The XC2S200-6FGG702C is a powerful field-programmable gate array (FPGA) from the renowned Xilinx Spartan-II family, engineered to deliver exceptional performance, reliability, and cost-effectiveness for demanding digital design applications. This versatile programmable logic device combines advanced architecture with comprehensive I/O capabilities, making it an ideal solution for engineers seeking robust signal processing, control systems, and embedded applications.
Key Features of the XC2S200-6FGG702C Spartan-II FPGA
The XC2S200-6FGG702C represents Xilinx’s commitment to providing high-quality programmable logic solutions. This FPGA offers a compelling combination of logic density, memory resources, and system-level features that make it suitable for a wide range of applications.
Advanced Programmable Logic Architecture
The XC2S200-6FGG702C features a regular, flexible, programmable architecture consisting of Configurable Logic Blocks (CLBs) surrounded by a perimeter of programmable Input/Output Blocks (IOBs). This architecture enables designers to implement complex digital logic functions with optimal efficiency.
Core Architecture Highlights:
- System Gates: 200,000 system gates providing substantial logic capacity
- Logic Cells: 5,292 logic cells for implementing complex digital designs
- CLB Array: 28 × 42 array configuration (1,176 CLBs total)
- Manufacturing Process: 0.18μm CMOS technology for enhanced performance
- Operating Voltage: 2.5V core voltage for reliable operation
Memory Resources and Block RAM Capabilities
One of the standout features of the XC2S200-6FGG702C is its comprehensive memory architecture. The device includes both distributed RAM and dedicated Block RAM resources.
Block RAM Specifications
The XC2S200-6FGG702C incorporates 56 Kbits of Block RAM organized in columns along the device edges. These memory blocks provide:
- True dual-port RAM functionality
- Configurable data widths
- Synchronous read and write operations
- Ideal for FIFO buffers, lookup tables, and data storage
Distributed RAM Features
Beyond Block RAM, the XC2S200-6FGG702C offers distributed RAM implemented within the CLB structure, providing:
- 75,264 bits of distributed memory
- Fast, local memory access
- Flexible configuration options
- Reduced routing delays for memory-intensive designs
XC2S200-6FGG702C Technical Specifications
Understanding the complete technical specifications helps engineers make informed decisions when selecting this Xilinx FPGA for their projects.
Electrical Characteristics
| Parameter |
Specification |
| Core Supply Voltage (VCCINT) |
2.5V ± 5% |
| I/O Supply Voltage (VCCO) |
1.5V to 3.3V |
| Maximum Operating Frequency |
263 MHz |
| Junction Temperature Range |
0°C to +85°C (Commercial) |
| Power Consumption |
Application dependent |
Logic Resources Summary
| Resource |
Quantity |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 total) |
| Maximum User I/O |
284 |
| Block RAM |
56 Kbits |
| Distributed RAM |
75,264 bits |
| Delay-Locked Loops (DLLs) |
4 |
Package Information
| Specification |
Detail |
| Package Type |
Fine-pitch Ball Grid Array (FBGA) |
| Pin Count |
702 pins |
| Lead-Free Option |
Available (Pb-free compliant) |
| Thermal Performance |
Enhanced thermal dissipation |
Clock Management with Four Delay-Locked Loops
The XC2S200-6FGG702C incorporates four Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide essential clock management capabilities:
DLL Features and Benefits
- Clock Deskew: Eliminates clock distribution delays
- Frequency Synthesis: Generate multiple clock frequencies from a single source
- Phase Shifting: Precise phase adjustment for timing-critical applications
- Clock Mirroring: Board-level clock synchronization across multiple devices
- Jitter Reduction: Improved signal integrity for high-speed designs
Clock Distribution Network
The global clock distribution network ensures low-skew clock delivery to all flip-flops and synchronous elements throughout the XC2S200-6FGG702C. This architecture supports:
- Four dedicated global clock inputs
- Primary and secondary clock networks
- Clock enable functionality
- Multiple clock domains
Input/Output Capabilities of the XC2S200-6FGG702C
The I/O subsystem of the XC2S200-6FGG702C provides exceptional flexibility for interfacing with external systems and components.
