The XC2S200-6FGG673C is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Spartan-II family, engineered for demanding industrial, telecommunications, and embedded applications. This advanced programmable logic device offers exceptional versatility with 200,000 system gates, 5,292 logic cells, and a robust 673-pin Fine-Pitch BGA package. Whether you’re developing digital signal processing systems or implementing complex control architectures, the XC2S200-6FGG673C delivers reliable performance at competitive pricing.
XC2S200-6FGG673C Key Features and Benefits
The XC2S200-6FGG673C represents the pinnacle of AMD’s Spartan-II FPGA technology, combining substantial logic resources with advanced on-chip memory capabilities. This device serves as a superior alternative to mask-programmed ASICs, eliminating lengthy development cycles and reducing project risk.
High-Density Logic Architecture
At the core of the XC2S200-6FGG673C lies a powerful configurable logic block (CLB) array organized in a 28 x 42 matrix, providing 1,176 total CLBs. Each CLB contains four logic cells with 4-input look-up tables (LUTs) that can implement any Boolean function. This architecture enables engineers to develop sophisticated digital designs with exceptional flexibility.
Advanced Memory Resources
The XC2S200-6FGG673C integrates comprehensive memory solutions:
- Block RAM: 56K bits of dedicated dual-port synchronous RAM
- Distributed RAM: 75,264 bits using LUT-based memory structures
- Configurable Depths: 4096 x 1 to 256 x 16 aspect ratios available
Performance Specifications
The -6 speed grade designation indicates this XC2S200-6FGG673C variant delivers enhanced timing performance for speed-critical applications. System clock rates up to 200 MHz are achievable, with the device’s 0.18-micron CMOS technology ensuring optimal power efficiency.
XC2S200-6FGG673C Technical Specifications
Understanding the complete specifications of the XC2S200-6FGG673C helps engineers make informed design decisions. Below is a comprehensive overview of this Spartan-II FPGA’s parameters.
General Device Parameters
| Parameter |
Specification |
| Manufacturer |
AMD (formerly Xilinx) |
| Product Family |
Spartan-II FPGA |
| Part Number |
XC2S200-6FGG673C |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 x 42 (1,176 CLBs) |
| Maximum User I/O |
284 |
| Speed Grade |
-6 (Higher Performance) |
| Temperature Range |
Commercial (0°C to +85°C) |
Memory Architecture Details
| Memory Type |
Capacity |
Configuration Options |
| Block RAM |
56K bits (14 blocks) |
Dual-port, synchronous |
| Distributed RAM |
75,264 bits |
16 bits per LUT |
| Configuration Storage |
1,335,840 bits |
Internal SRAM-based |
Electrical Characteristics
| Parameter |
Specification |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V |
| Process Technology |
0.18 µm CMOS |
| Package Type |
FGG673 (Fine-Pitch BGA) |
| Pin Count |
673 |
XC2S200-6FGG673C I/O Standards and Interface Capabilities
The XC2S200-6FGG673C supports 16 high-performance interface standards, making it exceptionally versatile for various system integration requirements.
Supported I/O Standards
The comprehensive I/O support includes:
- LVTTL: 3.3V Low-Voltage TTL (2-24 mA drive)
- LVCMOS2: 2.5V Low-Voltage CMOS
- PCI: 3.3V/5V at 33 MHz/66 MHz compliance
- GTL/GTL+: Gunning Transceiver Logic
- HSTL Class I/III/IV: High-Speed Transceiver Logic
- SSTL2/SSTL3: Stub Series Terminated Logic
- CTT: Center-Terminated Tap
- AGP-2X: Accelerated Graphics Port
I/O Banking Architecture
The XC2S200-6FGG673C features eight independent I/O banks, allowing engineers to interface with multiple voltage domains simultaneously. This banking structure enables mixed-voltage designs while maintaining signal integrity.
XC2S200-6FGG673C Clock Management System
Advanced clock distribution and management are critical for high-performance FPGA designs. The XC2S200-6FGG673C incorporates sophisticated clock resources.
Delay-Locked Loop (DLL) Features
Four dedicated DLLs provide:
- Zero-Delay Clock Distribution: Eliminates clock skew across the device
- Clock Multiplication: 2x frequency doubling capability
- Clock Division: Divide by 1.5, 2, 2.5, 3, 4, 5, 8, or 16
- Phase Shifting: Four quadrature phases (0°, 90°, 180°, 270°)
- Board-Level Deskewing: External clock mirror functionality
Global Clock Networks
The device includes four primary global clock networks with dedicated input pins, ensuring minimal skew distribution to all sequential elements throughout the XC2S200-6FGG673C.
XC2S200-6FGG673C Configuration Modes
Flexible configuration options make the XC2S200-6FGG673C adaptable to diverse system architectures.
