Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG670C: High-Performance Spartan-II FPGA for Industrial and Commercial Applications

Product Details

The XC2S200-6FGG670C is a powerful field-programmable gate array (FPGA) from the renowned AMD/Xilinx Spartan-II family. This high-performance programmable logic device delivers exceptional value for engineers and designers seeking reliable digital solutions for complex embedded systems, telecommunications equipment, and industrial automation projects.

Built on proven 0.18-micron CMOS technology, the XC2S200-6FGG670C combines 200,000 system gates with the fastest -6 speed grade available in the Spartan-II lineup. The lead-free FGG670 ball grid array package ensures RoHS compliance while providing robust thermal performance and excellent signal integrity for demanding applications.

XC2S200-6FGG670C Technical Specifications

Understanding the complete technical specifications of the XC2S200-6FGG670C helps engineers make informed design decisions. This Spartan-II FPGA delivers comprehensive programmable logic resources suitable for a wide range of digital applications.

Core Logic Resources

The XC2S200-6FGG670C provides substantial programmable logic capacity through its well-organized architecture:

Parameter Specification
System Gates 200,000
Logic Cells 5,292
Configurable Logic Blocks (CLBs) 1,176
CLB Array Configuration 28 × 42
Maximum User I/Os 284
Delay-Locked Loops (DLLs) 4

Memory Architecture

The XC2S200-6FGG670C features a hierarchical memory system that supports diverse data storage requirements:

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56K bits (14 × 4,096-bit blocks)
Total RAM Bits 131,264 bits

The dual-port block RAM architecture enables simultaneous read/write operations with independent port configurations. Each 4,096-bit block RAM cell provides fully synchronous operation with configurable data widths ranging from 1 to 16 bits.

Electrical and Performance Characteristics

Parameter Value
Core Voltage (VCCINT) 2.5V
I/O Voltage (VCCO) 1.5V to 3.3V
Maximum System Frequency 263 MHz
Process Technology 0.18 µm CMOS
Speed Grade -6 (Fastest)
Temperature Range Commercial (0°C to +85°C)

Package Information

Specification Detail
Package Type FGG670 (Fine-Pitch BGA, Lead-Free)
Pin Count 670
RoHS Compliance Yes
Mounting Type Surface Mount

XC2S200-6FGG670C Architecture Overview

The XC2S200-6FGG670C utilizes the proven Spartan-II FPGA architecture, featuring a regular and flexible programmable structure. The device consists of Configurable Logic Blocks (CLBs) surrounded by programmable Input/Output Blocks (IOBs), interconnected through a versatile routing hierarchy.

Configurable Logic Block Structure

Each CLB in the XC2S200-6FGG670C contains four logic cells organized as two slices. Every slice includes two 4-input function generators (LUTs), carry logic, arithmetic logic gates, and two storage elements. This architecture enables efficient implementation of both combinatorial and sequential logic functions.

Input/Output Block Capabilities

The IOBs in the XC2S200-6FGG670C support 16 different I/O standards, providing exceptional flexibility for interfacing with various system components. Supported standards include LVTTL, LVCMOS (3.3V and 2.5V), PCI (3.3V and 5V), GTL, GTL+, HSTL Class I through IV, SSTL2 Class I and II, SSTL3 Class I and II, CTT, and AGP-2X.

Delay-Locked Loop Features

The four DLLs positioned at each corner of the XC2S200-6FGG670C die provide advanced clock management capabilities. These DLLs eliminate clock distribution delays, multiply or divide clock frequencies, and enable precise phase shifting for high-speed designs.

XC2S200-6FGG670C Applications

The XC2S200-6FGG670C serves numerous applications across various industries due to its versatile architecture and robust performance characteristics.

Telecommunications and Networking

The high I/O count and fast signal propagation make the XC2S200-6FGG670C ideal for telecommunications infrastructure equipment, network switches, routers, and protocol converters. The device efficiently handles data packet processing, signal encoding/decoding, and interface bridging functions.

Industrial Automation and Control

Manufacturing facilities and process control systems benefit from the XC2S200-6FGG670C’s reliable operation across commercial temperature ranges. Applications include programmable logic controllers (PLCs), motor drive controllers, sensor interfaces, and real-time monitoring systems.

Automotive Electronics

The XC2S200-6FGG670C supports automotive applications requiring custom logic implementations, including infotainment systems, instrument clusters, body control modules, and advanced driver assistance system (ADAS) preprocessing.

Consumer Electronics

Consumer products leverage the XC2S200-6FGG670C for video processing, audio enhancement, gaming peripherals, and smart home device control logic where cost-effective programmable solutions are essential.

Digital Signal Processing

The arithmetic resources and block RAM capabilities make the XC2S200-6FGG670C suitable for DSP applications including FIR/IIR filters, FFT implementations, and digital modulation/demodulation circuits.

XC2S200-6FGG670C Design Resources and Development Tools

Engineers working with the XC2S200-6FGG670C have access to comprehensive development resources that accelerate design implementation and verification.

Software Development Environment

The XC2S200-6FGG670C is fully supported by the Xilinx ISE Design Suite, providing complete design entry, synthesis, implementation, and verification capabilities. The toolchain supports both VHDL and Verilog hardware description languages, enabling designers to choose their preferred design methodology.

Configuration and Programming

The XC2S200-6FGG670C supports multiple configuration modes including Master Serial, Slave Serial, Master Parallel (SelectMAP), and JTAG Boundary Scan. This flexibility allows designers to select the optimal configuration approach based on system requirements and available resources.

Documentation and Support

Comprehensive technical documentation is available for the XC2S200-6FGG670C, including detailed datasheets, user guides, application notes, and reference designs. These resources provide guidance on PCB layout recommendations, power supply design, and configuration procedures.

Why Choose the XC2S200-6FGG670C Spartan-II FPGA

The XC2S200-6FGG670C offers several compelling advantages for embedded system designers and electronic engineers.

Cost-Effective ASIC Alternative

The XC2S200-6FGG670C provides a superior alternative to mask-programmed ASICs. Engineers avoid the substantial initial costs, lengthy development cycles, and inherent risks associated with conventional ASIC development. The FPGA’s in-system programmability permits design upgrades in the field without hardware replacement.

Fastest Speed Grade Performance

The -6 speed grade designation indicates the XC2S200-6FGG670C delivers the fastest signal propagation delays available in the Spartan-II family. This performance advantage enables higher operating frequencies and tighter timing margins for demanding applications.

Lead-Free RoHS Compliance

The FGG670 package with its “G” designation indicates lead-free, RoHS-compliant construction. This ensures the XC2S200-6FGG670C meets current environmental regulations and supports green manufacturing initiatives.

Proven Reliability

The Spartan-II architecture has demonstrated exceptional reliability across millions of deployed units worldwide. The mature 0.18-micron process technology and comprehensive qualification testing ensure consistent performance throughout the device’s operational lifetime.

XC2S200-6FGG670C Ordering and Availability

The XC2S200-6FGG670C is available through authorized AMD/Xilinx distributors worldwide. For current pricing, lead times, and volume discount information, contact your preferred electronic component supplier.

When sourcing the XC2S200-6FGG670C, verify the complete part number to ensure you receive the correct speed grade, package type, and temperature rating for your application requirements.

For more information about Spartan-II FPGA products and related programmable logic solutions, explore our comprehensive Xilinx FPGA product catalog featuring detailed specifications, application guides, and technical support resources.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.