The XC2S200-6FGG689C is a high-performance Field Programmable Gate Array (FPGA) from the Xilinx FPGA Spartan-II family, manufactured by AMD (formerly Xilinx). This advanced programmable logic device delivers exceptional performance for industrial, telecommunications, and embedded system applications requiring flexible, cost-effective digital design solutions.

XC2S200-6FGG689C Key Features and Specifications

The XC2S200-6FGG689C combines powerful logic resources with high-speed performance in a reliable BGA package configuration. This FPGA offers engineers substantial design flexibility while maintaining cost efficiency for volume production.

Technical Specifications Table

XC2S200-6FGG689C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG689C features a robust CLB architecture with 1,176 total blocks arranged in a 28 × 42 array. Each CLB contains four logic cells (LCs), providing substantial computational resources for complex digital designs.

CLB capabilities include:

• 4-input look-up tables (LUTs) for function generation
• Dedicated carry logic for high-speed arithmetic operations
• Efficient multiplier support
• Cascade chains for wide-input functions
• Edge-triggered D-type flip-flops or level-sensitive latches

Block RAM Memory Resources

The XC2S200-6FGG689C integrates 56 Kbits of dedicated block RAM organized in 14 memory blocks. Each 4,096-bit block operates as a fully synchronous dual-port RAM with independent control signals for each port.

Block RAM features:

• Configurable data widths: 1, 2, 4, 8, or 16 bits
• Built-in bus-width conversion
• Independent read/write clocks
• Synchronous operation for reliable timing

Distributed RAM Capabilities

Beyond block RAM, the XC2S200-6FGG689C provides 75,264 bits of distributed RAM implemented within the LUTs. This distributed memory architecture enables designers to implement small, fast memory structures close to the logic that requires them.

XC2S200-6FGG689C I/O Standards and Interface Support

Supported I/O Standards

The XC2S200-6FGG689C supports 16 high-performance I/O signaling standards, making it highly versatile for diverse system integration requirements:

• LVTTL (2-24 mA drive strength)
• LVCMOS2 (2.5V CMOS)
• PCI (3V/5V, 33 MHz/66 MHz compliant)
• GTL and GTL+
• HSTL Class I, III, IV
• SSTL2 Class I and II
• SSTL3 Class I and II
• CTT
• AGP-2X

I/O Banking Structure

The device organizes I/Os into eight independent banks, allowing designers to use multiple I/O standards simultaneously within a single design while maintaining signal integrity requirements.

XC2S200-6FGG689C Clock Management

Delay-Locked Loop (DLL) Features

The XC2S200-6FGG689C includes four dedicated Delay-Locked Loops (DLLs) positioned at each corner of the die. These DLLs provide advanced clock management capabilities essential for high-performance digital designs.

DLL capabilities:

• Zero propagation delay clock distribution
• Clock multiplication (2×)
• Clock division (÷1.5, 2, 2.5, 3, 4, 5, 8, 16)
• Four quadrature phase outputs (0°, 90°, 180°, 270°)
• Board-level clock deskewing via clock mirroring
• Automatic lock detection with LOCKED output signal

Global Clock Distribution Network

Four primary global clock networks provide low-skew clock distribution to all CLB, IOB, and block RAM clock pins throughout the device. This dedicated routing ensures consistent timing across the entire FPGA fabric.

XC2S200-6FGG689C Configuration Options

Configuration Modes

The XC2S200-6FGG689C supports multiple configuration modes for flexible system integration:

Configuration File Size

The XC2S200-6FGG689C requires a 1,335,840-bit configuration bitstream. This can be stored in serial PROMs, parallel flash, or delivered from microcontrollers and processors.

XC2S200-6FGG689C Speed Grade -6 Performance

The -6 speed grade designation indicates higher performance operation within the Spartan-II family. This speed grade is exclusively available in the commercial temperature range (0°C to +85°C) and delivers:

• System clock rates up to 200 MHz
• Optimized timing for performance-critical applications
• Fast carry logic propagation delays
• Low clock-to-output times on IOBs

XC2S200-6FGG689C Applications

The XC2S200-6FGG689C serves diverse applications across multiple industries:

Telecommunications

• Network interface controllers
• Protocol converters and bridges
• SDH/SONET framing
• Digital signal processing subsystems

Industrial Automation

• Motor control systems
• PLC replacement and augmentation
• Sensor interface and data aggregation
• Real-time control algorithms

Consumer Electronics

• Video processing and display controllers
• Audio codec interfaces
• USB and peripheral controllers
• Set-top box logic

Embedded Systems

• ASIC prototyping and replacement
• Coprocessor implementations
• Custom peripheral development
• Glue logic consolidation

XC2S200-6FGG689C FGG689 Package Information

Package Characteristics

The FGG689 package is a Fine-pitch Ball Grid Array (FBGA) with Pb-free solder balls compliant with RoHS directives. The “G” in the part number suffix indicates lead-free packaging.

Package specifications:

• Ball pitch: 1.0 mm
• Package dimensions: Refer to package drawing
• Moisture sensitivity level: MSL 3
• Pb-free reflow compatible

Pin Categories

The XC2S200-6FGG689C package pins are organized into several functional categories:

• User I/O pins: Up to 284 available for design use
• Global clock inputs: 4 dedicated clock pins (GCLK0-3)
• Configuration pins: Mode, CCLK, PROGRAM, DONE, INIT
• JTAG/Boundary-scan: TDI, TDO, TMS, TCK
• Power supplies: VCC_INT (2.5V), VCC_O (I/O banks), GND

XC2S200-6FGG689C Design Tools and Support

Development Environment

The XC2S200-6FGG689C is fully supported by Xilinx ISE Design Suite, providing:

• Schematic and HDL-based design entry
• Automatic mapping, placement, and routing
• Comprehensive timing analysis
• In-circuit debugging capabilities
• Bitstream generation and download

Design Resources

Engineers working with the XC2S200-6FGG689C have access to:

• Complete datasheet (DS001) with electrical specifications
• Package pinout tables and footprint drawings
• Application notes and design examples
• IP cores and reference designs
• Online technical forums and support

XC2S200-6FGG689C Ordering Information

Part Number Breakdown

XC2S200-6FGG689C decodes as follows:

Why Choose the XC2S200-6FGG689C Spartan-II FPGA?

The XC2S200-6FGG689C offers compelling advantages for design engineers:

1. Cost-Effective Performance: Delivers high gate density at competitive pricing for volume applications
2. Proven Architecture: Based on the reliable Virtex architecture with streamlined features
3. Flexible I/O: Supports 16 interface standards for seamless system integration
4. Abundant Resources: 5,292 logic cells, 56K block RAM, and four DLLs
5. Field Upgradeable: Unlimited reprogramming cycles enable in-field updates
6. Industry Compliance: Full PCI compliance, IEEE 1149.1 boundary-scan support
7. RoHS Compliant: Pb-free packaging meets environmental regulations

Conclusion

The XC2S200-6FGG689C represents an excellent choice for engineers seeking a high-performance, cost-effective FPGA solution. With its substantial logic resources, flexible I/O capabilities, advanced clock management features, and proven reliability, this Spartan-II device addresses demanding application requirements across telecommunications, industrial, consumer, and embedded markets.

For additional technical specifications, design resources, and application support for the XC2S200-6FGG689C and other Spartan-II family devices, consult the official AMD/Xilinx documentation and authorized distributors.