Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG701C: High-Performance Spartan-II FPGA for Industrial and Commercial Applications

Product Details

The XC2S200-6FGG701C is a powerful field-programmable gate array (FPGA) from the renowned Xilinx Spartan-II family. Engineered with advanced 0.18-micron CMOS technology and operating at 2.5V core voltage, this programmable logic device delivers exceptional performance for demanding digital design applications. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O capabilities, the XC2S200-6FGG701C represents an ideal solution for engineers seeking cost-effective, high-density programmable logic.


Key Features of XC2S200-6FGG701C Spartan-II FPGA

High-Density Logic Resources

The XC2S200-6FGG701C integrates substantial programmable logic resources within its compact Fine-Pitch Ball Grid Array (FBGA) package:

Specification Value
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56 Kbits

Superior Speed Grade Performance

The -6 speed grade designation indicates this device operates at higher performance levels compared to standard variants. This enhanced speed grade enables:

  • System clock rates up to 200 MHz
  • Optimized timing for high-speed digital signal processing
  • Reduced propagation delays for time-critical applications
  • Enhanced performance for complex arithmetic operations

XC2S200-6FGG701C Technical Specifications

Package and Pinout Configuration

The FGG701C package designation indicates a Pb-free Fine-Pitch Ball Grid Array configuration, making it compliant with modern environmental and manufacturing standards. The “G” designation confirms RoHS-compliant lead-free packaging, while the “C” suffix indicates Commercial temperature range operation (0°C to +85°C).

Memory Architecture

The XC2S200-6FGG701C features a hierarchical SelectRAM memory system:

  • Distributed RAM: Each 4-input Look-Up Table (LUT) can function as a 16×1-bit synchronous RAM
  • Block RAM: 14 dedicated 4,096-bit dual-port RAM blocks
  • Total Block RAM Capacity: 56 Kbits with independent read/write ports
  • RAM Aspect Ratios: Configurable from 4096×1 to 256×16

Clock Management System

Four integrated Delay-Locked Loops (DLLs) provide advanced clock management capabilities:

  • Zero-delay clock buffering for minimal clock skew
  • Clock multiplication (2×) and division (up to 16×)
  • Four-phase clock generation (0°, 90°, 180°, 270°)
  • Board-level clock deskewing through clock mirroring

I/O Standards and Interface Compatibility

Supported I/O Standards

The XC2S200-6FGG701C supports 16 industry-standard I/O interfaces:

I/O Standard Reference Voltage (VREF) Output Voltage (VCCO)
LVTTL N/A 3.3V
LVCMOS2 N/A 2.5V
PCI (3V/5V, 33/66 MHz) N/A 3.3V
GTL 0.8V N/A
GTL+ 1.0V N/A
HSTL Class I 0.75V 1.5V
HSTL Class III/IV 0.9V 1.5V
SSTL3 Class I/II 1.5V 3.3V
SSTL2 Class I/II 1.25V 2.5V
CTT 1.5V 3.3V
AGP-2X 1.32V 3.3V

PCI Compliance

The device is fully PCI compliant, supporting both 3.3V and 5V signaling at 33 MHz and 66 MHz operation modes.


Configuration Options for XC2S200-6FGG701C

Multiple Configuration Modes

Mode Data Width CCLK Direction Description
Master Serial 1-bit Output FPGA drives PROM directly
Slave Serial 1-bit Input External controller drives configuration
Slave Parallel 8-bit Input Fastest configuration option
Boundary-Scan (JTAG) 1-bit N/A IEEE 1149.1 compliant

Configuration File Size

The XC2S200-6FGG701C requires approximately 1,335,840 bits (167 KB) of configuration data, compatible with standard Xilinx serial PROMs and parallel flash memories.


Application Areas for XC2S200-6FGG701C FPGA

Industrial Control Systems

The robust architecture and comprehensive I/O support make this device ideal for:

  • Programmable Logic Controllers (PLCs)
  • Motor drive controllers
  • Industrial automation systems
  • Process control equipment

Telecommunications Equipment

High-speed performance characteristics enable deployment in:

  • Network interface cards
  • Protocol converters
  • Channel aggregation systems
  • Baseband processing units

Consumer Electronics

Cost-effective density supports applications including:

  • Digital video processing
  • Audio signal processing
  • Display controllers
  • Gaming hardware

Embedded Systems

Versatile configuration options facilitate integration in:

  • Single-board computers
  • Microcontroller coprocessors
  • Custom peripheral controllers
  • Prototyping platforms

Development Tools and Software Support

Xilinx ISE Design Suite

The XC2S200-6FGG701C is fully supported by the Xilinx ISE development environment, providing:

  • Automatic mapping, placement, and routing
  • HDL synthesis support (VHDL, Verilog)
  • Timing-driven implementation tools
  • Comprehensive simulation and verification capabilities

IP Core Library

Access to over 400 pre-verified primitives and macros including:

  • Arithmetic functions and comparators
  • Counters and shift registers
  • Multiplexers and decoders
  • Memory controllers and FIFOs

Why Choose XC2S200-6FGG701C for Your Design?

Cost-Effective ASIC Replacement

The Spartan-II architecture provides a superior alternative to mask-programmed ASICs:

  • Eliminates NRE costs: No tooling or mask charges
  • Reduces development time: Programmable logic enables rapid prototyping
  • Enables field upgrades: In-system reprogrammability without hardware changes
  • Minimizes risk: Design modifications possible throughout product lifecycle

Proven Reliability

Built on mature 0.18-micron process technology with established production history, ensuring:

  • Consistent supply availability
  • Well-characterized electrical parameters
  • Extensive application documentation
  • Global distributor network support

For a comprehensive selection of programmable logic devices including the Spartan-II family, explore our complete catalog of Xilinx FPGA products.


XC2S200-6FGG701C Ordering Information

Part Number Breakdown

XC2S200 - 6 - FGG701 - C
   │      │     │      └── Temperature Range: C = Commercial (0°C to +85°C)
   │      │     └────────── Package: FGG = Fine-Pitch BGA, Pb-free
   │      └──────────────── Speed Grade: -6 = Higher Performance
   └─────────────────────── Device: Spartan-II, 200K System Gates

Quality and Compliance

  • RoHS Compliant: Pb-free packaging meets environmental regulations
  • MSL Rating: Moisture sensitivity level for proper handling
  • ESD Protection: Built-in electrostatic discharge protection on all I/Os

Summary: XC2S200-6FGG701C Spartan-II FPGA

The XC2S200-6FGG701C delivers an optimal combination of performance, density, and cost-effectiveness for a wide range of digital design applications. With 200,000 system gates, advanced clock management through four DLLs, flexible memory options, and support for 16 I/O standards, this Spartan-II FPGA provides engineers with the resources needed to implement complex digital systems while maintaining competitive pricing.

Whether designing industrial control systems, telecommunications equipment, or embedded applications, the XC2S200-6FGG701C offers the programmable logic foundation for successful product development backed by comprehensive development tools and documentation.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.