The XC2S200-6FGG684C is a high-performance Field Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. This cost-effective programmable logic device delivers exceptional functionality for industrial automation, telecommunications, and embedded system applications. Engineers and designers seeking a reliable ASIC alternative will find the XC2S200-6FGG684C offers unmatched flexibility with 200,000 system gates and comprehensive I/O capabilities.
XC2S200-6FGG684C Key Features and Benefits
The XC2S200-6FGG684C combines advanced programmable architecture with industry-leading reliability. This Xilinx FPGA solution eliminates lengthy development cycles associated with traditional ASICs while providing unlimited in-system reprogrammability.
Core Architecture Advantages
The Spartan-II architecture delivers several compelling benefits for system designers. The XC2S200-6FGG684C features a regular, flexible programmable structure built around Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs). Four Delay-Locked Loops (DLLs) positioned at each corner of the die ensure precise clock management and timing optimization.
Why Choose XC2S200-6FGG684C for Your Design
- Superior ASIC replacement technology with faster time-to-market
- Field-upgradeable without hardware replacement
- Proven 0.18-micron CMOS manufacturing process
- Commercial temperature range operation
- Pb-free (RoHS compliant) BGA packaging option
XC2S200-6FGG684C Technical Specifications
Device Parameters Overview
| Parameter |
Specification |
| Family |
Spartan-II |
| Manufacturer |
Xilinx (AMD) |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 (1,176 CLBs) |
| Maximum User I/O |
284 |
| Block RAM |
56 Kbits |
| Distributed RAM |
75,264 bits |
| Delay-Locked Loops (DLLs) |
4 |
| Speed Grade |
-6 (Fastest Commercial) |
| Package Type |
684-Pin Fine-Pitch BGA |
| Core Voltage |
2.5V |
| Process Technology |
0.18μm CMOS |
| Temperature Range |
Commercial (0°C to +85°C) |
Detailed Logic Resources
| Resource Type |
Quantity |
Description |
| Configurable Logic Blocks |
1,176 |
Primary logic implementation units |
| 4-Input LUTs |
4,704 |
Function generators for combinational logic |
| Flip-Flops |
4,704 |
Sequential element storage |
| Block RAM Columns |
2 |
Dual-port synchronous memory |
| Block RAM Cells |
14 |
4,096-bit each, configurable widths |
| Global Clock Networks |
4 |
Low-skew primary distribution |
| Secondary Clock Networks |
24 |
Additional high-fanout routing |
XC2S200-6FGG684C Architecture Deep Dive
Configurable Logic Block (CLB) Structure
Each CLB in the XC2S200-6FGG684C contains four logic cells, forming the fundamental building block for digital design implementation. The logic cell architecture incorporates a 4-input function generator, dedicated storage element, and arithmetic carry logic. This arrangement enables efficient implementation of both combinational and sequential circuits.
The function generators operate as high-performance Look-Up Tables (LUTs) capable of implementing any Boolean function of four inputs. Additionally, each LUT can serve as 16×1 distributed RAM or a 16-bit shift register, providing design flexibility without consuming dedicated memory resources.
Input/Output Block (IOB) Capabilities
The XC2S200-6FGG684C provides extensive I/O flexibility through its programmable IOB architecture. Each IOB supports multiple signaling standards, enabling seamless interface with various external devices and bus protocols.
Supported I/O Standards
| Standard |
Voltage Level |
Application |
| LVTTL |
3.3V |
General purpose digital |
| LVCMOS |
2.5V/3.3V |
Low-voltage logic |
| PCI |
3.3V |
Computer bus interface |
| GTL/GTL+ |
1.2V |
High-speed backplane |
| SSTL |
2.5V/3.3V |
Memory interfaces |
| HSTL |
1.5V |
High-speed transceiver |
Block RAM Memory Architecture
The XC2S200-6FGG684C integrates 56 Kbits of dedicated block RAM organized in two columns along the vertical edges of the die. Each block RAM cell provides 4,096 bits of true dual-port synchronous memory with independent port control signals.
Block RAM Configuration Options
| Port A Width |
Port B Width |
Depth |
| 1-bit |
1-bit |
4,096 |
| 2-bit |
2-bit |
2,048 |
| 4-bit |
4-bit |
1,024 |
| 8-bit |
8-bit |
512 |
| 16-bit |
16-bit |
256 |
The dual-port architecture allows simultaneous read and write operations from independent addresses, making it ideal for FIFO buffers, dual-clock domain crossings, and high-bandwidth data storage applications.
XC2S200-6FGG684C Delay-Locked Loop (DLL) Features
Clock Management Excellence
The four integrated DLLs provide precise clock distribution and phase control throughout the XC2S200-6FGG684C device. Each DLL can eliminate clock distribution delays, ensuring zero-delay buffering from the external clock pin to internal sequential elements.