Comprehensive I/O Standards Support
The XC2S200-6FGG702C supports multiple I/O standards to ensure compatibility with various system requirements:
- LVTTL: Low-Voltage TTL for general-purpose interfacing
- LVCMOS: Low-Voltage CMOS at multiple voltage levels
- PCI: Compliant with PCI Local Bus specifications
- GTL+: Gunning Transceiver Logic Plus for high-speed buses
- SSTL: Stub Series Terminated Logic for memory interfaces
- HSTL: High-Speed Transceiver Logic
I/O Block Architecture
Each IOB in the XC2S200-6FGG702C includes:
- Programmable input delay elements
- Output slew rate control
- Programmable pull-up/pull-down resistors
- 3-state output control
- Registered input and output paths
Configuration Options and Programming Flexibility
The XC2S200-6FGG702C offers multiple configuration modes to suit various system architectures and requirements.
Supported Configuration Modes
| Mode |
Description |
Data Width |
| Master Serial |
FPGA controls configuration clock |
1 bit |
| Slave Serial |
External source controls configuration |
1 bit |
| Slave Parallel |
8-bit parallel configuration |
8 bits |
| Boundary-Scan (JTAG) |
IEEE 1149.1 compliant programming |
1 bit |
Configuration Memory
- Configuration Bits: 1,335,840 bits
- PROM Compatibility: Compatible with Xilinx Platform Flash and serial PROMs
- In-System Programmability: Unlimited reprogramming capability
- Security Features: Configuration bitstream encryption support
Applications for the XC2S200-6FGG702C FPGA
The versatility of the XC2S200-6FGG702C makes it suitable for numerous application domains:
Industrial Control Systems
- Motor control and drive systems
- Process automation equipment
- Industrial networking interfaces
- Sensor data acquisition
Digital Signal Processing
- Audio processing systems
- Image processing pipelines
- Filter implementations
- Signal conditioning circuits
Communications Infrastructure
- Protocol converters
- Data encryption/decryption
- Network switching equipment
- Interface bridging solutions
Consumer Electronics
- Video processing systems
- Display controllers
- Gaming peripherals
- Audio equipment
Embedded Systems
- Custom microcontroller implementations
- Peripheral interface controllers
- System-on-chip prototyping
- Hardware acceleration modules
Advantages Over Mask-Programmed ASICs
The XC2S200-6FGG702C offers significant advantages compared to traditional ASIC implementations:
Cost Benefits
- No NRE Costs: Eliminates expensive mask charges
- Lower Volume Economics: Cost-effective even for low-volume production
- Reduced Inventory Risk: Single device supports multiple designs
Development Advantages
- Faster Time-to-Market: Immediate prototyping capability
- Design Flexibility: Easy modifications without hardware changes
- Field Upgradability: In-system reprogramming for feature updates
- Risk Mitigation: Verify functionality before volume production
Technical Benefits
- Proven Architecture: Based on mature, reliable Spartan-II technology
- Comprehensive Tool Support: Full ISE Design Suite compatibility
- Extensive Documentation: Complete datasheet, application notes, and reference designs
- Long-Term Availability: Established product with continued support
Design Tools and Development Resources
Engineers working with the XC2S200-6FGG702C have access to comprehensive development resources:
Software Tools
- ISE Design Suite: Complete FPGA design environment
- Synthesis Tools: Support for VHDL and Verilog
- Simulation: Integrated behavioral and timing simulation
- Implementation: Place-and-route with timing-driven optimization
Documentation and Support
- Complete datasheet (DS001)
- Application notes and reference designs
- Technical support forums
- Design examples and IP cores
Ordering Information for XC2S200-6FGG702C
Part Number Breakdown
| Element |
Meaning |
| XC2S |
Xilinx Spartan-II Family |
| 200 |
200K System Gates |
| -6 |
Speed Grade (Fastest commercial) |
| FGG |
Fine-pitch BGA, Pb-free |
| 702 |
Pin Count |
| C |
Commercial Temperature Range |
Speed Grade Options
- -5: Standard speed grade
- -6: Fastest speed grade (commercial only)
Temperature Range Options
- C: Commercial (0°C to +85°C)
- I: Industrial (-40°C to +100°C)
Conclusion: Why Choose the XC2S200-6FGG702C
The XC2S200-6FGG702C delivers an optimal balance of performance, features, and cost-effectiveness for modern digital design challenges. With its 200,000 system gates, comprehensive memory resources, flexible I/O capabilities, and robust clock management features, this Spartan-II FPGA provides the foundation for successful implementation of complex digital systems.
Whether you’re developing industrial control systems, communications equipment, digital signal processing applications, or embedded systems, the XC2S200-6FGG702C offers the programmability, reliability, and performance needed to bring your designs to life efficiently and cost-effectively.
For engineers seeking a proven, reliable FPGA solution backed by comprehensive development tools and documentation, the XC2S200-6FGG702C represents an excellent choice that combines Xilinx’s industry-leading FPGA technology with practical, real-world usability.
