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  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG696C: High-Performance Spartan-II FPGA for Industrial and Commercial Applications

Product Details

The XC2S200-6FGG696C is a powerful field-programmable gate array (FPGA) from the renowned Spartan-II family by AMD Xilinx. This high-density programmable logic device delivers exceptional performance for demanding digital design applications, combining 200,000 system gates with advanced architecture in a 696-ball Fine-Pitch Ball Grid Array (FBGA) package. Engineers seeking reliable, cost-effective FPGA solutions will find this device ideal for telecommunications, industrial automation, and embedded system designs.

XC2S200-6FGG696C Key Features and Specifications

The XC2S200-6FGG696C offers an impressive combination of logic resources, memory capacity, and I/O flexibility that makes it suitable for complex digital implementations.

Core Architecture Specifications

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Core Voltage 2.5V
Process Technology 0.18μm
Maximum Frequency 263 MHz

Memory Resources

Memory Type Capacity
Block RAM 56 Kbits
Distributed RAM 75,264 bits
Total RAM Bits 131,264 bits

I/O and Package Details

Feature Specification
Package Type 696-Ball Fine-Pitch BGA (FBGA)
Maximum User I/O 284
Speed Grade -6 (Highest Performance)
Temperature Range Commercial (0°C to +85°C)
RoHS Status Pb-Free Compliant

XC2S200-6FGG696C Technical Overview

Configurable Logic Block Architecture

The XC2S200-6FGG696C features a regular, flexible, programmable architecture built around Configurable Logic Blocks (CLBs). The 28 × 42 CLB array provides 1,176 total CLBs, each containing look-up tables (LUTs), flip-flops, and multiplexers. This architecture enables flexible implementation of complex digital circuits while maintaining predictable timing performance.

Delay-Locked Loop Technology

Four Delay-Locked Loops (DLLs) are positioned at each corner of the die, providing advanced clock management capabilities. These DLLs enable clock deskewing across multiple devices, making the XC2S200-6FGG696C excellent for synchronous multi-chip designs requiring precise timing alignment.

Dual-Port Block RAM

The block RAM architecture consists of two columns positioned along the vertical edges of the die. Each 4,096-bit RAM block operates as a fully synchronous dual-ported memory with independent control signals for each port. The configurable data widths allow engineers to optimize memory usage for specific application requirements.

XC2S200-6FGG696C Part Number Explanation

Understanding the part number structure helps engineers select the correct variant:

  • XC2S200: Spartan-II device with 200K system gates
  • -6: Speed grade designation (fastest available for commercial temperature)
  • FGG: Pb-free Fine-Pitch Ball Grid Array package
  • 696: 696-ball package pin count
  • C: Commercial temperature range (0°C to +85°C)

Applications for the XC2S200-6FGG696C FPGA

Telecommunications and Networking

The XC2S200-6FGG696C excels in implementing communication protocols, network routers, and data transmission interfaces. Its high-speed performance supports real-time signal processing for telecommunications infrastructure equipment.

Industrial Automation and Control

For industrial applications, this FPGA facilitates motor control systems, process automation, and machinery control. The reliable operation and reconfigurability make it ideal for factory automation and programmable logic controller replacements.

Medical Device Equipment

Medical imaging systems, diagnostic equipment, and patient monitoring devices benefit from the XC2S200-6FGG696C’s processing capabilities. Its proven reliability meets the stringent requirements of medical electronics design.

Digital Signal Processing

The combination of logic resources and embedded memory makes the XC2S200-6FGG696C suitable for DSP implementations including filtering, FFT operations, and real-time data acquisition systems.

Embedded System Design

Engineers developing embedded systems appreciate the XC2S200-6FGG696C as a superior alternative to mask-programmed ASICs. The FPGA eliminates initial NRE costs, reduces development cycles, and allows field upgrades without hardware replacement.

XC2S200-6FGG696C Development Tools and Support

Design Software Compatibility

The XC2S200-6FGG696C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can develop using VHDL or Verilog HDL with complete simulation and timing analysis tools.

Configuration Options

Multiple configuration modes support various system architectures:

  • Master Serial Mode
  • Slave Parallel Mode
  • Slave Serial Mode
  • Boundary-Scan (JTAG) Mode

I/O Standard Support

The device supports 16 selectable I/O standards, enabling seamless integration with diverse system components and voltage levels. This flexibility simplifies board-level design and reduces external component requirements.

Why Choose the XC2S200-6FGG696C for Your Design

Cost-Effective Performance

The Spartan-II family delivers high performance at competitive price points, making the XC2S200-6FGG696C ideal for high-volume production applications where both performance and cost matter.

Field Programmability

Unlike ASICs, the XC2S200-6FGG696C allows design modifications and upgrades in the field. This programmability reduces time-to-market and enables product enhancements throughout the device lifecycle.

Proven Reliability

Built on mature 0.18μm process technology, the XC2S200-6FGG696C offers proven reliability backed by comprehensive characterization data and years of field deployment experience.

Comprehensive Ecosystem

Access to development boards, IP cores, reference designs, and technical documentation accelerates design cycles and reduces engineering effort.

Order XC2S200-6FGG696C from Trusted Suppliers

For engineers seeking high-performance programmable logic solutions, the XC2S200-6FGG696C represents an excellent choice combining logic density, memory resources, and I/O capability in a single device. Explore our complete selection of Xilinx FPGA products to find the perfect component for your application requirements.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.