DLL Functional Capabilities
| Feature |
Benefit |
| Clock Deskewing |
Eliminates input-to-output clock delay |
| Phase Shifting |
90°, 180°, 270° phase outputs |
| Frequency Multiplication |
2× clock frequency generation |
| Clock Mirroring |
Board-level clock synchronization |
| Duty Cycle Correction |
Automatic 50% duty cycle adjustment |
XC2S200-6FGG684C Package Information
684-Pin Fine-Pitch BGA Package Details
The FGG684 package provides optimal thermal performance and signal integrity for high-density designs. The fine-pitch ball grid array configuration ensures reliable solder joints while maximizing I/O density.
| Package Specification |
Value |
| Package Code |
FGG684 |
| Ball Count |
684 |
| Ball Pitch |
1.0 mm |
| Package Dimensions |
27 mm × 27 mm |
| Lead-Free Compliant |
Yes (Pb-free) |
| Moisture Sensitivity Level |
MSL-3 |
Pin Distribution
| Pin Category |
Quantity |
| User I/O |
284 |
| Global Clock Inputs |
4 |
| Configuration Pins |
12 |
| JTAG Pins |
4 |
| Power (VCCINT) |
Multiple |
| Power (VCCO) |
Multiple |
| Ground (GND) |
Multiple |
XC2S200-6FGG684C Configuration Modes
Flexible Programming Options
The XC2S200-6FGG684C supports multiple configuration modes to accommodate various system requirements. Configuration data can be loaded from serial PROMs, parallel flash memory, or through the JTAG boundary-scan interface.
| Mode |
Data Width |
Clock Source |
PROM Support |
| Master Serial |
1-bit |
Internal |
Yes |
| Slave Serial |
1-bit |
External |
Yes |
| Slave Parallel |
8-bit |
External |
No |
| Boundary Scan (JTAG) |
1-bit |
External |
No |
Configuration Data Requirements
| Parameter |
Value |
| Configuration Bits |
1,335,840 |
| Recommended PROM |
XC18V04 or larger |
| Maximum CCLK Frequency |
66 MHz |
| Configuration Time |
~20 ms (at 66 MHz) |
XC2S200-6FGG684C Applications
Industrial and Commercial Use Cases
The XC2S200-6FGG684C excels in applications requiring high logic density, flexible I/O, and cost-effective implementation.
Target Applications
- Telecommunications Equipment: Protocol conversion, data routing, signal processing
- Industrial Automation: Motor control, sensor interfaces, process monitoring
- Consumer Electronics: Video processing, audio systems, gaming hardware
- Medical Devices: Diagnostic equipment, imaging systems, monitoring devices
- Networking Hardware: Switch fabric, packet processing, interface bridging
- Automotive Systems: Infotainment, driver assistance, vehicle networking
- Test and Measurement: Data acquisition, signal generation, instrument control
XC2S200-6FGG684C Development Tools
Design Software Ecosystem
Xilinx provides comprehensive development tools for the XC2S200-6FGG684C through the ISE Design Suite. The software supports HDL design entry, synthesis, implementation, and verification workflows.
| Tool Category |
Options |
| Design Entry |
VHDL, Verilog, Schematic |
| Synthesis |
XST (Xilinx Synthesis Technology) |
| Simulation |
ModelSim, ISIM |
| Implementation |
Map, Place & Route |
| Programming |
iMPACT, ChipScope |
XC2S200-6FGG684C Electrical Characteristics
Power Supply Requirements
| Parameter |
Min |
Typical |
Max |
Unit |
| VCCINT (Core) |
2.375 |
2.5 |
2.625 |
V |
| VCCO (I/O Banks) |
1.14 |
— |
3.6 |
V |
| Power Consumption |
— |
Device/Design Dependent |
— |
mW |
Operating Conditions
| Parameter |
Commercial Grade |
| Junction Temperature |
0°C to +85°C |
| Ambient Temperature |
Device-specific |
| Storage Temperature |
-65°C to +150°C |
XC2S200-6FGG684C Ordering Information
Part Number Decoder
XC2S200-6FGG684C breaks down as follows:
| Segment |
Meaning |
| XC |
Xilinx device |
| 2S |
Spartan-II family |
| 200 |
200K system gates |
| -6 |
Speed grade (fastest commercial) |
| FG |
Fine-pitch BGA package |
| G |
Pb-free (RoHS compliant) |
| 684 |
684 ball count |
| C |
Commercial temperature range |
Conclusion: XC2S200-6FGG684C Value Proposition
The XC2S200-6FGG684C represents an excellent choice for engineers requiring proven FPGA technology with substantial logic resources. With 200,000 system gates, 5,292 logic cells, and 56 Kbits of block RAM, this Spartan-II device delivers the performance and flexibility needed for demanding applications.
The combination of -6 speed grade performance, comprehensive I/O standards support, and Pb-free packaging makes the XC2S200-6FGG684C suitable for both new designs and legacy system maintenance. Its unlimited reprogrammability enables design iterations and field upgrades impossible with traditional ASIC solutions.
For comprehensive FPGA solutions and component sourcing, explore our complete selection of programmable logic devices to find the perfect fit for your next project.
