 2.5V

Package Information

Specification Details
Package Type FGG (Fine-Pitch BGA, Pb-Free)
Pin Count 710 pins
Mounting Type Surface Mount (BGA)
RoHS Compliance Yes (Pb-Free)
Operating Temperature 0°C to +85°C (Commercial)

Electrical Characteristics

Parameter Value
Core Supply Voltage (VCCINT) 2.375V to 2.625V
I/O Supply Voltage (VCCO) 1.4V to 3.6V
Maximum Operating Frequency 263 MHz
Configuration Bits 1,335,840

XC2S200-6FGG710C Block RAM Features

Dual-Port Synchronous Block RAM

The XC2S200-6FGG710C includes 14 dedicated block RAM modules, each providing 4,096 bits of fully synchronous dual-port memory. These block RAM cells offer independent control signals for each port, enabling simultaneous read and write operations for maximum throughput.

Flexible Port Aspect Ratios

Engineers can configure block RAM ports with various width and depth combinations:

Data Width Memory Depth Address Bus Data Bus
1-bit 4,096 ADDR[11:0] DATA[0]
2-bit 2,048 ADDR[10:0] DATA[1:0]
4-bit 1,024 ADDR[9:0] DATA[3:0]
8-bit 512 ADDR[8:0] DATA[7:0]
16-bit 256 ADDR[7:0] DATA[15:0]

XC2S200-6FGG710C I/O Capabilities

Comprehensive I/O Standard Support

The XC2S200-6FGG710C supports multiple I/O standards for seamless system integration:

  • LVTTL (Low-Voltage TTL)
  • LVCMOS (Low-Voltage CMOS)
  • PCI (Peripheral Component Interconnect)
  • GTL+ (Gunning Transceiver Logic Plus)
  • SSTL (Stub Series Terminated Logic)
  • HSTL (High-Speed Transceiver Logic)

Input/Output Block (IOB) Architecture

Each IOB in the XC2S200-6FGG710C provides:

  • Programmable input delay for hold-time adjustment
  • Three-state output control with dedicated enable
  • Adjustable output slew rate for EMI reduction
  • Optional pull-up/pull-down resistors
  • Support for registered or combinatorial I/O

XC2S200-6FGG710C Delay-Locked Loop (DLL) Features

Advanced Clock Management

The XC2S200-6FGG710C incorporates four Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide essential clock management functions:

  • Clock multiplication (2x, 4x)
  • Clock division (1.5x, 2x, 2.5x, 3x, 4x, 5x, 8x, 16x)
  • Phase shifting (0°, 90°, 180°, 270°)
  • Clock deskewing for improved system timing
  • Clock mirroring for board-level synchronization

Zero-Delay Buffer Operation

The DLL architecture eliminates clock distribution delays, ensuring that internal clock edges align precisely with external clock inputs. This capability is critical for high-speed interface designs and multi-device synchronization.


XC2S200-6FGG710C Configuration Options

Multiple Configuration Modes

The XC2S200-6FGG710C supports versatile configuration methods:

Mode CCLK Direction Data Width Description
Master Serial Output 1-bit FPGA drives configuration clock
Slave Serial Input 1-bit External source provides clock
Slave Parallel Input 8-bit High-speed parallel download
Boundary Scan (JTAG) N/A 1-bit IEEE 1149.1 compliant

Configuration Data Security

  • CRC error detection during configuration
  • Bitstream readback for verification
  • In-system programming support for field updates

XC2S200-6FGG710C Application Areas

Telecommunications and Networking

The XC2S200-6FGG710C excels in telecommunications applications requiring high-speed data processing and protocol conversion. Common implementations include:

  • DSL modem chipsets
  • Wireless base station controllers
  • Network switches and routers
  • Protocol bridges and converters

Industrial Automation

For industrial control systems, this FPGA provides reliable performance for:

  • Motor control and drive systems
  • PLC (Programmable Logic Controller) implementations
  • Machine vision processing
  • Sensor interface and data acquisition

Consumer Electronics

Cost-effective design solutions for consumer products:

  • Digital video processing
  • Audio codec implementations
  • Display controllers
  • Gaming peripherals

Automotive Systems

The XC2S200-6FGG710C supports automotive applications including:

  • Infotainment systems
  • Driver assistance interfaces
  • Vehicle networking gateways
  • Instrument cluster displays

XC2S200-6FGG710C Development Tools and Support

Xilinx ISE Design Suite Compatibility

The XC2S200-6FGG710C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers benefit from:

  • HDL synthesis (VHDL and Verilog)
  • Schematic capture integration
  • Timing analysis and optimization
  • Power analysis and estimation

Design Resources

  • Complete datasheets with electrical specifications
  • User guides for implementation best practices
  • Application notes demonstrating design techniques
  • Reference designs for common applications
  • IP cores for accelerated development

XC2S200-6FGG710C Ordering Information

Part Number Breakdown

Code Meaning
XC2S200 Spartan-II device with 200K system gates
-6 Fastest speed grade
FGG Fine-pitch BGA, Pb-free (RoHS compliant)
710 710-pin package
C Commercial temperature range (0°C to +85°C)

Quality and Compliance

  • RoHS Compliant: Lead-free packaging
  • MSL Rating: Appropriate moisture sensitivity level
  • REACH Compliant: Environmental regulations adherence
  • WEEE Compliant: Waste electronics directive compliance

Why Choose the XC2S200-6FGG710C Spartan-II FPGA

Cost-Effective ASIC Alternative

The XC2S200-6FGG710C serves as a superior alternative to mask-programmed ASICs by eliminating:

  • High initial development costs
  • Lengthy design cycles
  • Inherent first-silicon risks
  • Inability to make field updates

Unlimited Reprogrammability

SRAM-based configuration enables infinite design iterations, allowing engineers to refine designs without hardware changes. This flexibility dramatically reduces time-to-market and enables field-upgradable products.

Proven Reliability

Built on Xilinx’s mature 0.18 μm CMOS process technology, the XC2S200-6FGG710C delivers consistent, reliable performance backed by extensive characterization and qualification data.


XC2S200-6FGG710C Summary

The XC2S200-6FGG710C Spartan-II FPGA represents an exceptional balance of performance, features, and cost-effectiveness for demanding digital design applications. With its 200,000 system gates, 5,292 logic cells, 56K block RAM, four DLLs, and comprehensive I/O support, this programmable logic device provides engineers with the resources needed to implement complex designs efficiently.

Whether developing telecommunications equipment, industrial controllers, consumer electronics, or embedded systems, the XC2S200-6FGG710C delivers the speed, flexibility, and reliability required for successful product development. Contact authorized distributors today to learn more about pricing, availability, and technical support for your next FPGA project.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.