The XC2S200-6FGG664C is a high-performance programmable logic device from AMD’s Spartan-II FPGA family, delivering 200,000 system gates in a 664-pin Fine-pitch Ball Grid Array (FBGA) package. This commercial-grade FPGA combines exceptional flexibility with cost-effective design implementation for embedded systems, telecommunications, and industrial control applications.
XC2S200-6FGG664C Overview and Key Features
The XC2S200-6FGG664C represents AMD’s commitment to delivering scalable, high-density programmable solutions. Built on proven 0.18/0.22µm CMOS technology with a 2.5V core voltage, this device offers an optimal balance between performance, power consumption, and integration density.
Core Architecture Specifications
| Parameter |
Specification |
| Part Number |
XC2S200-6FGG664C |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Maximum User I/O |
512 |
| Package Type |
FGG664 (Fine-pitch BGA) |
| Speed Grade |
-6 (Fastest) |
| Temperature Range |
Commercial (0°C to +85°C) |
Configurable Logic Block (CLB) Resources
The XC2S200-6FGG664C contains 1,176 Configurable Logic Blocks arranged in a 28 × 42 array. Each CLB consists of two slices, with each slice containing:
- Two 4-input function generators (LUTs)
- Carry logic for arithmetic operations
- Two storage elements (flip-flops)
- Wide function multiplexers
This architecture enables efficient implementation of both combinational and sequential logic designs.
XC2S200-6FGG664C Memory Capabilities
SelectRAM Distributed Memory
The XC2S200-6FGG664C provides substantial distributed memory resources through its SelectRAM technology:
| Memory Type |
Capacity |
| Distributed RAM Bits |
84,672 |
| Maximum Distributed RAM |
10,584 × 1 bit |
Each 4-input LUT can be configured as 16×1 single-port RAM, 16×1 dual-port RAM, or 32×1 single-port RAM using paired function generators.
Dedicated Block RAM (BlockRAM)
For applications requiring larger memory blocks, the XC2S200-6FGG664C includes:
| BlockRAM Parameter |
Value |
| Total BlockRAM Bits |
56,320 |
| Number of RAM Blocks |
14 |
| Block Size |
4,096 bits each |
Each BlockRAM block supports configurable aspect ratios including 4K×1, 2K×2, 1K×4, 512×8, and 256×16 configurations. Dual-port operation allows simultaneous read/write access with independent clocks on each port.
XC2S200-6FGG664C I/O Standards and Connectivity
Supported I/O Standards
The XC2S200-6FGG664C supports comprehensive I/O standards for maximum design flexibility:
Single-Ended Standards
- LVTTL (Low Voltage TTL)
- LVCMOS (3.3V, 2.5V, 1.8V)
- PCI (33 MHz, 3.3V)
- GTL and GTL+
Differential Standards
- LVDS (Low Voltage Differential Signaling)
- BLVDS (Bus LVDS)
- LVPECL
- SSTL2 and SSTL3 (DDR Memory Interface)
- HSTL Class I, II, III, IV
I/O Bank Architecture
The XC2S200-6FGG664C organizes its I/O resources into four independent I/O banks, each with separate VCCO power supply. This architecture enables:
- Mixed voltage operation across different banks
- Flexible interface design with multiple voltage domains
- Independent pull-up/pull-down configuration per bank
XC2S200-6FGG664C Clock Management
Delay-Locked Loop (DLL) Features
The XC2S200-6FGG664C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the device, providing:
| DLL Capability |
Specification |
| Input Frequency Range |
25 MHz to 200 MHz |
| Output Phases |
0°, 90°, 180°, 270° |
| Clock Multiplication |
1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, 16× |
| Clock Division |
1.5, 2, 2.5, 3, 4, 5, 8, 16 |
| Duty Cycle Correction |
Yes |
Global Clock Distribution
The device features four dedicated global clock networks with minimal skew across all CLBs. Primary global clock buffers (BUFGMUX) support:
- Glitch-free clock switching
- Clock enable functionality
- Low-skew distribution (<500ps typical)
XC2S200-6FGG664C Speed Grade -6 Performance
The -6 speed grade represents the fastest performance tier for the Spartan-II family, offering superior timing characteristics for demanding applications.
