The XC2S200-6FGG671C is a powerful Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, engineered to deliver exceptional performance and reliability for demanding digital design applications. This advanced programmable logic device offers an optimal balance of logic density, speed, and cost-effectiveness, making it the preferred choice for engineers seeking robust solutions in telecommunications, industrial automation, and embedded systems.
As a member of the Xilinx FPGA product lineup, the XC2S200-6FGG671C combines cutting-edge 0.18µm technology with comprehensive I/O capabilities, providing designers with unprecedented flexibility for implementing complex digital circuits.
XC2S200-6FGG671C Technical Specifications
Core Architecture Features
The XC2S200-6FGG671C incorporates advanced architectural elements that distinguish it from competing programmable logic devices:
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Operating Voltage |
2.5V |
| Process Technology |
0.18µm |
| Maximum Frequency |
263 MHz |
| Speed Grade |
-6 (Commercial) |
| Package Type |
Fine Pitch BGA (Pb-Free) |
| Temperature Range |
Commercial (0°C to +85°C) |
Memory Resources
The XC2S200-6FGG671C provides extensive on-chip memory capabilities essential for data-intensive applications:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Block RAM Cells |
14 × 4,096-bit dual-port RAM |
Key Features of the XC2S200-6FGG671C FPGA
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG671C features a flexible, regular architecture of Configurable Logic Blocks that serve as the primary building elements for most logic designs. Each CLB contains four logic cells with 4-input function generators, storage elements, and dedicated carry logic for high-speed arithmetic operations.
Input/Output Blocks (IOBs) with Multiple I/O Standards
The programmable IOBs surrounding the CLB array support 16 different I/O signaling standards, including:
- LVTTL (Low Voltage TTL)
- LVCMOS (Low Voltage CMOS)
- PCI (Peripheral Component Interconnect)
- GTL/GTL+ (Gunning Transceiver Logic)
- SSTL (Stub Series Terminated Logic)
- HSTL (High-Speed Transceiver Logic)
- CTT (Center Tap Terminated)
This extensive I/O flexibility enables seamless interfacing with modern memory interfaces and diverse bus architectures.
Delay-Locked Loops (DLLs)
Four Delay-Locked Loops positioned at each corner of the die provide advanced clock management features:
- Clock deskewing and phase shifting
- Clock multiplication and division
- Board-level clock synchronization
- Frequency synthesis capabilities
Dual-Port Block RAM Architecture
Each block RAM cell operates as a fully synchronous dual-ported 4,096-bit RAM with independent control signals for each port. The configurable data widths enable optimized memory utilization for various application requirements.
XC2S200-6FGG671C Applications and Use Cases
Industrial Automation Systems
The XC2S200-6FGG671C excels in industrial control applications requiring real-time processing, motor control algorithms, and sensor interface management. Its high logic density and predictable timing characteristics ensure reliable operation in demanding manufacturing environments.
Telecommunications Equipment
Network routers, protocol converters, and base station controllers benefit from the XC2S200-6FGG671C’s high-speed I/O capabilities and extensive logic resources. The device supports complex signal processing algorithms essential for modern communication systems.
Digital Signal Processing
With 56 Kbits of block RAM and 75,264 bits of distributed RAM, the XC2S200-6FGG671C handles data-intensive DSP applications including:
- Audio and video processing
- Filter implementation
- FFT computations
- Encryption/decryption algorithms
Embedded Systems and Prototyping
The XC2S200-6FGG671C serves as an excellent platform for rapid prototyping and embedded system development. In-system programmability enables iterative design refinement without hardware modifications.
Design Advantages of Spartan-II XC2S200-6FGG671C
Superior Alternative to ASICs
The XC2S200-6FGG671C eliminates the initial NRE (Non-Recurring Engineering) costs, lengthy development cycles, and inherent risks associated with conventional mask-programmed ASICs. Field programmability permits design upgrades and bug fixes without hardware replacement.
VersaRing Routing Architecture
Additional routing resources between the CLB array and IOBs facilitate pin-swapping and pin-locking capabilities. This feature reduces time-to-market by allowing PCB manufacturing to proceed while logic design continues.
Fast and Predictable Interconnects
The optimized routing architecture ensures successive design iterations consistently meet timing requirements. Reduced compilation times result from the user-friendly architecture that minimizes long-path delays.
Comprehensive Configuration Options
Multiple configuration modes provide flexibility in system implementation:
- Serial configuration from PROM
- Parallel configuration (SelectMAP)
- JTAG-based programming
- Daisy-chain configuration for multiple devices
XC2S200-6FGG671C Part Number Decoder
Understanding the XC2S200-6FGG671C nomenclature ensures correct ordering:
| Code Element |
Meaning |
| XC2S |
Spartan-II Family |
| 200 |
200,000 System Gates |
| -6 |
Speed Grade (Fastest Commercial) |
| FG |
Fine Pitch BGA Package |
| G |
Pb-Free (RoHS Compliant) |
| 671 |
Pin Count |
| C |
Commercial Temperature Range |
Development Tools and Software Support
ISE Design Suite Compatibility
The XC2S200-6FGG671C integrates seamlessly with Xilinx ISE Design Suite, providing:
- Schematic capture and HDL synthesis
- Implementation and timing analysis
- Bitstream generation and device programming
- Simulation and verification tools
Third-Party EDA Tool Support
Comprehensive support for industry-standard electronic design automation tools ensures smooth integration into existing design workflows.
XC2S200-6FGG671C Ordering Information
Package Options
The Spartan-II XC2S200 series is available in both standard and Pb-free packaging options. The “G” character in the ordering code indicates Pb-free (RoHS-compliant) packaging.
Availability and Lead Times
Contact authorized distributors for current pricing, stock availability, and lead time information. Volume discounts are available for production quantities.
Frequently Asked Questions About XC2S200-6FGG671C
What is the maximum operating frequency of the XC2S200-6FGG671C?
The XC2S200-6FGG671C supports system performance up to 263 MHz, with the -6 speed grade offering the fastest performance in the commercial temperature range.
Is the XC2S200-6FGG671C RoHS compliant?
Yes, the “G” designation in the part number indicates Pb-free packaging that meets RoHS compliance requirements.
What development board supports the XC2S200-6FGG671C?
Various Spartan-II development boards and starter kits are available from Xilinx and third-party vendors for prototyping and evaluation purposes.
Can the XC2S200-6FGG671C be reconfigured in-system?
Yes, the device supports in-system reconfiguration through multiple configuration modes, enabling design updates without physical hardware changes.
Conclusion
The XC2S200-6FGG671C represents an excellent choice for engineers requiring a reliable, high-performance FPGA solution with substantial logic resources, comprehensive I/O capabilities, and proven 0.18µm technology. Its combination of 200,000 system gates, 5,292 logic cells, and 56 Kbits of block RAM delivers the computational power necessary for demanding industrial, telecommunications, and embedded applications.
With field programmability, multiple I/O standards support, and seamless design tool integration, the XC2S200-6FGG671C accelerates time-to-market while reducing development risks compared to traditional ASIC approaches.
