The XC2S200-6FGG700C is a powerful Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, engineered by Xilinx (now AMD). This 700-pin Fine-pitch Ball Grid Array (FGG) device delivers exceptional performance, flexible I/O capabilities, and robust architecture for demanding embedded applications. With 200,000 system gates and a -6 speed grade, this FPGA offers the perfect balance of processing power, cost-efficiency, and design flexibility.
XC2S200-6FGG700C Key Features and Specifications
The XC2S200-6FGG700C combines cutting-edge FPGA technology with industrial-grade reliability. Below are the comprehensive technical specifications that make this device an excellent choice for engineers and system designers.
Core Architecture Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 CLBs) |
| Maximum User I/O |
284 |
| Package Type |
700-Pin Fine-pitch BGA (FGG700) |
| Speed Grade |
-6 (Higher Performance) |
| Operating Temperature |
Commercial (0°C to +85°C) |
Memory Resources
The XC2S200-6FGG700C features a hierarchical memory architecture that supports both distributed and block RAM configurations.
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits (14 blocks × 4,096 bits) |
| Total RAM Bits |
131,264 bits |
Spartan-II FPGA Architecture Overview
The Spartan-II architecture provides a flexible and programmable foundation for implementing complex digital designs. Understanding the internal structure helps engineers maximize the potential of the XC2S200-6FGG700C.
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG700C contains 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB comprises:
- Four Logic Cells (LCs) organized in two identical slices
- 4-input Look-Up Tables (LUTs) for combinatorial logic implementation
- Dedicated carry logic for high-speed arithmetic operations
- Flip-flops/latches with enable, set, and reset controls
Block RAM Architecture
The dual-port block RAM in the XC2S200-6FGG700C offers flexible memory configurations:
| Width |
Depth |
Address Bus |
Data Bus |
| 1-bit |
4,096 |
ADDR[11:0] |
DATA[0] |
| 2-bit |
2,048 |
ADDR[10:0] |
DATA[1:0] |
| 4-bit |
1,024 |
ADDR[9:0] |
DATA[3:0] |
| 8-bit |
512 |
ADDR[8:0] |
DATA[7:0] |
| 16-bit |
256 |
ADDR[7:0] |
DATA[15:0] |
Delay-Locked Loop (DLL) Technology
The XC2S200-6FGG700C integrates four dedicated DLLs positioned at each corner of the die, providing:
- Zero clock distribution delay
- Clock multiplication and division
- Four-phase clock outputs (0°, 90°, 180°, 270°)
- Clock division ratios: 1.5, 2, 2.5, 3, 4, 5, 8, or 16
- Board-level clock de-skewing capability
I/O Standards and Interface Compatibility
The versatile I/O capabilities of the XC2S200-6FGG700C support 16 different signaling standards, enabling seamless integration with various system interfaces.
Supported I/O Standards
| Standard |
VREF (V) |
VCCO (V) |
VTT (V) |
| LVTTL (2-24 mA) |
N/A |
3.3 |
N/A |
| LVCMOS2 |
N/A |
2.5 |
N/A |
| PCI (3V/5V, 33/66 MHz) |
N/A |
3.3 |
N/A |
| GTL |
0.8 |
N/A |
1.2 |
| GTL+ |
1.0 |
N/A |
1.5 |
| HSTL Class I |
0.75 |
1.5 |
0.75 |
| HSTL Class III/IV |
0.9 |
1.5 |
1.5 |
| SSTL3 Class I/II |
1.5 |
3.3 |
1.5 |
| SSTL2 Class I/II |
1.25 |
2.5 |
1.25 |
| AGP-2X |
1.32 |
3.3 |
N/A |
I/O Banking Structure
The XC2S200-6FGG700C features eight independent I/O banks, allowing designers to:
- Mix multiple I/O standards within a single design
- Optimize signal integrity for different voltage domains
- Support hot-swap and Compact PCI applications
Power Supply Requirements
Proper power management ensures reliable operation of the XC2S200-6FGG700C in all applications.
Voltage Specifications
| Power Rail |
Voltage |
Description |
| VCCINT |
2.5V |
Core logic supply |
| VCCO |
1.5V / 2.5V / 3.3V |
I/O output drivers (bank-specific) |
| VREF |
Variable |
Input threshold reference |
Configuration Options
The XC2S200-6FGG700C supports multiple configuration modes for maximum design flexibility.
Configuration Modes
| Mode |
Data Width |
CCLK Direction |
Bitstream Size |
| Master Serial |
1-bit |
Output |
1,335,840 bits |
| Slave Serial |
1-bit |
Input |
1,335,840 bits |
| Slave Parallel |
8-bit |
Input |
1,335,840 bits |
| Boundary Scan (JTAG) |
1-bit |
N/A |
1,335,840 bits |
Configuration Features
- IEEE 1149.1 boundary scan compliance
- Unlimited reprogrammability through SRAM-based architecture
- In-system programming capability
- Configuration readback for design verification
Typical Applications for XC2S200-6FGG700C
The high gate count and flexible architecture make the XC2S200-6FGG700C ideal for numerous applications:
Industrial and Embedded Systems
- Programmable Logic Controllers (PLCs)
- Motor control systems
- Industrial automation equipment
- Process control instrumentation
Communications Equipment
- Protocol converters and bridges
- Data encoding/decoding systems
- Channel coding implementations
- Network interface cards
Digital Signal Processing
- Audio processing systems
- Image processing applications
- Filter implementations
- Data acquisition systems
Prototyping and Development
- ASIC replacement and prototyping
- System-level integration
- Algorithm verification platforms
- Educational development boards
Development Tools and Software Support
The XC2S200-6FGG700C is fully supported by industry-standard design tools.
Xilinx ISE Design Suite
- Fully automatic mapping, placement, and routing
- Timing-driven implementation algorithms
- Comprehensive simulation support
- In-circuit debugging capabilities
Design Entry Options
- HDL synthesis (VHDL/Verilog) through third-party tools
- Schematic capture for graphical design entry
- EDIF netlist import for design portability
Ordering Information
Part Number Breakdown: XC2S200-6FGG700C
| Component |
Value |
Description |
| XC2S200 |
– |
Device type (200K system gates) |
| -6 |
– |
Speed grade (higher performance) |
| FGG |
– |
Fine-pitch BGA with Pb-free option |
| 700 |
– |
Pin count |
| C |
– |
Commercial temperature range (0°C to +85°C) |
Package Options
The Spartan-II family offers multiple packaging options to meet various design requirements:
- Pb-free (RoHS compliant) versions available with “G” suffix
- Industrial temperature range variants available for extended operating conditions
Why Choose the XC2S200-6FGG700C?
The XC2S200-6FGG700C represents an exceptional value proposition for system designers seeking:
- Cost-effective FPGA solution with professional-grade performance
- Extensive I/O flexibility with 16 supported standards
- Robust memory resources combining block and distributed RAM
- Advanced clock management through integrated DLLs
- Proven reliability backed by the Spartan-II legacy
For engineers developing embedded systems, communications equipment, or industrial controllers, the XC2S200-6FGG700C delivers the perfect combination of functionality, performance, and cost-efficiency.
Related Products and Resources
Looking for more Xilinx FPGA solutions? Explore our comprehensive catalog of Spartan, Virtex, and Artix series devices to find the perfect FPGA for your next project.
Technical Documentation
For complete specifications, pinout diagrams, and application notes, refer to:
- DS001 – Spartan-II FPGA Family Data Sheet
- XAPP176 – Spartan-II Configuration and Readback
- XAPP098 – Serial Configuration Guide