Available Configuration Methods
| Mode |
CCLK Direction |
Data Width |
Description |
| Master Serial |
Output |
1-bit |
FPGA controls PROM |
| Slave Serial |
Input |
1-bit |
External master control |
| Slave Parallel |
Input |
8-bit |
High-speed byte-wide loading |
| Boundary Scan |
N/A |
1-bit |
JTAG IEEE 1149.1 |
Configuration File Size
The XC2S200-6FGG673C requires approximately 1.34 Mbit (1,335,840 bits) of configuration data, compatible with standard serial PROM devices or processor-based configuration schemes.
XC2S200-6FGG673C Applications and Use Cases
The versatility of the XC2S200-6FGG673C makes it suitable for numerous applications across multiple industries.
Industrial and Automation
- Motor control systems
- Programmable logic controllers
- Factory automation equipment
- Process control interfaces
Telecommunications
- Network interface cards
- Protocol conversion bridges
- Base station equipment
- Digital subscriber line (DSL) systems
Consumer Electronics
- Set-top boxes
- Digital video processing
- Audio equipment
- Gaming peripherals
Embedded Systems
- Medical instrumentation
- Test and measurement equipment
- Aerospace and defense systems
- Automotive electronics
For more information about AMD programmable logic devices and related products, explore our comprehensive Xilinx FPGA product catalog.
XC2S200-6FGG673C Development Tools and Support
AMD provides comprehensive design resources for the XC2S200-6FGG673C development workflow.
Software Development Environment
The ISE Design Suite offers complete support for Spartan-II FPGA development, including:
- Schematic and HDL design entry
- Synthesis and implementation tools
- Timing analysis and simulation
- Bitstream generation and programming
Design Resources
Engineers working with the XC2S200-6FGG673C have access to:
- Complete datasheet documentation (DS001)
- Application notes and reference designs
- IP cores and design examples
- Technical support forums
XC2S200-6FGG673C Package Information
FGG673 Package Specifications
The Fine-Pitch BGA package of the XC2S200-6FGG673C provides:
- Ball Pitch: 1.0 mm spacing
- Body Size: Optimized for high-density PCB layouts
- Pb-Free Option: RoHS-compliant versions available (FGG designation)
- Thermal Performance: Enhanced heat dissipation characteristics
PCB Design Considerations
When designing with the XC2S200-6FGG673C:
- Use appropriate via structures for BGA breakout
- Implement proper power plane separation for VCCINT and VCCO
- Follow recommended decoupling capacitor placement guidelines
- Consider controlled impedance routing for high-speed signals
XC2S200-6FGG673C Ordering Information
Part Number Decoder
XC2S200-6FGG673C breakdown:
| Code |
Meaning |
| XC2S200 |
Spartan-II, 200K system gates |
| -6 |
Speed grade (higher performance) |
| FGG |
Fine-Pitch BGA, Pb-free |
| 673 |
673-pin package |
| C |
Commercial temperature (0°C to +85°C) |
Available Variants
The XC2S200 device is available in multiple package options:
- PQ208: 208-pin Plastic QFP
- FG256: 256-ball Fine-Pitch BGA
- FG456: 456-ball Fine-Pitch BGA
- FGG673: 673-ball Fine-Pitch BGA (Pb-free)
Why Choose the XC2S200-6FGG673C?
The XC2S200-6FGG673C stands out as an exceptional choice for cost-sensitive applications requiring substantial programmable logic resources.
Key Advantages
- Cost-Effective: Lower per-gate costs compared to ASICs
- Rapid Development: Eliminate lengthy ASIC design cycles
- Field Upgradeability: Reprogram designs without hardware changes
- Risk Reduction: Validate designs before volume production
- Time-to-Market: Accelerate product development schedules
Proven Reliability
As part of AMD’s established Spartan-II family, the XC2S200-6FGG673C benefits from mature silicon technology and extensive field deployment experience, ensuring dependable operation in mission-critical applications.
Conclusion
The XC2S200-6FGG673C delivers an optimal balance of performance, resources, and cost-effectiveness for FPGA-based designs. With 200K system gates, comprehensive I/O flexibility, advanced clock management, and robust configuration options, this Spartan-II device addresses the demanding requirements of modern electronic systems.
From industrial automation to telecommunications infrastructure, the XC2S200-6FGG673C provides engineers with a proven, versatile platform for implementing complex digital logic. Combined with AMD’s comprehensive development tools and support ecosystem, this FPGA enables faster development cycles and reduced project risk.
For engineers seeking reliable programmable logic solutions with extensive I/O capabilities and proven performance, the XC2S200-6FGG673C represents an outstanding choice backed by decades of AMD FPGA innovation.
