Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG685C: High-Performance Spartan-II FPGA for Industrial and Commercial Applications

Product Details

The XC2S200-6FGG685C is a powerful field-programmable gate array (FPGA) from Xilinx’s renowned Spartan-II family. This high-density programmable logic device delivers exceptional performance, making it an ideal solution for demanding digital signal processing, embedded systems, and industrial control applications. With 200,000 system gates and advanced memory architecture, the XC2S200-6FGG685C offers engineers unmatched flexibility and cost-effectiveness for both prototyping and production environments.


XC2S200-6FGG685C Technical Specifications

The XC2S200-6FGG685C combines industry-leading specifications with reliable performance. Below is a comprehensive overview of this Xilinx FPGA device’s technical parameters.

Core Architecture and Logic Resources

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Configuration Bits 1,335,840

Memory Configuration

Memory Type Capacity
Block RAM 56 Kbits
Distributed RAM 75,264 bits
Block RAM Columns 2

Electrical and Operating Specifications

Parameter Value
Core Voltage 2.5V
Process Technology 0.18µm
Speed Grade -6 (Highest Performance)
Temperature Range Commercial (0°C to +85°C)
Package Type 685-Ball Fine-Pitch BGA
RoHS Compliance Pb-Free (Lead-Free)

XC2S200-6FGG685C Key Features and Benefits

Advanced Delay-Locked Loop (DLL) Technology

The XC2S200-6FGG685C integrates four Delay-Locked Loops (DLLs), one positioned at each corner of the die. These DLLs provide precise clock management capabilities, including clock multiplication, division, and phase shifting. This advanced clocking architecture ensures optimal system synchronization and reduces clock skew across complex digital designs.

Flexible I/O Standards Support

This Spartan-II FPGA supports 16 selectable I/O standards, enabling seamless integration with diverse system components and interfaces. Engineers can configure I/O banks to match specific voltage and signaling requirements, maximizing design flexibility and system compatibility.

Dual-Port Block RAM Architecture

The XC2S200-6FGG685C features fully synchronous dual-ported 4096-bit RAM blocks with independent control signals for each port. This architecture supports configurable data widths, enabling efficient data storage, buffering, and memory-intensive operations essential for DSP applications.

High-Speed Interconnect Hierarchy

A powerful hierarchy of versatile routing channels interconnects all functional elements. This fast, predictable interconnect ensures that successive design iterations continue to meet timing requirements without extensive manual optimization.


XC2S200-6FGG685C Applications

Industrial Control Systems

The XC2S200-6FGG685C excels in programmable logic controller (PLC) designs, motor drive systems, and factory automation equipment. Its robust architecture handles real-time control algorithms with deterministic timing performance.

Telecommunications and Networking Equipment

This FPGA is ideal for routers, switches, protocol converters, and base station infrastructure. The high I/O count and flexible memory configuration support complex data path implementations and multi-channel processing.

Digital Signal Processing (DSP)

With abundant logic resources and block RAM, the XC2S200-6FGG685C efficiently implements FIR filters, FFT processors, and other DSP algorithms. The distributed RAM provides additional storage for coefficient tables and intermediate calculations.

Embedded Systems and Prototyping

Engineers leverage this device for rapid prototyping, ASIC emulation, and custom embedded processor implementations. The programmable nature eliminates lengthy ASIC development cycles while enabling field-upgradable designs.

Medical and Scientific Instrumentation

Precision measurement systems, data acquisition platforms, and laboratory instruments benefit from the XC2S200-6FGG685C’s reliable performance and comprehensive I/O capabilities.


XC2S200-6FGG685C Package Information

FGG685 Fine-Pitch Ball Grid Array Details

The FGG685 package designation indicates a 685-ball Fine-Pitch Ball Grid Array with Pb-free (lead-free) construction. The “G” suffix denotes RoHS-compliant, environmentally responsible manufacturing that eliminates hazardous substances including lead, mercury, and cadmium.

Package Characteristics

  • Ball Count: 685 balls
  • Ball Pitch: 1.0mm fine-pitch configuration
  • Mounting Type: Surface mount BGA
  • Thermal Performance: Optimized for efficient heat dissipation
  • Signal Integrity: Superior electrical characteristics with minimal inductance

XC2S200-6FGG685C Part Number Decoder

Understanding the part number structure helps engineers specify the correct device variant:

Code Element Meaning
XC2S Spartan-II Family Identifier
200 200,000 System Gates
-6 Speed Grade (Fastest in Commercial Range)
FG Fine-Pitch Ball Grid Array Package
G Pb-Free (RoHS Compliant)
685 Pin Count
C Commercial Temperature Range

Configuration Modes for XC2S200-6FGG685C

The XC2S200-6FGG685C supports multiple configuration modes for flexible system integration:

Master Serial Mode

The FPGA actively reads configuration data from external serial PROM devices, generating its own configuration clock. This mode is ideal for standalone operation without external processor control.

Slave Serial Mode

An external controller provides both configuration data and clock signals. This mode suits systems where a microprocessor or microcontroller manages FPGA initialization.

Slave Parallel Mode

Eight-bit parallel data transfer accelerates configuration time for applications requiring rapid startup. An external master provides data and clock signals.

Boundary-Scan Mode

JTAG-based configuration enables in-system programming and debugging through standard boundary-scan interfaces. This mode facilitates production testing and field updates.


Development Tools and Design Resources

Xilinx ISE Design Suite Compatibility

The XC2S200-6FGG685C is fully supported by Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can develop using VHDL, Verilog, or schematic capture methodologies.

Available Documentation

  • Complete datasheet with DC and AC timing specifications
  • Package pinout diagrams and thermal design guidelines
  • Application notes covering common design patterns
  • Reference designs for rapid development acceleration

IP Core Ecosystem

A rich library of pre-verified intellectual property cores expands XC2S200-6FGG685C functionality. Available cores include soft processors, memory controllers, communication interfaces, and DSP building blocks.


Why Choose XC2S200-6FGG685C for Your Design?

Cost-Effective ASIC Alternative

The XC2S200-6FGG685C eliminates expensive mask charges, lengthy development cycles, and inventory risks associated with traditional ASIC development. Design changes can be implemented quickly without hardware modifications.

Field-Upgradable Flexibility

Unlike mask-programmed devices, the XC2S200-6FGG685C enables in-field firmware updates. This capability extends product lifecycles, fixes bugs post-deployment, and adds new features without hardware recalls.

Proven Reliability

The Spartan-II architecture has demonstrated exceptional reliability across millions of deployed units. Xilinx’s stringent quality processes ensure consistent performance throughout the product’s operational lifetime.

Global Support Infrastructure

Comprehensive technical support, extensive documentation, authorized distribution network, and active engineering community provide resources for successful project completion.


XC2S200-6FGG685C Ordering Information

When specifying the XC2S200-6FGG685C for procurement, verify the complete part number matches your design requirements. Contact authorized distributors for current pricing, lead times, and volume discount availability. Educational and research institutions may qualify for special pricing programs.


Conclusion

The XC2S200-6FGG685C represents an excellent choice for engineers seeking a reliable, high-performance FPGA solution. With 200,000 system gates, 56 Kbits of block RAM, four DLLs, and comprehensive I/O capabilities in a RoHS-compliant package, this Spartan-II device delivers the resources needed for complex digital designs. Whether developing industrial control systems, telecommunications equipment, DSP applications, or embedded systems, the XC2S200-6FGG685C provides the flexibility, performance, and cost-effectiveness that modern electronic designs demand.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.