Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

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XC2S200-6FGG683C: High-Performance Spartan-II FPGA for Industrial and Commercial Applications

Product Details

The XC2S200-6FGG683C is a high-performance Field Programmable Gate Array (FPGA) from Xilinx’s proven Spartan-II family. This versatile programmable logic device delivers exceptional performance with 200,000 system gates and 5,292 logic cells, making it an ideal solution for complex digital system designs requiring reliability and cost-effectiveness.


XC2S200-6FGG683C Overview and Key Features

The XC2S200-6FGG683C represents the pinnacle of the Spartan-II FPGA family, combining high logic density with the fastest -6 speed grade available. Built on mature 0.18-micron CMOS technology, this Xilinx FPGA delivers consistent performance for demanding embedded systems, telecommunications equipment, and industrial control applications.

Core Architecture Specifications

Parameter Specification
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42 (1,176 CLBs)
Maximum User I/O 284
Block RAM 56 Kbits (14 × 4Kbit blocks)
Distributed RAM 75,264 bits
Delay-Locked Loops (DLLs) 4
Maximum Frequency 263 MHz

XC2S200-6FGG683C Technical Specifications

Electrical Characteristics

The XC2S200-6FGG683C operates with a 2.5V core voltage supply, ensuring compatibility with standard logic levels while maintaining low power consumption. The operating voltage range spans from 2.375V to 2.625V, providing design flexibility for various power supply configurations.

Package Information for XC2S200-6FGG683C

The FGG683 package designation indicates a 683-pin Fine-pitch Ball Grid Array (FBGA) with Pb-free (lead-free) construction. This environmentally compliant package offers:

  • Ball pitch: 1.0mm
  • Package dimensions optimized for high-density PCB layouts
  • Enhanced thermal dissipation characteristics
  • RoHS-compliant lead-free solder balls

Speed Grade and Temperature Rating

The -6 speed grade represents the highest performance tier in the Spartan-II family, delivering maximum clock frequencies and minimal propagation delays. The “C” suffix indicates commercial temperature range operation from 0°C to 70°C ambient.


Spartan-II Architecture Advantages

Configurable Logic Blocks (CLBs)

Each CLB in the XC2S200-6FGG683C contains four logic cells with look-up tables (LUTs), flip-flops, and multiplexers. This architecture enables efficient implementation of combinational and sequential logic functions while supporting distributed RAM configurations.

SelectRAM Hierarchical Memory System

The XC2S200-6FGG683C features Xilinx’s SelectRAM technology providing dual-port block RAM and distributed RAM capabilities:

  • 14 dedicated 4Kbit block RAM modules
  • True dual-port operation with independent read/write clocks
  • Configurable data widths from 1-bit to 16-bit
  • 16 bits per LUT for distributed RAM implementation

Four Delay-Locked Loops (DLLs)

Positioned at each corner of the die, the four DLLs provide advanced clock management features including clock deskewing, frequency synthesis, and phase adjustment. These capabilities ensure precise timing control for high-speed interface designs.


XC2S200-6FGG683C Applications

The XC2S200-6FGG683C excels in numerous application domains requiring programmable logic solutions:

Industrial Automation Systems

Motor control interfaces, programmable logic controllers (PLCs), sensor data acquisition systems, and factory automation equipment benefit from the XC2S200-6FGG683C’s robust logic density and reliable operation.

Telecommunications Equipment

Protocol conversion, data switching, signal processing, and interface bridging applications leverage the FPGA’s high-speed I/O capabilities and flexible routing architecture.

Embedded Computing Platforms

Custom processor peripherals, co-processor implementations, memory controllers, and bus interface logic find efficient implementation within the XC2S200-6FGG683C’s configurable fabric.

Prototype Development and ASIC Replacement

The XC2S200-6FGG683C serves as an ideal platform for rapid prototyping and as a cost-effective alternative to mask-programmed ASICs, eliminating lengthy development cycles and non-recurring engineering costs.


Configuration and Programming Options

Supported Configuration Modes

The XC2S200-6FGG683C supports multiple configuration interfaces:

Mode Data Width CCLK Direction
Master Serial 1-bit Output
Slave Serial 1-bit Input
Slave Parallel 8-bit Input
Boundary Scan (JTAG) 1-bit N/A

Configuration Memory Requirements

The XC2S200-6FGG683C requires approximately 1,335,840 configuration bits, compatible with standard Xilinx serial and parallel PROMs including the XC18V01, XC18V02, and XC18V04 families.


Design Software Compatibility

The XC2S200-6FGG683C is fully supported by Xilinx ISE Design Suite, providing comprehensive synthesis, implementation, and verification tools. Compatible design entry methods include:

  • HDL synthesis (VHDL and Verilog)
  • Schematic capture
  • IP core integration through CORE Generator
  • Behavioral simulation with ISE Simulator

Ordering Information for XC2S200-6FGG683C

Part Number Breakdown

  • XC2S200: Spartan-II device with 200K system gates
  • -6: Fastest speed grade
  • FGG: Fine-pitch BGA package, Pb-free
  • 683: 683-pin package
  • C: Commercial temperature range (0°C to 70°C)

Quality and Reliability

All XC2S200-6FGG683C devices undergo comprehensive testing and quality assurance procedures ensuring reliable operation across the specified temperature range. Xilinx’s established manufacturing processes deliver consistent device performance meeting stringent quality standards.


Why Choose the XC2S200-6FGG683C

The XC2S200-6FGG683C offers compelling advantages for system designers:

  1. Proven Technology: Built on mature, well-characterized 0.18μm process technology
  2. High Logic Density: 200,000 system gates accommodate complex designs
  3. Fast Performance: -6 speed grade delivers maximum system throughput
  4. Flexible Memory: Combination of block RAM and distributed RAM options
  5. Robust I/O: Up to 284 user I/O pins support diverse interface requirements
  6. Environmental Compliance: Pb-free packaging meets RoHS directives
  7. Cost-Effective: Competitive pricing for volume applications

Summary

The XC2S200-6FGG683C Spartan-II FPGA combines high logic density, fast speed grades, and flexible I/O options in a lead-free BGA package. Whether designing industrial control systems, telecommunications equipment, or embedded computing platforms, this FPGA provides the programmable logic resources needed for successful implementation. With comprehensive design tool support and proven reliability, the XC2S200-6FGG683C remains a dependable choice for cost-sensitive applications requiring high-performance programmable logic.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.