The XC2S200-6FGG709C is a powerful Field Programmable Gate Array from the renowned Xilinx Spartan-II FPGA family. This advanced programmable logic device delivers exceptional performance with 200,000 system gates, making it the ideal choice for engineers seeking a cost-effective yet high-performance FPGA solution for complex digital designs.
Key Features of XC2S200-6FGG709C FPGA
The XC2S200-6FGG709C offers an impressive array of features that make it suitable for diverse industrial, telecommunications, and embedded applications.
Core Architecture Specifications
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Delay-Locked Loops (DLLs) |
4 |
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V |
| Process Technology |
0.18 µm CMOS |
| Maximum Frequency |
263 MHz |
| Speed Grade |
-6 (Commercial) |
| Operating Temperature |
0°C to +85°C |
Package Information
| Detail |
Description |
| Package Type |
FGG (Fine Ball Grid Array, Pb-Free) |
| Pin Count |
709 |
| RoHS Compliance |
Yes (Lead-Free) |
Spartan-II FPGA Architecture Overview
The XC2S200-6FGG709C incorporates Xilinx’s proven Spartan-II architecture, featuring a highly flexible programmable structure of Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs). This architecture provides engineers with exceptional design flexibility for implementing custom digital circuits.
Configurable Logic Block (CLB) Features
Each CLB in the XC2S200-6FGG709C contains two slices with the following resources: two 4-input function generators capable of implementing any Boolean function, carry logic for high-speed arithmetic operations, and two storage elements that can function as flip-flops or latches. The 1,176 CLBs arranged in a 28 × 42 array provide ample logic resources for sophisticated digital designs.
SelectRAM Hierarchical Memory System
The XC2S200-6FGG709C features a dual-tier memory architecture delivering maximum flexibility. The distributed RAM offers 16 bits per Look-Up Table with a total capacity of 75,264 bits for localized data storage. The configurable block RAM provides 56 Kbits in 4K-bit fully synchronous dual-port modules, enabling independent read/write operations with configurable data widths. This hierarchical memory system allows designers to optimize storage placement based on application requirements.
Advanced Clock Management with DLLs
Four dedicated Delay-Locked Loops positioned at each corner of the die provide precise clock distribution and management capabilities. These DLLs enable clock multiplication, division, phase shifting, and deskewing functions essential for high-speed synchronous designs. The low-skew global clock distribution network ensures timing consistency across the entire FPGA fabric.
I/O Standards and Interface Capabilities
The XC2S200-6FGG709C supports 16 different I/O standards, providing exceptional interface flexibility for diverse system requirements.
Supported Interface Standards
The device accommodates LVTTL (3.3V Low-Voltage TTL), LVCMOS (Low-Voltage CMOS) at 3.3V/2.5V/1.5V, PCI Local Bus 3.3V Signaling, GTL and GTL+ (Gunning Transceiver Logic), HSTL Class I/II/III/IV (High-Speed Transceiver Logic), SSTL3 and SSTL2 (Stub Series Terminated Logic), and LVDS differential signaling. This extensive I/O support enables seamless integration with processors, memory devices, and communication interfaces.
Hot-Swap and PCI Compliance
The XC2S200-6FGG709C is fully PCI compliant and Compact PCI hot-swap friendly, making it ideal for telecommunications infrastructure and server applications requiring live board insertion and removal without system shutdown.
Configuration and Programming Options
The XC2S200-6FGG709C offers multiple configuration modes for maximum deployment flexibility.
Configuration Modes
Master Serial Mode allows autonomous boot from serial PROM using an internally generated CCLK. Slave Parallel Mode accepts 8-bit configuration data from external processor or controller. Slave Serial Mode provides single-bit configuration input with externally supplied CCLK. Boundary-Scan Mode enables IEEE 1149.1 JTAG-based configuration and testing. The configuration bitstream size for the XC2S200-6FGG709C is 1,335,840 bits, requiring appropriate PROM selection for production deployment.
Readback and Verification
Full readback capability allows design verification and internal state observation during operation, supporting debug and testing workflows essential for complex system development.
Application Areas for XC2S200-6FGG709C
Telecommunications Infrastructure
The XC2S200-6FGG709C excels in telecommunications applications including base station controllers, channel cards, multiplexers, and protocol converters. The combination of 200,000 system gates, 56K block RAM, and multiple I/O standards supports complex signal processing and interface bridging functions.
Industrial Automation and Control
Industrial control systems benefit from the XC2S200-6FGG709C’s deterministic timing, flexible I/O configuration, and operating temperature range. Applications include motor controllers, PLC modules, sensor interfaces, and factory automation equipment.
Networking Equipment
Routers, switches, and network interface cards leverage the XC2S200-6FGG709C’s high-speed logic and extensive I/O capabilities for packet processing, protocol translation, and interface adaptation functions.
Embedded Systems and SoC Prototyping
The substantial logic density and hierarchical memory architecture make the XC2S200-6FGG709C suitable for embedded processor implementations, peripheral controllers, and system-on-chip prototyping applications.
Development Tools and Resources
Xilinx ISE Design Suite
The XC2S200-6FGG709C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry through schematic capture or HDL (VHDL/Verilog). The suite includes automated synthesis, mapping, placement, and routing capabilities with timing-driven optimization. Simulation support enables functional and timing verification, while integrated programming utilities handle device configuration.
IP Core Availability
Xilinx and third-party vendors offer pre-verified IP cores for the Spartan-II platform, accelerating development of common functions such as processors, memory controllers, communication protocols, and DSP modules.
Ordering Information Breakdown
Understanding the XC2S200-6FGG709C part number provides insight into device specifications.
| Code Segment |
Meaning |
| XC2S |
Xilinx Spartan-II Family |
| 200 |
200,000 System Gate Density |
| -6 |
Speed Grade (Commercial Temp) |
| FGG |
Fine Ball Grid Array (Pb-Free) |
| 709 |
Pin Count |
| C |
Commercial Temperature (0°C to +85°C) |
Why Choose XC2S200-6FGG709C FPGA
The XC2S200-6FGG709C represents an excellent balance of performance, features, and value for FPGA-based designs. Engineers selecting this device benefit from proven Spartan-II architecture with extensive deployment history, 200,000 system gates supporting complex digital implementations, flexible I/O with 16 interface standards, substantial on-chip memory resources, and RoHS-compliant Pb-free packaging.
The XC2S200-6FGG709C serves as a superior alternative to mask-programmed ASICs, eliminating non-recurring engineering costs, reducing development cycles, and enabling field upgrades impossible with fixed-function devices.
Where to Buy XC2S200-6FGG709C FPGA
For purchasing the XC2S200-6FGG709C and other Spartan-II family devices, explore authorized distributor networks offering genuine Xilinx components. For comprehensive Xilinx FPGA solutions, reliable sourcing, and technical support, trusted suppliers provide competitive pricing and availability information.
