The XC2S200-6FGG703C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, originally developed by Xilinx (now AMD). This powerful programmable logic device delivers 200,000 system gates, making it an exceptional choice for engineers seeking cost-effective, flexible digital design solutions. Whether you’re developing telecommunications equipment, industrial control systems, or embedded applications, the XC2S200-6FGG703C provides the perfect balance of performance, density, and affordability.

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Key Features of the XC2S200-6FGG703C FPGA

The XC2S200-6FGG703C stands out as a superior alternative to mask-programmed ASICs, offering unlimited reprogrammability and eliminating the initial costs associated with conventional ASIC development. This device combines advanced architectural features with cost-effective 0.18-micron process technology.

Core Logic Resources

Performance Specifications

The -6 speed grade designation indicates this is the higher performance variant within the Spartan-II family, delivering exceptional timing characteristics for demanding applications:

• Maximum System Clock Rate: Up to 200 MHz
• Process Technology: 0.18 μm CMOS
• Core Voltage: 2.5V
• I/O Voltage Support: 1.5V, 2.5V, or 3.3V

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XC2S200-6FGG703C Package Information

Understanding the Part Number

The XC2S200-6FGG703C part number follows a specific naming convention that provides essential information about the device:

• XC2S200: Spartan-II family, 200K system gates
• -6: Higher performance speed grade (Commercial temperature only)
• FGG: Fine-pitch Ball Grid Array, Pb-free (RoHS compliant)
• 703: Pin count
• C: Commercial temperature range (0°C to +85°C)

Package Characteristics

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Architectural Overview of the Spartan-II XC2S200-6FGG703C

The XC2S200-6FGG703C features a sophisticated architecture that maximizes design flexibility while maintaining predictable, high-speed performance. This Xilinx FPGA incorporates several key architectural elements that work together seamlessly.

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG703C contains four Logic Cells (LCs), organized into two identical slices. The key components include:

• 4-Input Look-Up Tables (LUTs): Function as programmable logic generators
• Dedicated Carry Logic: Enables high-speed arithmetic operations
• Storage Elements: Configurable as edge-triggered D-type flip-flops or level-sensitive latches
• F5/F6 Multiplexers: Allow implementation of functions up to 6 inputs

Input/Output Blocks (IOBs)

The XC2S200-6FGG703C IOBs support a comprehensive range of I/O standards, making it suitable for interfacing with various external devices and protocols:

Supported I/O Standards

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Block RAM Capabilities

The XC2S200-6FGG703C includes 14 dedicated Block RAM modules, providing a total of 56K bits of fast, dual-port synchronous memory. Each 4,096-bit block RAM cell offers:

• Dual-Port Operation: Independent read/write access from two ports
• Configurable Data Widths: 1×4096, 2×2048, 4×1024, 8×512, or 16×256
• Built-in Bus Width Conversion: Different port widths supported simultaneously
• Fully Synchronous Operation: Independent control signals for each port

Block RAM Aspect Ratios

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Delay-Locked Loop (DLL) Features

The XC2S200-6FGG703C incorporates four fully digital Delay-Locked Loops positioned at each corner of the device. These DLLs provide advanced clock management capabilities:

DLL Functions

• Zero Clock Distribution Delay: Eliminates on-chip clock skew
• Clock Phase Control: Provides 0°, 90°, 180°, and 270° phase outputs
• Frequency Synthesis: Clock doubling capability
• Clock Division: Divide by 1.5, 2, 2.5, 3, 4, 5, 8, or 16
• Clock Mirroring: Board-level clock deskewing between multiple FPGAs

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Configuration Options for the XC2S200-6FGG703C

The XC2S200-6FGG703C supports multiple configuration modes to accommodate various system requirements:

Available Configuration Modes

Configuration File Size

The XC2S200-6FGG703C requires a configuration bitstream of 1,335,840 bits (approximately 167 KB). This data can be stored in:

• External Serial PROMs
• Parallel Flash Memory
• Microcontroller/Processor Memory
• System Hard Drives or Flash Cards

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IEEE 1149.1 Boundary Scan Support

The XC2S200-6FGG703C includes full IEEE 1149.1-compliant boundary scan logic, enabling:

• Board-Level Testing: EXTEST, SAMPLE/PRELOAD, BYPASS instructions
• In-System Configuration: Through the JTAG Test Access Port
• Design Verification: Readback of configuration data and internal states
• User-Defined Registers: USR1 and USR2 for custom applications

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Typical Applications for the XC2S200-6FGG703C

The versatility and performance of the XC2S200-6FGG703C make it ideal for numerous applications:

Industrial Applications

• Programmable Logic Controllers (PLCs)
• Motor Control Systems
• Industrial Automation Equipment
• Process Control Instrumentation

Communications

• Network Switches and Routers
• Protocol Converters
• Base Station Equipment
• Fiber Optic Transceivers

Consumer Electronics

• Set-Top Boxes
• Digital Video Equipment
• Audio Processing Systems
• Gaming Peripherals

Automotive Systems

• Advanced Driver Assistance Systems (ADAS)
• Infotainment Systems
• Vehicle Networking
• Sensor Integration

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Development Tools and Software Support

The XC2S200-6FGG703C is fully supported by the Xilinx ISE Design Suite, which provides:

• Design Entry: Schematic capture and HDL (Verilog/VHDL) support
• Synthesis: Automatic logic optimization and mapping
• Implementation: Place and route with timing-driven optimization
• Verification: Simulation and static timing analysis
• Configuration: Bitstream generation and device programming

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Ordering Information Summary

Related Specifications

• Lifecycle Status: Legacy (Check with distributor for availability)
• RoHS Compliance: Yes (Pb-free packaging)
• MSL Rating: Consult datasheet for moisture sensitivity level
• ESD Protection: Built-in protection on all I/O pins

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Why Choose the XC2S200-6FGG703C?

The XC2S200-6FGG703C offers compelling advantages for design engineers:

1. Cost-Effective Performance: Delivers high gate density at competitive pricing
2. Design Flexibility: Unlimited reprogramming cycles enable rapid prototyping
3. Fast Time-to-Market: Eliminates lengthy ASIC development cycles
4. Field Upgradability: Designs can be updated post-deployment
5. Reduced Risk: No NRE costs or minimum order quantities
6. Comprehensive I/O Support: 16 different interface standards
7. Integrated Memory: Both distributed and block RAM options

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Technical Documentation and Resources

For complete specifications, timing parameters, and design guidelines, refer to:

• DS001: Spartan-II FPGA Family Data Sheet
• XAPP176: Configuration and Readback Application Note
• XAPP098: Serial Configuration Application Note

The XC2S200-6FGG703C represents an excellent choice for engineers requiring a reliable, high-performance FPGA solution with proven architecture and comprehensive development tool support.