The XC2S200-6FGG692C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx Spartan-II family. This powerful programmable logic device delivers exceptional flexibility, reliability, and cost-effectiveness for demanding digital design applications. With 200,000 system gates, advanced clock management, and comprehensive I/O capabilities, the XC2S200-6FGG692C serves as an ideal solution for engineers seeking a superior alternative to traditional mask-programmed ASICs.

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XC2S200-6FGG692C Key Features and Specifications

The XC2S200-6FGG692C combines cutting-edge FPGA architecture with robust performance capabilities, making it suitable for a wide range of industrial, commercial, and telecommunications applications.

Technical Specifications Overview

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XC2S200-6FGG692C Architecture and Design

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG692C features a sophisticated CLB architecture based on proven Virtex FPGA technology. Each CLB contains four Logic Cells (LCs) organized into two identical slices, providing:

• 4-input Look-Up Tables (LUTs) for implementing any Boolean function
• Dedicated carry logic for high-speed arithmetic operations
• Storage elements configurable as edge-triggered D-type flip-flops or level-sensitive latches
• F5 and F6 multiplexers for implementing functions of up to 19 inputs
• Cascade chains for wide-input functions

Block RAM Memory Architecture

The XC2S200-6FGG692C integrates 14 dedicated block RAM modules, each providing 4,096 bits of synchronous dual-port memory. Key block RAM features include:

• Fully synchronous dual-port operation with independent control signals
• Configurable aspect ratios: 4096×1, 2048×2, 1024×4, 512×8, or 256×16
• Built-in bus-width conversion capability
• Dedicated routing for efficient CLB interface

Distributed RAM Capabilities

Beyond block RAM, the XC2S200-6FGG692C offers 75,264 bits of distributed RAM implemented within the CLB structure:

• 16-bit shift registers for capturing high-speed or burst-mode data
• 16×1-bit synchronous RAM per LUT
• Dual-port RAM configurations using paired LUTs

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Advanced Clock Management with DLL Technology

Delay-Locked Loop (DLL) Features

The XC2S200-6FGG692C includes four fully digital Delay-Locked Loops (DLLs), one at each corner of the die, providing sophisticated clock management:

• Zero propagation delay through automatic delay compensation
• Low clock skew across the entire device
• Clock multiplication (2×) for internal frequency doubling
• Clock division by 1.5, 2, 2.5, 3, 4, 5, 8, or 16
• Four quadrature phase outputs (0°, 90°, 180°, 270°)
• Clock mirroring for board-level clock deskewing

Global Clock Distribution Network

Four dedicated global clock networks ensure minimal skew distribution:

• Primary global routing with dedicated input pins
• Low-skew clock distribution to all CLB, IOB, and block RAM clock pins
• Secondary global routing with 24 backbone lines for additional flexibility

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Versatile I/O Standards Support

Supported Interface Standards

The XC2S200-6FGG692C supports 16 high-performance I/O standards through programmable IOBs:

I/O Block Features

Each Input/Output Block (IOB) provides comprehensive interface capabilities:

• Three registers per IOB (input, output, and 3-state control)
• Programmable slew rate control to minimize bus transients
• Selectable drive strength up to 24mA source / 48mA sink
• Optional pull-up/pull-down resistors
• Weak-keeper circuit for bus hold functionality
• 5V tolerance on LVTTL, LVCMOS2, and PCI inputs
• ESD protection on all pads

I/O Banking Structure

The XC2S200-6FGG692C organizes its I/O pins into eight independent banks:

• Flexible VCCO configuration per bank
• Shared VREF within each bank for referenced input standards
• Mixed-standard support following compatibility rules

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XC2S200-6FGG692C Configuration Options

Supported Configuration Modes

Configuration Specifications

• Configuration file size: 1,335,840 bits
• Maximum CCLK frequency: 66 MHz
• Slave Parallel (no handshake): 50 MHz maximum
• Unlimited reprogramming cycles
• In-system reconfiguration capability
• Readback support for verification and debugging

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IEEE 1149.1 Boundary-Scan Support

The XC2S200-6FGG692C provides full IEEE 1149.1 (JTAG) compliance:

Supported JTAG Instructions

• EXTEST: Boundary-scan external test
• SAMPLE/PRELOAD: Sample I/O states
• BYPASS: Single-bit bypass register
• IDCODE: Device identification
• CFG_IN/CFG_OUT: Configuration and readback access
• USERCODE: Custom user codes
• INTEST: Internal test capability

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XC2S200-6FGG692C Part Number Breakdown

Understanding the XC2S200-6FGG692C ordering code:

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XC2S200-6FGG692C Applications

The XC2S200-6FGG692C is optimized for diverse application domains:

Industrial and Automation

• Motor control systems leveraging high-speed I/O
• Process automation with custom logic implementations
• Programmable logic controllers (PLC) replacement
• Machine vision preprocessing

Telecommunications

• Protocol conversion and bridging
• Data framing and formatting
• Channel encoding/decoding
• Switch fabric implementations

Consumer Electronics

• Display controllers and video processing
• Audio processing systems
• Interface bridging between protocols

Automotive Systems

• ADAS preprocessing logic
• Infotainment system interfaces
• Sensor fusion implementations

Prototyping and Development

• ASIC emulation and verification
• Rapid prototyping of digital systems
• Educational platform for digital design

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Design Resources and Development Tools

Software Support

The XC2S200-6FGG692C is fully supported by Xilinx ISE Design Suite:

• Automatic mapping, placement, and routing
• Timing-driven implementation algorithms
• Static timing analysis tools
• In-circuit debugging with readback capability
• BSDL files for boundary-scan testing

Documentation Available

• Complete datasheet (DS001) with all specifications
• Application notes for specific design implementations
• IBIS models for signal integrity analysis
• Package drawings and pinout tables

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Why Choose XC2S200-6FGG692C Over ASICs?

The XC2S200-6FGG692C offers significant advantages compared to mask-programmed ASICs:

Development Benefits

• Zero NRE costs: No mask charges or upfront tooling fees
• Rapid time-to-market: Compress development cycles
• Risk mitigation: Verify designs before committing to silicon
• Design flexibility: Make changes without hardware replacement

Operational Advantages

• Field upgradability: Update functionality post-deployment
• Inventory flexibility: Single part supports multiple designs
• Lower minimum quantities: Economical for low-to-medium volumes
• Future-proof designs: Adapt to evolving requirements

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Related Xilinx Spartan-II Family Devices

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Order XC2S200-6FGG692C Today

The XC2S200-6FGG692C delivers proven Spartan-II performance with 200,000 system gates, comprehensive memory resources, advanced clock management, and versatile I/O capabilities. This Pb-free, RoHS-compliant device represents an excellent choice for engineers seeking reliable programmable logic solutions.

For more information about Xilinx FPGA products and technical specifications, contact your authorized distributor or visit the manufacturer’s documentation portal.