Timing Specifications
| Parameter |
-6 Speed Grade |
| CLB Flip-Flop Toggle Rate |
Up to 326 MHz |
| Logic Delays (Tilo) |
0.65 ns typical |
| CLB Setup Time |
0.58 ns |
| BlockRAM Access |
2.8 ns |
| I/O Register Clock-to-Out |
2.6 ns |
System Frequency Capabilities
Applications implemented on the XC2S200-6FGG664C -6 speed grade can achieve system frequencies exceeding 200 MHz, depending on design complexity and routing requirements.
XC2S200-6FGG664C Package Information
FGG664 Package Details
The FGG664 package provides a compact, high-density solution for the XC2S200-6FGG664C:
| Package Parameter |
Value |
| Package Type |
Fine-pitch Ball Grid Array |
| Total Balls |
664 |
| Ball Pitch |
1.0 mm |
| Body Size |
27 mm × 27 mm |
| Ball Matrix |
26 × 26 |
| User I/O Available |
512 |
| Mounting |
Surface Mount (SMT) |
Power Supply Requirements
| Supply Rail |
Voltage |
Function |
| VCCINT |
2.5V ±5% |
Core Logic |
| VCCO |
1.5V to 3.3V |
Output Drivers |
| VREF |
Bank-specific |
Input Reference |
XC2S200-6FGG664C Design Considerations
Configuration Options
The XC2S200-6FGG664C supports multiple configuration modes:
- Master Serial Mode
- Slave Serial Mode
- Master SelectMAP (Parallel)
- Slave SelectMAP (Parallel)
- Boundary Scan (JTAG)
Configuration data size: approximately 1,335,840 bits (including overhead).
Recommended Design Tools
For optimal development with the XC2S200-6FGG664C, AMD provides comprehensive design tool support through Vivado Design Suite (legacy ISE support) including:
- HDL synthesis and simulation
- Place and route optimization
- Static timing analysis
- Power estimation
- Bitstream generation
XC2S200-6FGG664C Applications
The XC2S200-6FGG664C excels in diverse application domains:
Telecommunications
- Protocol bridging and conversion
- Channel coding/decoding
- Digital filtering and signal processing
- Base station equipment
Industrial Control
- Motor control systems
- PLC implementation
- Sensor interface processing
- Real-time monitoring
Embedded Systems
- Co-processor implementations
- Custom peripheral controllers
- Hardware acceleration
- System-on-chip prototyping
Consumer Electronics
- Video processing
- Display interfaces
- Audio processing
- Gaming systems
Why Choose XC2S200-6FGG664C for Your Design?
The XC2S200-6FGG664C delivers compelling advantages for system designers:
High Gate Density: 200,000 system gates enable complex logic implementation without multiple devices.
Superior Speed Performance: The -6 speed grade provides fastest-in-class timing for performance-critical applications.
Flexible I/O: Support for 20+ I/O standards ensures compatibility with virtually any interface requirement.
Cost Efficiency: Spartan-II architecture delivers optimal performance-per-dollar for volume applications.
Proven Reliability: Commercial temperature range (0°C to +85°C) suits broad deployment scenarios.
For more AMD programmable logic devices and related components, explore our complete Xilinx FPGA product selection.
XC2S200-6FGG664C Ordering Information
| Part Number |
Description |
| XC2S200-6FGG664C |
Spartan-II, 200K Gates, -6 Speed, FGG664 Package, Commercial |
Related Part Numbers
| Variant |
Difference |
| XC2S200-5FGG664C |
-5 Speed Grade (Standard) |
| XC2S200-6FGG664I |
Industrial Temperature (-40°C to +100°C) |
Technical Support and Documentation
For complete electrical specifications, timing diagrams, and application notes, refer to the official AMD Spartan-II Family Data Sheet (DS001). Design engineers can access configuration guides, reference designs, and software tools through the AMD Developer Portal.
Note: XC2S200-6FGG664C specifications subject to manufacturer updates. Contact supplier for current revision documentation.
