The XC2S200-6FGG686C is a high-performance Field Programmable Gate Array from the AMD/Xilinx Spartan-II FPGA family. Designed for cost-sensitive, high-volume applications, this 200,000 system gate FPGA delivers exceptional flexibility, advanced I/O capabilities, and robust embedded memory resources in a 686-pin Fine-Pitch Ball Grid Array (FBGA) package.
XC2S200-6FGG686C Overview
The XC2S200-6FGG686C belongs to the second-generation ASIC replacement technology platform. This Xilinx FPGA offers unlimited reprogrammability through SRAM-based configuration, making it ideal for applications requiring in-field upgrades without hardware replacement.
Built on a cost-effective 0.18-micron CMOS process technology, the XC2S200-6FGG686C features a streamlined architecture derived from the Virtex FPGA platform while maintaining an aggressive price point for volume production.
Key Features of XC2S200-6FGG686C
Logic Resources and System Capacity
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 CLBs) |
| Maximum User I/O |
284 |
| Speed Grade |
-6 (Higher Performance) |
| Package Type |
686-Pin FBGA (Pb-Free) |
Embedded Memory Architecture
The XC2S200-6FGG686C integrates a powerful hierarchical SelectRAM memory system:
- Block RAM: 56 Kbits total (14 blocks × 4,096 bits each)
- Distributed RAM: 75,264 bits (16 bits per LUT)
- Dual-Port RAM: Fully synchronous with independent control signals
- Configurable Aspect Ratios: 4096×1, 2048×2, 1024×4, 512×8, or 256×16
Advanced Clock Management
The XC2S200-6FGG686C incorporates four dedicated Delay-Locked Loops (DLLs):
- Zero propagation delay clock distribution
- Clock multiplication (2×) and division (up to 16×)
- Four quadrature phase outputs (0°, 90°, 180°, 270°)
- System clock rates up to 200 MHz
- Low-skew global clock routing network
XC2S200-6FGG686C I/O Capabilities
Supported I/O Standards
The XC2S200-6FGG686C supports 16 high-performance interface standards:
| Standard |
VREF (V) |
VCCO (V) |
VTT (V) |
| LVTTL (2-24 mA) |
N/A |
3.3 |
N/A |
| LVCMOS2 |
N/A |
2.5 |
N/A |
| PCI (3V/5V, 33/66 MHz) |
N/A |
3.3 |
N/A |
| GTL |
0.8 |
N/A |
1.2 |
| GTL+ |
1.0 |
N/A |
1.5 |
| HSTL Class I |
0.75 |
1.5 |
0.75 |
| HSTL Class III/IV |
0.9 |
1.5 |
1.5 |
| SSTL3 Class I/II |
1.5 |
3.3 |
1.5 |
| SSTL2 Class I/II |
1.25 |
2.5 |
1.25 |
| CTT |
1.5 |
3.3 |
1.5 |
| AGP-2X |
1.32 |
3.3 |
N/A |
I/O Banking Structure
The XC2S200-6FGG686C features eight independent I/O banks with dedicated VCCO and VREF pins, enabling mixed-voltage interfacing within a single device.
XC2S200-6FGG686C Electrical Specifications
Power Supply Requirements
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V |
| Operating Temperature |
0°C to +85°C (Commercial) |
Configuration Options
| Mode |
Data Width |
CCLK Direction |
| Master Serial |
1-bit |
Output |
| Slave Serial |
1-bit |
Input |
| Slave Parallel |
8-bit |
Input |
| Boundary Scan (JTAG) |
1-bit |
N/A |
Configuration File Size: 1,335,840 bits
XC2S200-6FGG686C Applications
The XC2S200-6FGG686C excels in diverse application domains:
Telecommunications and Networking
- Protocol conversion and bridging
- Network interface controllers
- Channel aggregation systems
Industrial Automation
- Motor control systems
- Process automation
- Real-time signal processing
Consumer Electronics
- Video processing pipelines
- Audio codec implementation
- Display controllers
Embedded Systems
- Custom peripheral interfaces
- Hardware acceleration
- System-on-Chip prototyping
Development Tools for XC2S200-6FGG686C
Xilinx ISE Design Suite
The XC2S200-6FGG686C is fully supported by the Xilinx ISE development environment featuring:
- Automatic mapping, placement, and routing
- Timing-driven implementation
- HDL synthesis integration (VHDL/Verilog)
- In-circuit debugging capabilities
- EDIF netlist support
Design Resources
- Over 400 library primitives and macros
- Hierarchical design entry support
- Post-layout timing analysis
- Comprehensive simulation models
XC2S200-6FGG686C Part Number Breakdown
| Code |
Description |
| XC2S |
Spartan-II Family |
| 200 |
200K System Gates |
| -6 |
Higher Performance Speed Grade |
| FGG |
Fine-Pitch BGA, Pb-Free |
| 686 |
686-Pin Package |
| C |
Commercial Temperature (0°C to +85°C) |
Why Choose XC2S200-6FGG686C?
The XC2S200-6FGG686C offers compelling advantages for your next design:
- Cost-Effective Performance: Optimized 0.18μm process delivers excellent price-performance ratio
- Flexible Memory: Hierarchical RAM architecture supports diverse data storage needs
- Advanced Clocking: Four DLLs enable sophisticated clock management schemes
- Versatile I/O: 16 interface standards ensure broad system compatibility
- Unlimited Reprogrammability: SRAM-based configuration allows field updates
- Proven Architecture: Based on the reliable Virtex FPGA platform
Technical Documentation
For complete specifications including pinout tables, timing parameters, and application notes, refer to the official Spartan-II FPGA Family Data Sheet (DS001).
Ordering Information:
- Part Number: XC2S200-6FGG686C
- Package: 686-Ball Fine-Pitch BGA (Pb-Free)
- Speed Grade: -6
- Temperature Range: Commercial (0°C to +85°C)
