The XC2S200-6FGG654C is a powerful Field Programmable Gate Array (FPGA) from the renowned Spartan-II family, engineered to deliver exceptional performance and flexibility for demanding digital design applications. This high-speed, cost-effective programmable logic device offers 200,000 system gates, making it an ideal solution for telecommunications, networking, industrial automation, and embedded system designs requiring robust signal processing capabilities.
XC2S200-6FGG654C Overview and Key Features
The XC2S200-6FGG654C represents AMD’s (formerly Xilinx) commitment to providing engineers with versatile FPGA solutions. Built on proven 0.18μm CMOS technology, this device combines high-density logic resources with advanced memory architecture and flexible I/O capabilities. Whether you’re developing prototypes or deploying production-ready systems, the XC2S200-6FGG654C delivers reliable performance backed by comprehensive design tool support.
Why Choose the XC2S200-6FGG654C?
Engineers and designers choose the XC2S200-6FGG654C for several compelling reasons:
- Cost-Effective ASIC Alternative: Eliminates high NRE costs and lengthy development cycles associated with mask-programmed ASICs
- Field Upgradability: Unlimited reprogrammability enables design modifications without hardware replacement
- High-Speed Performance: -6 speed grade delivers maximum operating frequencies for time-critical applications
- RoHS Compliant: Pb-free (lead-free) packaging meets environmental compliance requirements
- Proven Architecture: Based on the reliable Virtex FPGA architecture with streamlined feature set
For engineers seeking reliable Xilinx FPGA solutions, the XC2S200-6FGG654C offers an excellent balance of performance, features, and cost.
XC2S200-6FGG654C Technical Specifications
Core Logic Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array Configuration |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Process Technology |
0.18μm 6-Layer Metal CMOS |
Memory Architecture Specifications
| Memory Type |
Capacity |
| Distributed RAM |
75,264 bits |
| Block RAM |
56K bits |
| Block RAM Modules |
14 |
| SelectRAM Configuration |
16 bits per LUT (distributed) / 4K bit blocks |
Electrical and Operating Specifications
| Parameter |
Value |
| Core Voltage |
2.5V |
| I/O Voltage Options |
1.5V, 2.5V, 3.3V |
| Maximum Operating Frequency |
263 MHz |
| Speed Grade |
-6 (Highest Performance) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Package Type |
Fine-Pitch Ball Grid Array (FBGA) |
| RoHS Status |
Compliant (Pb-Free) |
XC2S200-6FGG654C Architecture Deep Dive
Configurable Logic Block (CLB) Structure
The XC2S200-6FGG654C features an advanced CLB architecture organized in a 28 × 42 array configuration. Each CLB contains multiple slices with 4-input look-up tables (LUTs), flip-flops, and dedicated carry logic for arithmetic operations. This hierarchical structure enables efficient implementation of complex combinational and sequential logic functions.
The CLB architecture supports:
- Fast Function Implementation: 4-input LUTs for combinational logic
- High-Speed Arithmetic: Dedicated carry chains for adders, counters, and comparators
- Cascade Functions: Wide-input function support through cascade chains
- Flexible Storage: Registers with synchronous/asynchronous set/reset capabilities
SelectRAM Hierarchical Memory System
The XC2S200-6FGG654C implements AMD’s innovative SelectRAM memory architecture, providing designers with flexible memory options:
Distributed RAM: Each LUT can be configured as a 16×1 single-port RAM, 32×1 single-port RAM, or 16×1 dual-port RAM. With 75,264 bits of distributed RAM available, designers can implement small, fast memory structures close to logic resources.
Block RAM: The device includes 14 dedicated 4K-bit block RAM modules totaling 56K bits. Each block supports various configurations including single-port and dual-port modes, with independent read and write clock domains for flexible system integration.
Clock Distribution and Delay-Locked Loops (DLLs)
Clock management is critical for high-performance FPGA designs. The XC2S200-6FGG654C incorporates four Delay-Locked Loops (DLLs) positioned at each corner of the die, providing:
- Clock De-Skew: Eliminates clock distribution delays
- Frequency Synthesis: Generates 1.5×, 2×, 2.5×, 3×, 4×, 5×, 8×, and 16× clock multipliers
- Phase Shift: Offers 0°, 90°, 180°, and 270° phase-shifted clock outputs
- Board-Level Synchronization: Clock mirroring capability for multi-chip systems
Four primary low-skew global clock distribution networks ensure minimal clock-to-output delays across the entire device.
XC2S200-6FGG654C I/O Capabilities and Interface Standards
Supported I/O Standards
The XC2S200-6FGG654C supports 16 high-performance interface standards, enabling seamless integration with diverse system components:
| Standard Category |
Supported Interfaces |
| Single-Ended |
LVTTL, LVCMOS (1.5V, 2.5V, 3.3V), PCI (3.3V) |
| Differential |
LVDS, BLVDS, LVPECL |
| Source-Synchronous |
SSTL2 Class I/II, SSTL3 Class I/II |
| High-Speed |
GTL, GTL+, HSTL Class I/II/III/IV |
PCI Bus Compliance
The XC2S200-6FGG654C is fully PCI compliant, supporting 33 MHz PCI applications at 3.3V. This makes it suitable for add-in card designs, embedded controllers, and peripheral interfaces requiring industry-standard bus connectivity.
