The XC2S200-6FGG667C is a powerful Field Programmable Gate Array (FPGA) from AMD’s (formerly Xilinx) renowned Spartan-II family. This versatile programmable logic device delivers exceptional performance, robust logic capacity, and comprehensive I/O capabilities, making it an ideal solution for demanding digital design applications. As a superior alternative to mask-programmed ASICs, the XC2S200-6FGG667C offers unlimited reprogrammability, shorter development cycles, and cost-effective implementation for high-volume production.
XC2S200-6FGG667C Key Features and Benefits
The XC2S200-6FGG667C combines advanced programmable logic technology with industrial-grade reliability. Engineers and designers choose this Xilinx FPGA for its exceptional value proposition in performance-critical applications requiring flexible digital logic implementation.
Core Logic Architecture
The XC2S200-6FGG667C features a sophisticated architecture built on proven 0.18-micron CMOS technology:
| Specification |
Value |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Delay-Locked Loops (DLLs) |
4 |
Speed Grade and Performance Specifications
The “-6” speed grade designation indicates this XC2S200-6FGG667C variant is optimized for higher performance applications:
- Maximum system clock frequency up to 200 MHz
- Internal operating frequency up to 263 MHz
- Fast predictable interconnect for consistent timing
- Low-power segmented routing architecture
Package Information and Pinout
The XC2S200-6FGG667C utilizes the FGG667 Fine-Pitch Ball Grid Array (FBGA) package format:
- Package Type: Fine-Pitch BGA (FBGA)
- Pin Count: 667 balls
- Lead-Free: Yes (indicated by “G” designation)
- Temperature Range: Commercial (0°C to +85°C)
- RoHS Compliant: Lead-free packaging option
XC2S200-6FGG667C Technical Specifications
Power Supply Requirements
The XC2S200-6FGG667C operates with dual voltage rails for optimal performance and I/O flexibility:
| Power Rail |
Voltage |
Description |
| VCCINT |
2.5V |
Core logic supply |
| VCCO |
1.5V / 2.5V / 3.3V |
I/O bank supply voltage |
Supported I/O Standards
The XC2S200-6FGG667C supports 16 high-performance interface standards, enabling seamless integration with various system architectures:
- LVTTL (2-24 mA drive strength)
- LVCMOS2
- PCI (3V/5V, 33 MHz/66 MHz compliant)
- GTL and GTL+
- HSTL Class I, III, and IV
- SSTL2 and SSTL3 Class I and II
- CTT
- AGP-2X
Memory Resources
The XC2S200-6FGG667C provides flexible memory options through its SelectRAM hierarchical memory architecture:
Distributed RAM Features
- 16 bits per Look-Up Table (LUT)
- Synchronous single-port and dual-port configurations
- Total capacity: 75,264 bits
Block RAM Features
- 14 dedicated 4K-bit RAM blocks
- Configurable aspect ratios (4096×1 to 256×16)
- Fully synchronous dual-ported operation
- Independent read/write port configurations
- Built-in bus-width conversion
XC2S200-6FGG667C Applications and Use Cases
The XC2S200-6FGG667C excels in numerous application domains requiring programmable logic solutions:
Industrial Control Systems
- Motor control and drive systems
- Process automation equipment
- Programmable logic controllers (PLCs)
- Factory automation interfaces
Telecommunications Equipment
- Network interface cards
- Protocol conversion bridges
- Digital signal processing front-ends
- Communication base station infrastructure
Consumer Electronics
- Video and image processing
- Audio system controllers
- Display interface management
- Gaming peripherals
Automotive Applications
- Infotainment system controllers
- Advanced driver assistance systems (ADAS)
- Vehicle networking gateways
- Diagnostic equipment
Configuration and Programming Options
The XC2S200-6FGG667C supports multiple configuration modes for maximum design flexibility:
Configuration Modes
- Master Serial Mode: Internal oscillator drives CCLK output to external PROM
- Slave Serial Mode: External controller provides CCLK input
- Slave Parallel Mode: Fastest configuration via byte-wide data input
- Boundary-Scan Mode: JTAG-based configuration through IEEE 1149.1 TAP
Configuration File Size
The XC2S200-6FGG667C requires approximately 1,335,840 bits of configuration data storage.
Advanced Clocking with Delay-Locked Loops
The four integrated DLLs provide sophisticated clock management capabilities:
- Zero propagation delay clock distribution
- Clock multiplication (2×) and division (÷1.5 to ÷16)
- Four quadrature phase outputs (0°, 90°, 180°, 270°)
- Board-level clock deskewing capability
- Automatic delay compensation
Boundary Scan and Testing Support
The XC2S200-6FGG667C includes full IEEE 1149.1 boundary-scan compliance:
- EXTEST, SAMPLE/PRELOAD, and BYPASS instructions
- User-defined scan chains (USR1, USR2)
- Configuration and readback via JTAG
- In-system debugging capabilities
Development Tools and Software Support
The XC2S200-6FGG667C is fully supported by comprehensive development environments:
- Xilinx ISE Design Suite: Complete FPGA design flow
- Vivado Design Suite: Modern design entry and implementation
- Third-party synthesis tools: Industry-standard HDL support
- Simulation tools: Pre- and post-implementation verification
XC2S200-6FGG667C Ordering Information
Part Number Breakdown
| Element |
Code |
Meaning |
| Device |
XC2S200 |
Spartan-II, 200K gates |
| Speed Grade |
-6 |
Higher performance |
| Package |
FGG |
Fine-Pitch BGA, Pb-free |
| Pin Count |
667 |
667-ball configuration |
| Temperature |
C |
Commercial (0°C to +85°C) |
Why Choose the XC2S200-6FGG667C?
The XC2S200-6FGG667C delivers compelling advantages for design engineers:
- Cost-Effective Performance: Exceptional price-to-performance ratio for high-volume applications
- Design Flexibility: Unlimited reprogrammability enables field upgrades without hardware changes
- Reduced Time-to-Market: Eliminates lengthy ASIC development cycles and NRE costs
- Proven Reliability: Built on mature 0.18μm technology with established track record
- Comprehensive I/O Support: 16 interface standards ensure compatibility with diverse system requirements
- Advanced Clock Management: Four DLLs provide sophisticated timing control
Conclusion
The XC2S200-6FGG667C represents an optimal choice for engineers seeking a reliable, high-performance FPGA solution. With its 200,000 system gates, 5,292 logic cells, comprehensive memory resources, and versatile I/O capabilities, this Spartan-II family member delivers the flexibility and performance needed for today’s demanding digital design challenges. Whether implementing industrial control systems, telecommunications equipment, or consumer electronics applications, the XC2S200-6FGG667C provides the programmable logic foundation for success.
