The XC2S200-6FGG672C is a powerful Field Programmable Gate Array (FPGA) from the renowned AMD/Xilinx Spartan-II family. This 672-pin Fine-pitch BGA device delivers exceptional performance, abundant logic resources, and comprehensive features at a competitive price point—making it the ideal solution for engineers seeking reliable programmable logic for demanding applications.
XC2S200-6FGG672C Key Features and Benefits
The XC2S200-6FGG672C combines advanced 0.18μm CMOS technology with a flexible programmable architecture. This FPGA provides a superior alternative to mask-programmed ASICs, eliminating lengthy development cycles and reducing inherent manufacturing risks while enabling in-field design upgrades without hardware replacement.
Logic Capacity and Gate Count
The XC2S200-6FGG672C offers substantial logic capacity for complex digital implementations:
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
Memory Resources
This Spartan-II FPGA integrates generous on-chip memory resources essential for high-performance data processing:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
The dual-memory architecture supports both single-port and dual-port configurations, providing design flexibility for buffering, FIFO implementation, and embedded storage applications.
XC2S200-6FGG672C Technical Specifications
Electrical Characteristics
| Parameter |
Specification |
| Core Supply Voltage |
2.5V |
| Process Technology |
0.18μm CMOS |
| Maximum System Clock |
200 MHz |
| Speed Grade |
-6 |
| Operating Temperature |
Commercial (0°C to +85°C) |
Package Information
The XC2S200-6FGG672C utilizes a 672-ball Fine-pitch Ball Grid Array (FGG672) package. The “G” designation indicates Pb-free (RoHS compliant) packaging, meeting modern environmental standards for electronics manufacturing.
Advanced Clock Management with Delay-Locked Loops (DLLs)
The XC2S200-6FGG672C features four integrated Delay-Locked Loops (DLLs), positioned at each corner of the die. These DLLs provide:
- Zero propagation delay clock distribution
- Low clock skew across the entire device
- Clock multiplication and division capabilities
- Board-level clock deskewing between multiple devices
- Guaranteed system clock stability before device startup
The DLL architecture ensures precise timing synchronization, critical for high-speed digital designs requiring reliable clock performance.
Configurable Logic Block (CLB) Architecture
Each CLB within the XC2S200-6FGG672C contains programmable logic elements interconnected through a versatile routing hierarchy. The architecture includes:
- 4-input Look-Up Tables (LUTs) for combinatorial logic
- Dedicated flip-flops with programmable set/reset
- Fast carry logic for arithmetic operations
- Multiplexer resources for efficient routing
I/O Standards and Flexibility
The XC2S200-6FGG672C supports 16 different I/O standards, enabling seamless interfacing with various logic families and protocols. The programmable Input/Output Blocks (IOBs) surrounding the CLB array provide comprehensive connectivity options for diverse system requirements.
XC2S200-6FGG672C Applications
This versatile Xilinx FPGA serves numerous application domains:
Industrial and Control Systems
- Programmable logic controllers (PLCs)
- Motor control interfaces
- Industrial automation equipment
- Process control systems
Communications Infrastructure
- Protocol conversion bridges
- Data packet processing
- Interface controllers
- Network switching equipment
Consumer Electronics
- Video processing systems
- Audio signal processing
- Display controllers
- Gaming peripherals
Embedded Systems Development
- Hardware prototyping platforms
- ASIC emulation and verification
- Co-processing acceleration
- Custom peripheral development
Configuration Modes
The XC2S200-6FGG672C supports multiple configuration modes for design flexibility:
| Mode |
Data Width |
Description |
| Master Serial |
1-bit |
Autonomous configuration from PROM |
| Slave Serial |
1-bit |
External controller configuration |
| Slave Parallel |
8-bit |
High-speed parallel configuration |
| Boundary Scan |
1-bit |
JTAG-based configuration |
Why Choose the XC2S200-6FGG672C?
Cost-Effective Performance
The Spartan-II family delivers high performance without premium pricing, making the XC2S200-6FGG672C ideal for volume production and cost-sensitive applications.
Reduced Time-to-Market
Programmable logic eliminates mask charges and lengthy ASIC fabrication cycles. Design iterations can be implemented immediately, accelerating product development timelines.
Field Upgradeability
Unlike fixed-function ASICs, the XC2S200-6FGG672C allows design modifications after deployment—enabling feature updates, bug fixes, and performance optimizations without hardware changes.
Design Tool Support
Comprehensive development support through Xilinx ISE Design Suite provides synthesis, simulation, and implementation tools for efficient design workflows.
Part Number Breakdown: XC2S200-6FGG672C
Understanding the part numbering convention:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (fastest available for commercial range)
- FGG: Fine-pitch BGA package, Pb-free (lead-free)
- 672: 672-ball package
- C: Commercial temperature range (0°C to +85°C)
Ordering and Availability
The XC2S200-6FGG672C is available through authorized AMD/Xilinx distributors worldwide. Contact your local distributor for current pricing, stock availability, and lead time information. Volume discounts apply for production quantities.
