The XC2S200-6FGG695C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. This cost-effective programmable logic device delivers exceptional flexibility and reliability for demanding digital design applications across telecommunications, industrial automation, and consumer electronics sectors.
XC2S200-6FGG695C Key Features and Benefits
The XC2S200-6FGG695C combines advanced FPGA architecture with robust specifications that make it an ideal choice for engineers seeking a versatile programmable logic solution.
Core Architecture Specifications
The XC2S200-6FGG695C features the proven Spartan-II architecture built on cost-effective 0.18μm CMOS technology. This Xilinx FPGA delivers impressive computational resources:
- System Gates: 200,000 gates (logic and RAM combined)
- Logic Cells: 5,292 cells for complex digital implementations
- CLB Array: 28 × 42 configuration with 1,176 total Configurable Logic Blocks
- Maximum Clock Frequency: 263 MHz for high-speed operations
- Core Voltage: 2.5V for optimal power efficiency
XC2S200-6FGG695C Memory Resources
The integrated memory architecture provides flexible storage options for diverse application requirements:
- Distributed RAM: 75,264 bits using SelectRAM technology
- Block RAM: 56 Kbits organized in dedicated memory columns
- Configuration Memory: 1,335,840 bits for bitstream storage
- 16 bits per LUT: Distributed RAM capability for local data storage
Package and I/O Configuration
The XC2S200-6FGG695C utilizes a Fine-Pitch Ball Grid Array (FBGA) package with Pb-free construction:
- Package Type: 695-Ball FBGA (Fine-Pitch BGA)
- User I/O Pins: Up to 284 maximum available I/Os
- Ball Pitch: 1.0mm for reliable PCB assembly
- RoHS Compliant: Lead-free packaging option designated by “G” in part number
XC2S200-6FGG695C Technical Specifications
Electrical Characteristics
| Parameter |
Specification |
| Core Supply Voltage (VCCINT) |
2.375V to 2.625V (2.5V nominal) |
| I/O Supply Voltage (VCCO) |
1.5V, 2.5V, or 3.3V selectable |
| Operating Temperature |
0°C to +85°C (Commercial) |
| Speed Grade |
-6 (fastest commercial grade) |
| Process Technology |
0.18μm CMOS |
Clock Management Features
The XC2S200-6FGG695C includes four dedicated Delay-Locked Loops (DLLs) positioned at each corner of the die:
- Four DLLs: Advanced clock control and distribution
- Four Global Clock Networks: Low-skew primary clock distribution
- Clock Multiplication/Division: Flexible frequency synthesis
- Phase Shifting: Precise timing alignment capabilities
XC2S200-6FGG695C I/O Standards and Interface Support
Supported Single-Ended I/O Standards
The XC2S200-6FGG695C supports multiple interface voltage levels for seamless system integration:
- LVTTL (3.3V Low-Voltage TTL)
- LVCMOS (1.5V, 2.5V, 3.3V variants)
- PCI 3.3V and PCI-X compliant
- GTL and GTL+ for high-speed buses
- HSTL Class I, II, III, IV
- SSTL2 and SSTL3 for DDR memory interfaces
Advanced Interface Capabilities
- Zero Hold Time: Simplified system timing design
- Fast External RAM Interfaces: High-bandwidth memory connections
- PCI Compliant: Full PCI local bus specification support
- Hot-Swap Support: Compact PCI friendly operation
- Boundary Scan: IEEE 1149.1 JTAG compatible
XC2S200-6FGG695C Configuration Options
Multiple Configuration Modes
The XC2S200-6FGG695C supports various configuration methods to suit different system architectures:
| Mode |
Data Width |
CCLK Direction |
Description |
| Master Serial |
1-bit |
Output |
Autonomous configuration from PROM |
| Slave Serial |
1-bit |
Input |
External processor controlled |
| Slave Parallel |
8-bit |
Input |
Fast parallel loading |
| Boundary Scan |
1-bit |
N/A |
JTAG-based configuration |
Configuration Features
- Full Readback: Design verification and observability
- Unlimited Reprogrammability: Field upgradable designs
- In-System Programming: No hardware replacement required
- Preconfiguration Pull-ups: Controlled startup behavior
XC2S200-6FGG695C Application Areas
Telecommunications Equipment
The XC2S200-6FGG695C excels in telecommunications infrastructure applications including base station equipment, network switches, routers, and protocol converters. The high-speed I/O capabilities and abundant logic resources support complex signal processing algorithms.
Industrial Automation Systems
Industrial control applications benefit from the XC2S200-6FGG695C’s reliability and flexibility. Suitable implementations include motor control systems, PLC replacements, sensor interfaces, and real-time data acquisition systems.
Consumer Electronics
Cost-sensitive consumer applications leverage the XC2S200-6FGG695C for display controllers, audio/video processing, gaming peripherals, and smart device interfaces.
Automotive Electronics
The XC2S200-6FGG695C supports automotive applications including infotainment systems, ADAS sensor interfaces, and vehicle network gateways.
Why Choose XC2S200-6FGG695C Over ASICs
The XC2S200-6FGG695C offers compelling advantages compared to traditional mask-programmed ASICs:
Development Flexibility
- No NRE Costs: Eliminate expensive mask charges
- Rapid Prototyping: Immediate design iteration capability
- Field Upgradability: In-system design modifications
- Reduced Time-to-Market: Skip lengthy ASIC fabrication cycles
Risk Mitigation
- Design Flexibility: Correct bugs without hardware respins
- Future-Proofing: Adapt to changing requirements post-deployment
- Proven Architecture: Mature, well-documented design flow
- Extensive IP Library: Pre-verified design blocks available
XC2S200-6FGG695C Development Support
Design Software
The XC2S200-6FGG695C is fully supported by the Xilinx ISE Development System, providing comprehensive tools for:
- HDL synthesis and implementation
- Timing analysis and optimization
- Simulation and verification
- Configuration file generation
Available IP Cores
Accelerate your development with pre-verified intellectual property cores including processors, memory controllers, communication protocols, and DSP functions.
XC2S200-6FGG695C Ordering Information
Part Number Breakdown
XC2S200-6FGG695C decodes as follows:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (fastest commercial option)
- FGG: Fine-pitch BGA package with Pb-free construction
- 695: Ball count designation
- C: Commercial temperature range (0°C to +85°C)
Package Options in Spartan-II Family
The XC2S200 device is available in multiple package configurations to match various board design requirements and I/O density needs.
XC2S200-6FGG695C Quality and Compliance
Environmental Compliance
- RoHS Directive: Fully compliant with lead-free requirements
- REACH Regulation: Meets European chemical safety standards
- Moisture Sensitivity: Appropriate MSL rating for manufacturing
Quality Certifications
- ISO 9001 certified manufacturing processes
- Automotive grade options available for qualified applications
- Full traceability and documentation
Conclusion
The XC2S200-6FGG695C Spartan-II FPGA represents an excellent balance of performance, flexibility, and cost-effectiveness for digital design projects. With 200,000 system gates, 5,292 logic cells, and comprehensive I/O support, this programmable logic device enables engineers to implement complex designs while maintaining competitive system costs. The proven 0.18μm architecture, extensive development tool support, and field-upgradable design capability make the XC2S200-6FGG695C an ideal choice for telecommunications, industrial, consumer, and automotive applications requiring reliable, high-performance programmable logic solutions.
