The XC2S200-6FGG659C is a high-performance Field Programmable Gate Array (FPGA) from the renowned AMD Xilinx Spartan-II family. Featuring 200,000 system gates, 5,292 logic cells, and advanced programmable I/O capabilities, this FPGA delivers exceptional flexibility for digital design applications. The XC2S200-6FGG659C comes in a 659-ball Fine-Pitch BGA package with Pb-free (RoHS compliant) construction, making it ideal for environmentally conscious electronic designs.
XC2S200-6FGG659C Key Features and Benefits
The XC2S200-6FGG659C offers an impressive combination of logic density, memory resources, and I/O flexibility that makes it a superior alternative to traditional mask-programmed ASICs. Engineers choose this Xilinx FPGA for its cost-effectiveness, rapid development cycles, and field-programmable capabilities.
High Logic Density and Performance
The XC2S200-6FGG659C integrates substantial logic resources within a compact footprint:
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Speed Grade |
-6 (Fastest) |
Embedded Memory Architecture
This Spartan-II FPGA provides generous on-chip memory options for buffering, data processing, and temporary storage:
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| Total On-Chip Memory |
131,264 bits |
XC2S200-6FGG659C Technical Specifications
Electrical Characteristics
| Parameter |
Value |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V to 3.3V |
| Process Technology |
0.18μm |
| Maximum Frequency |
263 MHz |
| Operating Temperature |
Commercial (0°C to +85°C) |
Package Information
| Specification |
Details |
| Package Type |
FGG659 (Fine-Pitch Ball Grid Array) |
| Pin Count |
659 Balls |
| Lead-Free |
Yes (Pb-Free/RoHS Compliant) |
| Moisture Sensitivity Level |
MSL-3 |
XC2S200-6FGG659C Architecture Overview
Configurable Logic Blocks (CLBs)
The XC2S200-6FGG659C features 1,176 Configurable Logic Blocks arranged in a 28×42 array. Each CLB contains four Logic Cells (LCs), providing the fundamental building blocks for implementing custom digital circuits. The CLB architecture includes:
- RAM-based Look-Up Tables (LUTs) for logic function implementation
- Dedicated flip-flops with programmable set/reset functionality
- Fast carry logic for arithmetic operations
- Direct feedthrough paths for enhanced routing flexibility
Input/Output Block (IOB) Capabilities
The I/O architecture of the XC2S200-6FGG659C supports multiple signaling standards, enabling seamless integration with various system interfaces:
| I/O Standard |
5V Tolerant |
| LVTTL |
Yes |
| LVCMOS2 |
Yes |
| PCI |
Yes |
| GTL/GTL+ |
Supported |
| SSTL |
Supported |
| HSTL |
Supported |
The FPGA divides its I/O into eight banks, with each bank supporting independent VCCO voltages for maximum design flexibility.
Delay-Locked Loop (DLL) Technology
Four dedicated DLLs positioned at each corner of the die provide advanced clock management:
- Zero propagation delay clock distribution
- Low clock skew across the entire device
- Clock mirroring for board-level synchronization
- Programmable clock multiplication and division
XC2S200-6FGG659C Applications
The XC2S200-6FGG659C excels in diverse application areas:
Industrial Automation
- Motor control systems
- PLC implementations
- Sensor interface processing
Telecommunications
- Protocol conversion
- Data encoding/decoding
- Signal processing pipelines
Consumer Electronics
- Video processing
- Audio signal routing
- Display controllers
Embedded Systems
- Custom peripheral controllers
- State machine implementations
- Real-time data processing
XC2S200-6FGG659C Design Tools and Development Support
Software Compatibility
The XC2S200-6FGG659C is fully supported by Xilinx ISE (Integrated Software Environment) Design Suite, which provides:
- Schematic capture and HDL synthesis
- Behavioral and timing simulation
- Automatic place and route optimization
- Bitstream generation and device programming
Configuration Options
This Spartan-II FPGA supports multiple configuration modes:
| Mode |
Description |
| Master Serial |
Self-configuration from serial PROM |
| Slave Serial |
External clock-driven configuration |
| Master Parallel |
8-bit parallel data loading |
| Slave Parallel |
Microprocessor-controlled configuration |
| JTAG |
Boundary scan configuration |
XC2S200-6FGG659C Part Number Decoder
Understanding the complete part number helps ensure correct component selection:
| Code |
Meaning |
| XC2S |
Xilinx Spartan-II Family |
| 200 |
200K System Gates |
| -6 |
Speed Grade (Fastest) |
| FG |
Fine-Pitch BGA Package |
| G |
Pb-Free (Lead-Free) |
| 659 |
659-Ball Package |
| C |
Commercial Temperature Range |
Why Choose the XC2S200-6FGG659C FPGA
The XC2S200-6FGG659C stands out as a reliable programmable logic solution offering:
- Cost-Effective Development: Eliminates NRE costs associated with custom ASICs
- Rapid Time-to-Market: Reduces development cycles from months to weeks
- Field Upgradability: Supports in-system reprogramming for design updates
- Environmental Compliance: Pb-free construction meets RoHS requirements
- Proven Architecture: Based on the well-established Spartan-II platform
XC2S200-6FGG659C Ordering Information
When ordering the XC2S200-6FGG659C, verify the following specifications match your design requirements:
- Part Number: XC2S200-6FGG659C
- Manufacturer: AMD (formerly Xilinx)
- Family: Spartan-II
- Package: 659-Ball Fine-Pitch BGA (Pb-Free)
- Speed Grade: -6
- Temperature Range: Commercial (0°C to +85°C)