Hot-Swap and CompactPCI Support
The device’s I/O architecture is designed for CompactPCI hot-swap applications, allowing system maintenance without power-down. This feature is essential for high-availability telecommunications and networking equipment.
XC2S200-6FGG654C Package Information
FBGA Package Characteristics
The XC2S200-6FGG654C utilizes a Fine-Pitch Ball Grid Array (FBGA) package, offering several advantages:
- High Pin Density: Maximum I/O utilization in compact footprint
- Superior Thermal Performance: Efficient heat dissipation through ball grid
- Excellent Electrical Characteristics: Short interconnect paths reduce parasitic effects
- Lead-Free Construction: “G” designation indicates RoHS-compliant Pb-free solder balls
Package Dimensions and Mounting
| Parameter |
Specification |
| Package Style |
Fine-Pitch BGA |
| Ball Pitch |
1.0 mm |
| Body Size |
23 × 23 mm |
| Mounting Type |
Surface Mount (SMD/SMT) |
XC2S200-6FGG654C Application Areas
Telecommunications Infrastructure
The XC2S200-6FGG654C excels in telecommunications applications including:
- Base station controllers and channel cards
- VoIP gateways and media converters
- SDH/SONET interface logic
- Protocol conversion and bridging
Networking Equipment
Network equipment designers leverage the XC2S200-6FGG654C for:
- Ethernet switch fabric implementation
- Router packet processing engines
- Firewall and security appliance logic
- Load balancer control systems
Industrial Automation and Control
Industrial applications benefit from the device’s reliability:
- Programmable Logic Controller (PLC) implementations
- Motor drive controllers
- Industrial communication interfaces (Profibus, CAN, Modbus)
- Machine vision preprocessing
Consumer Electronics
The cost-effective nature of the XC2S200-6FGG654C suits consumer products:
- Set-top box video processing
- Display controller implementations
- Audio processing systems
- Gaming hardware interfaces
Automotive Systems
Automotive engineers utilize the XC2S200-6FGG654C for:
- Advanced Driver Assistance Systems (ADAS) preprocessing
- Infotainment system interfaces
- Body electronics controllers
- Diagnostic system implementations
XC2S200-6FGG654C Design Tool Support
Development Environment
The XC2S200-6FGG654C is fully supported by AMD’s comprehensive development ecosystem:
- ISE Design Suite: Complete synthesis, implementation, and verification toolchain
- ModelSim/Questa: Industry-standard simulation support
- Vivado Design Suite: Modern design flow compatibility
- IP Core Libraries: Pre-verified intellectual property blocks
Configuration Options
The device supports multiple configuration modes:
- Master Serial Mode: Self-loading from external PROM
- Slave Serial Mode: Processor-controlled configuration
- Slave Parallel Mode: High-speed parallel configuration interface
- JTAG Boundary Scan: IEEE 1149.1 compliant programming and test
XC2S200-6FGG654C vs. ASIC Implementation
Advantages Over Mask-Programmed ASICs
| Factor |
XC2S200-6FGG654C |
Traditional ASIC |
| Initial Cost |
Low (no NRE) |
High NRE fees |
| Development Time |
Weeks to months |
Months to years |
| Design Risk |
Low (reprogrammable) |
High (fixed mask) |
| Field Updates |
Possible |
Impossible |
| Prototype Cost |
Minimal |
Significant |
| Volume Break-Even |
Lower volumes |
Very high volumes |
Ordering Information for XC2S200-6FGG654C
Part Number Breakdown
Understanding the XC2S200-6FGG654C part number:
- XC2S200: Spartan-II device, 200K system gates
- -6: Speed grade (highest performance level)
- FGG: Fine-pitch BGA, Pb-free packaging
- 654: Package pin count designation
- C: Commercial temperature range (0°C to +85°C)
Quality and Compliance
The XC2S200-6FGG654C meets rigorous quality standards:
- RoHS Directive compliant
- REACH regulation compliant
- ISO 9001 manufacturing standards
- AEC-Q100 automotive qualification available (selected variants)
Conclusion: XC2S200-6FGG654C as Your FPGA Solution
The XC2S200-6FGG654C stands as a proven, reliable FPGA solution for engineers demanding high performance, flexible I/O capabilities, and cost-effective implementation. With its robust 200,000 system gate capacity, comprehensive memory architecture, and extensive I/O standard support, this Spartan-II family member continues to serve mission-critical applications across telecommunications, networking, industrial, and consumer electronics sectors.
Whether replacing costly ASICs, accelerating time-to-market, or enabling field-upgradable designs, the XC2S200-6FGG654C delivers the performance and reliability that modern electronic systems demand.
