The XC2S200-6FGG680C is a powerful Field Programmable Gate Array (FPGA) from Xilinx’s renowned Spartan-II family, delivering exceptional programmable logic capabilities in a compact 680-pin fine-pitch BGA package. This commercial-grade device combines high gate density, fast processing speeds, and robust I/O options, making it an ideal choice for telecommunications, industrial control, and consumer electronics applications.

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XC2S200-6FGG680C Overview and Key Features

The XC2S200-6FGG680C represents a cost-effective ASIC alternative that eliminates initial development costs and lengthy design cycles. Engineers worldwide choose this Xilinx FPGA for its remarkable flexibility, in-system reprogrammability, and proven reliability in demanding environments.

Core Architecture Specifications

Memory Resources

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XC2S200-6FGG680C Package and Pinout Information

FGG680C Package Specifications

Speed Grade and Temperature Range

The -6 speed grade denotes the fastest available performance tier within the Spartan-II XC2S200 lineup. This speed grade is exclusively available in the Commercial temperature range (0°C to +85°C TJ), ensuring reliable operation across standard industrial environments.

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XC2S200-6FGG680C Electrical Characteristics

Power Supply Requirements

I/O Standards and Features

The XC2S200-6FGG680C supports multiple I/O standards to ensure seamless integration with diverse system architectures:

• LVTTL and LVCMOS (3.3V, 2.5V, 1.8V)
• GTL and GTL+
• SSTL3 and SSTL2 (Class I and II)
• HSTL (Class I, II, III, IV)
• PCI 33 MHz / 66 MHz Compliant
• AGP 2× Interface Support

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XC2S200-6FGG680C Advanced Features

Delay-Locked Loop (DLL) Technology

The XC2S200-6FGG680C integrates four independent Delay-Locked Loops (DLLs), positioned at each corner of the die. These DLLs provide:

• Clock deskewing and phase shifting
• Clock multiplication and division (1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16×)
• Board-level clock synchronization
• Zero-delay clock buffering

Configurable Logic Block (CLB) Architecture

Each CLB in the XC2S200-6FGG680C contains:

• Two Logic Cells (LCs) with dedicated 4-input LUT
• Dual flip-flops with independent clock enable
• Fast carry logic for arithmetic operations
• Cascade chains for wide function implementation
• Four direct feedthrough paths for enhanced routing

Block RAM Capabilities

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XC2S200-6FGG680C Configuration Options

Supported Configuration Modes

Configuration Security

• Bitstream encryption for IP protection
• Readback capability for design verification
• CRC error detection during configuration

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XC2S200-6FGG680C Applications

The XC2S200-6FGG680C excels in numerous high-volume, cost-sensitive applications:

Industrial and Commercial Applications

• Industrial automation and PLC systems
• Motor control and drive systems
• Test and measurement equipment
• Medical instrumentation
• Building automation controllers

Telecommunications and Networking

• DSL and cable modem interfaces
• Wireless base station equipment
• Network switching and routing
• Protocol conversion bridges
• Encryption/decryption accelerators

Consumer Electronics

• Digital video processing
• Audio signal processing
• Gaming and entertainment systems
• Set-top box implementations
• Display controller interfaces

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XC2S200-6FGG680C Ordering Information

Part Number Breakdown

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XC2S200-6FGG680C Development Tools and Support

Design Software Compatibility

The XC2S200-6FGG680C is fully supported by Xilinx ISE Design Suite, which provides:

• Schematic and HDL-based design entry
• Synthesis and implementation tools
• Simulation and timing analysis
• ChipScope Pro integrated logic analyzer
• PROM file generation utilities

Documentation Resources

• Complete datasheet (DS001)
• Application notes and design guides
• Reference designs and IP cores
• PCB layout guidelines
• Thermal management specifications

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Why Choose the XC2S200-6FGG680C?

The XC2S200-6FGG680C delivers the perfect balance of performance, features, and cost-effectiveness for FPGA-based designs. Its 680-pin package provides maximum I/O flexibility, while the -6 speed grade ensures optimal timing performance for demanding applications.

Key advantages include:

• Proven Architecture – Built on mature 0.18 µm technology with extensive field deployment
• Rapid Prototyping – In-system programmability accelerates development cycles
• Field Upgradeability – Design updates without hardware replacement
• Cost Efficiency – Eliminates NRE costs associated with ASIC development
• Comprehensive Support – Extensive documentation and design resources

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XC2S200-6FGG680C Technical Summary