Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG706C: High-Performance Xilinx Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG706C is a powerful Field Programmable Gate Array from the renowned Xilinx FPGA Spartan-II family. This advanced programmable logic device delivers exceptional performance for demanding industrial, commercial, and embedded system applications. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O capabilities, the XC2S200-6FGG706C stands as a superior alternative to traditional mask-programmed ASICs.

XC2S200-6FGG706C Key Features and Specifications

The XC2S200-6FGG706C combines cutting-edge programmable logic technology with cost-effective implementation, making it an ideal choice for engineers seeking high-performance digital solutions.

Core Logic Architecture

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Process Technology 0.18μm
Core Voltage 2.5V

Memory Resources

The XC2S200-6FGG706C offers flexible memory options to support various application requirements:

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56 Kbits (14 blocks)
Block RAM Configuration Dual-port 4,096-bit synchronous RAM

Each block RAM cell provides fully synchronous dual-ported operation with independent control signals for each port. The data widths of the two ports can be configured independently, offering built-in flexibility for diverse memory applications.

Package and Pin Configuration

Specification Value
Package Type FGG706 (Fine-Pitch BGA)
Total Pins 706
Maximum User I/O 284
Lead-Free Yes (Pb-free)
Speed Grade -6 (Fastest)
Temperature Range Commercial (0°C to +85°C)

Why Choose the XC2S200-6FGG706C Spartan-II FPGA?

Superior Alternative to ASICs

The XC2S200-6FGG706C eliminates the initial costs, lengthy development cycles, and inherent risks associated with conventional ASICs. Its programmability permits design upgrades in the field with no hardware replacement necessary—a capability impossible with traditional ASICs.

High-Performance Clock Management

The device features four Delay-Locked Loops (DLLs), one at each corner of the die, providing:

  • Clock deskew and phase alignment
  • Clock multiplication and division
  • Board-level clock mirroring capabilities
  • Fast and predictable interconnects ensuring successive design iterations meet timing requirements

Versatile I/O Standards Support

The XC2S200-6FGG706C supports 16 different I/O standards, enabling seamless integration with various bus and memory interfaces. The Input/Output Blocks (IOBs) surround the CLB array and include three D-type edge-triggered flip-flops or level-sensitive latches with independent clock enable signals.

XC2S200-6FGG706C Technical Architecture

Configurable Logic Block Structure

The Spartan-II architecture features a regular, flexible, programmable arrangement of Configurable Logic Blocks (CLBs). Key architectural elements include:

  • Logic Cells: Each logic cell contains a 4-input function generator, storage element, and carry logic
  • Four Logic Cells per CLB: Providing comprehensive logic implementation capabilities
  • Direct Feedthrough Paths: Four paths per CLB for extra data input lines or additional local routing
  • LUT-based Design: 4-input Look-Up Tables implement combinatorial logic functions

Block RAM Organization

Block RAM memory blocks are organized in columns along each vertical edge of the device:

  • Two columns extending the full height of the chip
  • 14 total blocks providing 56 Kbits of storage
  • Configurable aspect ratios from 1×4096 to 16×256
  • Dedicated routing for efficient CLB and inter-block communication

XC2S200-6FGG706C Applications

The XC2S200-6FGG706C excels in high-volume applications where programmable versatility adds significant benefits:

  • Industrial Control Systems: Real-time processing and automation
  • Telecommunications Equipment: Protocol conversion and signal processing
  • Video and Image Processing: Real-time video manipulation and filtering
  • Embedded Systems: Custom peripheral interfaces and controllers
  • Medical Devices: Signal acquisition and processing systems
  • Automotive Electronics: Sensor interfaces and control modules
  • Consumer Electronics: Custom logic implementation

Configuration and Development

Configuration Modes

The XC2S200-6FGG706C supports multiple configuration modes:

Mode Description CCLK Direction Data Width
Master Serial FPGA drives configuration clock Output 1
Slave Parallel External controller drives configuration Input 8
Boundary-Scan JTAG-based configuration N/A 1
Slave Serial External serial configuration Input 1

Configuration Data Requirements

Parameter Value
Configuration Bits 1,335,840
Configuration Memory Approximately 163 KB

Development Tools

The XC2S200-6FGG706C is fully supported by Xilinx ISE Design Suite, providing:

  • Comprehensive synthesis and implementation tools
  • Behavioral and timing simulation
  • In-system debugging capabilities
  • Extensive IP core library support

XC2S200-6FGG706C Ordering Information

Part Number Breakdown

Code Meaning
XC2S200 Spartan-II, 200K System Gates
-6 Speed Grade (Fastest)
FGG Fine-Pitch BGA, Pb-Free
706 Pin Count
C Commercial Temperature (0°C to +85°C)

Quality and Compliance

  • RoHS Compliant (Pb-free packaging)
  • Industrial-grade reliability
  • Comprehensive qualification testing
  • Full JTAG boundary scan support (IEEE 1149.1/1532)

Related Spartan-II Family Devices

For projects requiring different resource levels, consider these related Spartan-II family members:

Device System Gates Logic Cells Max I/O Block RAM
XC2S15 15,000 432 86 16K
XC2S30 30,000 972 92 24K
XC2S50 50,000 1,728 176 32K
XC2S100 100,000 2,700 176 40K
XC2S150 150,000 3,888 260 48K
XC2S200 200,000 5,292 284 56K

Technical Support and Documentation

Comprehensive documentation is available for the XC2S200-6FGG706C:

  • Complete datasheet (DS001) covering all four modules
  • Application notes for design implementation
  • Reference designs and IP cores
  • PCB layout guidelines and thermal management recommendations

Conclusion

The XC2S200-6FGG706C represents a proven, reliable FPGA solution for engineers requiring high-performance programmable logic in a cost-effective package. With its 200,000 system gates, 56 Kbits of block RAM, 284 user I/Os, and fastest -6 speed grade, this Spartan-II device delivers the performance and flexibility needed for demanding industrial and commercial applications.

Whether you’re designing industrial control systems, telecommunications equipment, or embedded solutions, the XC2S200-6FGG706C provides the programmable versatility and proven reliability that modern electronic designs demand.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.