The XC2S200-6FGG643C is a powerful field-programmable gate array from AMD’s Spartan-II FPGA family. This 200,000-system-gate device delivers exceptional performance, extensive I/O capabilities, and advanced on-chip memory resources in a robust 643-pin Fine Pitch BGA package. Designed for cost-sensitive, high-volume applications, the XC2S200-6FGG643C provides an ideal solution for engineers seeking ASIC-level performance with the flexibility of programmable logic.

Key Features of XC2S200-6FGG643C Spartan-II FPGA

The XC2S200-6FGG643C combines second-generation ASIC replacement technology with industry-leading programmable architecture. This device operates at a 2.5V core voltage while supporting multiple I/O voltage standards, making it highly versatile for mixed-voltage system designs.

Superior Logic Capacity and System Gates

The XC2S200-6FGG643C offers impressive logic resources for complex digital designs:

• 200,000 system gates for comprehensive logic implementation
• 5,292 logic cells arranged in a 28 × 42 CLB array
• 1,176 Configurable Logic Blocks (CLBs) for maximum design flexibility
• 284 maximum user I/O pins enabling extensive connectivity options

Advanced On-Chip Memory Architecture

Memory-intensive applications benefit significantly from the XC2S200-6FGG643C’s hierarchical memory structure:

• 56 Kbits of Block RAM organized in 14 dedicated 4096-bit blocks
• 75,264 bits of Distributed RAM utilizing 16-bit LUT-based memory
• Dual-port RAM capability with configurable aspect ratios
• Fast interfaces supporting external RAM integration

XC2S200-6FGG643C Technical Specifications

Versatile I/O Standards Support

The XC2S200-6FGG643C supports 16 high-performance interface standards, ensuring compatibility with diverse system requirements:

Supported I/O Interfaces

• LVTTL (2-24 mA drive strength)
• LVCMOS2 (2.5V CMOS)
• PCI (3V/5V, 33 MHz/66 MHz compliant)
• GTL and GTL+ (Gunning Transceiver Logic)
• HSTL Class I, III, IV (High-Speed Transceiver Logic)
• SSTL2 and SSTL3 Class I/II (Stub Series Terminated Logic)
• CTT (Center-Tap Terminated)
• AGP-2X (Accelerated Graphics Port)

Each output buffer can source up to 24 mA and sink up to 48 mA, with independent drive strength and slew rate controls for minimizing bus transients.

Clock Management with Delay-Locked Loops

The XC2S200-6FGG643C incorporates four fully digital Delay-Locked Loop (DLL) circuits positioned at each corner of the die. These DLLs provide:

DLL Capabilities

• Zero propagation delay for system-wide clock distribution
• Low clock skew between distributed clock signals
• Clock frequency multiplication (2×)
• Clock division by factors of 1.5, 2, 2.5, 3, 4, 5, 8, or 16
• Four quadrature phase outputs (0°, 90°, 180°, 270°)
• Board-level clock deskewing through clock mirroring

Configuration Options for XC2S200-6FGG643C

The XC2S200-6FGG643C supports multiple configuration modes for maximum design flexibility:

Configuration Modes

• Master Serial Mode – FPGA controls configuration from serial PROM
• Slave Serial Mode – External source controls configuration timing
• Slave Parallel Mode – Fastest 8-bit parallel configuration
• Boundary-Scan Mode – IEEE 1149.1 JTAG-based configuration

The configuration file size of 1,335,840 bits allows storage in various nonvolatile media including serial PROMs, parallel flash, or system-level storage devices.

Applications for XC2S200-6FGG643C FPGA

The XC2S200-6FGG643C excels in numerous application domains:

Industrial and Commercial Applications

• Telecommunications infrastructure equipment
• Industrial automation and control systems
• Video and image processing systems
• Digital signal processing implementations
• High-speed data acquisition systems
• Protocol bridging and conversion
• Custom interface controllers
• Medical device instrumentation

Why Choose XC2S200-6FGG643C Over ASICs

The XC2S200-6FGG643C represents a superior alternative to mask-programmed ASICs for many applications. Key advantages include:

• Zero NRE costs – Eliminates expensive mask tooling charges
• Rapid time-to-market – No lengthy ASIC development cycles
• Field upgradability – Unlimited reprogramming capability
• Design flexibility – Modify functionality without hardware changes
• Risk reduction – Eliminate first-silicon risks common with ASICs

Development Tool Support

The XC2S200-6FGG643C is fully supported by AMD’s development ecosystem, including synthesis tools, simulation environments, and implementation software. The place-and-route algorithms support fully automatic design implementation while offering manual control options for demanding applications.

For comprehensive information about Xilinx FPGA devices and technical resources, including datasheets, application notes, and design examples, visit our resource center.

Ordering Information

The XC2S200-6FGG643C part number follows AMD’s standard nomenclature:

• XC2S200 – Device type (Spartan-II, 200K gates)
• -6 – Speed grade (Higher Performance)
• FGG643 – Package type (Pb-Free Fine Pitch BGA, 643 pins)
• C – Temperature range (Commercial: 0°C to +85°C)

Summary

The XC2S200-6FGG643C delivers the optimal balance of performance, logic density, and cost-effectiveness for high-volume programmable logic applications. With 200,000 system gates, 56 Kbits of block RAM, comprehensive I/O standard support, and advanced clock management features, this Spartan-II FPGA addresses the demanding requirements of modern digital system design. The Pb-free 643-pin BGA package ensures environmental compliance while providing robust mechanical characteristics for industrial applications.