The XC2S200-6FGG681C is a powerful Field Programmable Gate Array (FPGA) from the renowned Xilinx Spartan-II family. This advanced programmable logic device delivers exceptional performance, reliability, and flexibility for demanding digital design applications. Engineers seeking a cost-effective alternative to mask-programmed ASICs will find this FPGA solution ideal for both prototyping and high-volume production environments.

XC2S200-6FGG681C Key Features and Benefits

The XC2S200-6FGG681C combines industry-leading programmable architecture with robust functionality. This Xilinx FPGA offers designers unprecedented flexibility for implementing complex digital systems while maintaining cost efficiency throughout the product lifecycle.

Core Architecture Specifications

The XC2S200-6FGG681C features a comprehensive set of technical specifications optimized for high-performance applications:

Package and Performance Details

XC2S200-6FGG681C Technical Architecture

Configurable Logic Blocks (CLBs)

The XC2S200-6FGG681C utilizes a regular, flexible, and programmable architecture centered around 1,176 Configurable Logic Blocks. Each CLB contains multiple function generators and flip-flops that can be programmed to implement any combinational or sequential logic function. This architecture provides exceptional design flexibility while maintaining high performance.

Input/Output Blocks (IOBs)

The device features up to 284 user-configurable I/O pins that support multiple interface standards including LVTTL, LVCMOS, PCI, and GTL+. Each IOB can be independently configured as input, output, or bidirectional, providing designers with maximum flexibility for system integration.

Block RAM Capabilities

With 56 Kbits of dual-port block RAM distributed across dedicated memory columns, the XC2S200-6FGG681C supports high-bandwidth data storage and buffering applications. Each 4,096-bit RAM block operates with independent read and write ports, enabling simultaneous access for maximum throughput.

Delay-Locked Loops (DLLs)

Four integrated Delay-Locked Loops positioned at each corner of the die provide precise clock management capabilities. These DLLs eliminate clock distribution delays, multiply or divide clock frequencies, and ensure system-wide clock synchronization for reliable high-speed operation.

XC2S200-6FGG681C Speed Grade -6 Performance Advantages

The -6 speed grade represents the fastest performance tier in the Spartan-II family. This speed designation indicates optimized timing parameters that enable:

• Higher system clock frequencies up to 263 MHz
• Reduced propagation delays across logic paths
• Enhanced signal integrity for critical timing applications
• Improved overall system throughput

The -6 speed grade is exclusively available in the commercial temperature range, making the XC2S200-6FGG681C ideal for applications requiring maximum performance in controlled operating environments.

XC2S200-6FGG681C Application Areas

Telecommunications Equipment

The XC2S200-6FGG681C excels in telecommunications applications requiring high-speed data processing and protocol conversion. Its extensive I/O capabilities and block RAM resources support complex networking functions including packet processing, data encryption, and interface bridging.

Industrial Control Systems

For industrial automation and control applications, this FPGA provides the programmable logic density needed to implement sophisticated control algorithms, motor drive interfaces, and sensor signal processing while maintaining real-time performance requirements.

Digital Signal Processing

The combination of high logic density and fast switching speeds makes the XC2S200-6FGG681C suitable for DSP applications including digital filtering, data compression, and signal conditioning. The distributed and block RAM resources enable efficient implementation of delay lines and coefficient storage.

Embedded System Design

System designers can leverage this FPGA for custom peripheral development, protocol conversion, and system-on-chip prototyping. The in-system programmability via JTAG interface enables rapid design iterations and field upgrades without hardware modifications.

XC2S200-6FGG681C Configuration Options

Configuration Modes Supported

The XC2S200-6FGG681C supports multiple configuration modes to accommodate various system requirements:

Configuration Bits Required

Total configuration memory: 1,335,840 bits

This configuration data can be stored in Xilinx Platform Flash PROMs or loaded dynamically from system memory through the processor interface.

XC2S200-6FGG681C Part Number Breakdown

Understanding the XC2S200-6FGG681C part numbering provides insight into device specifications:

• XC2S200: Spartan-II device with 200K system gates
• -6: Fastest speed grade available
• FG: Fine-pitch Ball Grid Array package
• G: Pb-free (RoHS compliant) packaging
• 681: 681-pin package configuration
• C: Commercial temperature range (0°C to +85°C)

XC2S200-6FGG681C Design Resources and Support

Development Tools

Engineers working with the XC2S200-6FGG681C have access to comprehensive development tools:

• Xilinx ISE Design Suite for synthesis and implementation
• ChipScope Pro for in-system debugging
• ModelSim and ISE Simulator for functional verification
• FPGA Editor for detailed placement and routing control

Documentation Available

Complete technical documentation supports all phases of design:

• DS001 Spartan-II FPGA Family Data Sheet
• Package pinout diagrams and footprint specifications
• PCB design guidelines and thermal management recommendations
• Application notes covering common implementation scenarios

XC2S200-6FGG681C vs ASIC Comparison

The XC2S200-6FGG681C offers significant advantages over traditional mask-programmed ASICs:

Ordering Information for XC2S200-6FGG681C

When ordering the XC2S200-6FGG681C, verify the following specifications match your requirements:

• Device: XC2S200 (200K system gates)
• Speed Grade: -6 (commercial only)
• Package: FGG681 (681-pin fine-pitch BGA, Pb-free)
• Temperature: Commercial (0°C to +85°C)

Quality and Reliability Standards

The XC2S200-6FGG681C meets stringent quality requirements:

• Manufactured using advanced 0.18μm CMOS process technology
• Pb-free packaging compliant with RoHS directives
• Comprehensive electrostatic discharge (ESD) protection
• Extensive qualification testing per JEDEC standards

Summary

The XC2S200-6FGG681C represents an excellent choice for engineers requiring high-performance programmable logic in a reliable, cost-effective package. With 200,000 system gates, 5,292 logic cells, and 284 user I/O pins, this Spartan-II FPGA delivers the flexibility and performance needed for demanding digital design applications. The -6 speed grade ensures maximum system throughput while the 681-pin fine-pitch BGA package provides extensive connectivity options for complex system integration.

Whether developing telecommunications equipment, industrial control systems, or embedded applications, the XC2S200-6FGG681C provides the programmable logic foundation for successful product development with reduced risk and accelerated time-to-market.