Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG688C: High-Performance Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG688C is a powerful Field Programmable Gate Array (FPGA) from the renowned Xilinx FPGA Spartan-II family. This versatile programmable logic device delivers exceptional performance for high-volume, cost-sensitive electronic applications requiring reliable digital processing capabilities.

XC2S200-6FGG688C Key Features and Specifications

The XC2S200-6FGG688C combines advanced programmable logic architecture with cost-effective implementation, making it an ideal solution for engineers seeking robust FPGA capabilities.

Core Technical Specifications

Parameter Specification
Device Family Spartan-II FPGA
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Maximum User I/O 284
Package Type 688-Pin Fine Pitch BGA (FGG688)
Speed Grade -6 (High Performance)
Core Voltage 2.5V
Process Technology 0.18μm CMOS
Operating Frequency Up to 263MHz
Temperature Range Commercial (0°C to +85°C)
RoHS Status Pb-free (Lead-free) Compliant

Memory Architecture of the XC2S200-6FGG688C

The XC2S200-6FGG688C features a hierarchical SelectRAM memory system that provides flexible storage options for diverse applications.

Block RAM Specifications

  • Total Block RAM: 56K bits
  • Memory Blocks: 14 blocks
  • Each Block: 4,096 bits (4K)
  • Configuration: Fully synchronous dual-ported RAM
  • Independent Control: Separate signals for each port
  • Flexible Width: Built-in bus-width conversion

Distributed RAM Capabilities

  • Total Distributed RAM: 75,264 bits
  • Implementation: 16 bits per Look-Up Table (LUT)
  • Support for: 16×1-bit or 32×1-bit synchronous RAM configurations
  • Dual-port: 16×1-bit dual-port synchronous RAM option

Why Choose the XC2S200-6FGG688C FPGA?

Superior Alternative to ASICs

The Spartan-II XC2S200-6FGG688C represents a superior alternative to mask-programmed Application-Specific Integrated Circuits (ASICs). This FPGA eliminates the substantial initial costs, lengthy development cycles, and inherent risks associated with conventional ASIC development.

Unlimited Reprogrammability

Unlike ASICs, the XC2S200-6FGG688C offers unlimited in-system reprogrammability. This capability enables design upgrades in the field without hardware replacement, providing unmatched flexibility throughout the product lifecycle.

High-Speed Performance

With the -6 speed grade designation, the XC2S200-6FGG688C delivers higher performance than standard grades, supporting system clock rates up to 200MHz for demanding applications.

XC2S200-6FGG688C Architecture Overview

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG688C architecture centers on 1,176 Configurable Logic Blocks arranged in a 28 x 42 array. Each CLB contains four logic cells organized in two identical slices, featuring:

  • 4-input function generators (Look-Up Tables)
  • Carry logic for high-speed arithmetic
  • Storage elements configurable as flip-flops or latches
  • F5 and F6 multiplexers for wide input functions
  • Dedicated 3-state drivers (BUFTs)

Input/Output Block (IOB) Features

The XC2S200-6FGG688C provides versatile I/O capabilities with support for 16 industry-standard interfaces:

  • LVTTL (2-24mA drive strength)
  • LVCMOS2
  • PCI (3V/5V, 33MHz/66MHz compliant)
  • GTL and GTL+
  • HSTL Class I, III, IV
  • SSTL2 and SSTL3 Class I/II
  • CTT
  • AGP-2X

Delay-Locked Loop (DLL) Technology

The XC2S200-6FGG688C incorporates four fully digital Delay-Locked Loops for advanced clock management:

  • Zero propagation delay clock distribution
  • Low clock skew across all outputs
  • Clock multiplication (2X)
  • Clock division (1.5, 2, 2.5, 3, 4, 5, 8, or 16)
  • Four quadrature phase outputs
  • Board-level clock deskewing capability

XC2S200-6FGG688C Applications

Industrial Automation and Control

The XC2S200-6FGG688C excels in industrial automation applications requiring reliable, high-speed digital processing with deterministic timing characteristics.

Telecommunications Equipment

This FPGA supports telecommunications infrastructure with its high-speed I/O interfaces and flexible protocol implementation capabilities.

Consumer Electronics

Cost-sensitive consumer electronic applications benefit from the XC2S200-6FGG688C’s balance of performance, features, and competitive pricing.

Digital Signal Processing (DSP)

The dedicated carry logic and arithmetic resources make the XC2S200-6FGG688C suitable for implementing efficient multipliers and DSP algorithms.

Prototyping and Development

Engineers frequently choose the XC2S200-6FGG688C for rapid prototyping, enabling quick design iterations before committing to production.

XC2S200-6FGG688C Configuration Options

The XC2S200-6FGG688C supports multiple configuration modes for flexible system integration:

Serial Configuration Modes

  • Master Serial Mode: FPGA controls configuration using internal oscillator
  • Slave Serial Mode: External controller drives configuration clock

Parallel Configuration Mode

  • Slave Parallel Mode: Fastest configuration option with byte-wide data loading

Boundary Scan Configuration

  • IEEE 1149.1 compliant JTAG interface
  • Configuration through Test Access Port (TAP)
  • Supports EXTEST, SAMPLE/PRELOAD, and BYPASS instructions

Configuration File Size

The XC2S200-6FGG688C requires 1,335,840 bits (approximately 163KB) of configuration data storage.

Development Tools for XC2S200-6FGG688C

Xilinx ISE Design Suite

The XC2S200-6FGG688C is fully supported by the Xilinx ISE development environment, offering:

  • Automatic mapping, placement, and routing
  • Timing-driven implementation
  • Library of over 400 primitives and macros
  • HDL design entry support
  • Static timing analysis
  • In-circuit debugging capabilities

Design Entry Options

Engineers can utilize multiple design entry methods:

  • VHDL and Verilog HDL synthesis
  • Schematic capture
  • EDIF netlist import
  • Mixed hierarchical designs

XC2S200-6FGG688C Package Information

FGG688 Package Details

The 688-pin Fine Pitch Ball Grid Array (FGG688) package provides:

  • Pb-free (Lead-free) construction indicated by “G” suffix
  • High pin count for maximum I/O utilization
  • Excellent thermal characteristics
  • Reliable solder joint formation

Pin Configuration

  • 284 Maximum User I/O pins
  • Four dedicated global clock input pins
  • Dedicated configuration pins
  • JTAG boundary scan interface

Ordering Information for XC2S200-6FGG688C

Part Number Breakdown

  • XC2S200: Device type (Spartan-II, 200K system gates)
  • -6: Speed grade (higher performance)
  • FGG: Package type (Fine Pitch BGA, Pb-free)
  • 688: Pin count
  • C: Temperature range (Commercial: 0°C to +85°C)

XC2S200-6FGG688C Technical Support Resources

Documentation

  • Complete datasheet (DS001)
  • Application notes for configuration and design
  • Pinout tables and package drawings
  • Timing specifications

Design Resources

  • Reference designs
  • IP cores
  • Development boards
  • Technical support forums

Conclusion: XC2S200-6FGG688C Performance Summary

The XC2S200-6FGG688C delivers a compelling combination of 200,000 system gates, 5,292 logic cells, 56K bits of block RAM, and 284 user I/O pins in a Pb-free 688-pin BGA package. With its -6 speed grade offering enhanced performance up to 263MHz, four DLLs for clock management, and support for 16 I/O standards, this Spartan-II FPGA provides engineers with a proven, cost-effective solution for industrial, telecommunications, and consumer applications.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.