The XC2S200-6FGG636C is a high-performance Field Programmable Gate Array (FPGA) from AMD’s renowned Spartan-II family. This versatile programmable logic device delivers exceptional value for cost-sensitive applications requiring reliable digital logic implementation. Engineers worldwide choose the XC2S200-6FGG636C for its optimal balance of logic capacity, I/O flexibility, and competitive pricing.
XC2S200-6FGG636C Overview
The XC2S200-6FGG636C belongs to the Spartan-II FPGA series, originally developed by Xilinx and now part of AMD’s extensive programmable logic portfolio. This device is specifically engineered for high-volume, cost-optimized applications where performance and reliability are paramount.
Part Number Breakdown
Understanding the XC2S200-6FGG636C part number helps engineers identify the exact device configuration:
| Segment |
Value |
Description |
| Family |
XC2S |
Spartan-II FPGA Family |
| Density |
200 |
200,000 System Gates |
| Speed Grade |
-6 |
Standard Speed Performance |
| Package Type |
FG |
Fine-pitch Ball Grid Array |
| Pin Count |
636 |
636 Ball Connections |
| Temperature |
C |
Commercial Grade (0°C to +85°C) |
Key Technical Specifications
The XC2S200-6FGG636C offers robust technical capabilities suitable for diverse embedded and industrial applications.
Logic Resources
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Maximum Flip-Flops |
5,292 |
| Maximum Distributed RAM |
57,344 bits |
Block RAM Configuration
The XC2S200-6FGG636C integrates dedicated Block SelectRAM+ memory resources for efficient on-chip data storage.
| Memory Feature |
Value |
| Block RAM Blocks |
14 |
| Block Size |
4,096 bits each |
| Total Block RAM |
56 Kbits |
| Configurations |
4K×1, 2K×2, 1K×4, 512×8, 256×16 |
Clock Management
| Clock Resource |
Quantity |
| Delay-Locked Loops (DLLs) |
4 |
| Global Clock Buffers |
4 |
| Clock Frequency Range |
Up to 200 MHz |
Package Specifications for FGG636
The FGG636 package provides maximum I/O capability for the XC2S200-6FGG636C device.
Physical Dimensions
| Dimension |
Value |
| Package Type |
Fine-pitch BGA |
| Ball Count |
636 |
| Ball Pitch |
1.0 mm |
| Body Size |
27 mm × 27 mm |
| Ball Matrix |
26 × 26 (depopulated) |
I/O Capabilities
| I/O Specification |
Value |
| Maximum User I/O |
410 |
| I/O Banks |
4 |
| Differential Pairs |
Up to 158 |
Supported I/O Standards
The XC2S200-6FGG636C supports multiple I/O standards for seamless system integration.
Single-Ended Standards
- LVTTL (3.3V Low-Voltage TTL)
- LVCMOS (3.3V, 2.5V)
- PCI 3.3V (33 MHz and 66 MHz compliant)
- GTL and GTL+
- HSTL (Class I, II, III, IV)
- SSTL (2.5V and 3.3V, Class I and II)
Differential Standards
- LVDS (Low-Voltage Differential Signaling)
- BLVDS (Bus LVDS)
- LVPECL (Low-Voltage Positive ECL)
Speed Grade Performance (-6)
The -6 speed grade designation indicates standard performance timing for the XC2S200-6FGG636C.
Timing Characteristics
| Parameter |
Typical Value |
| CLB Flip-Flop Toggle Rate |
Up to 200 MHz |
| Internal Clock Frequency |
Up to 200 MHz |
| Block RAM Speed |
Up to 200 MHz |
| I/O Toggle Rate |
Up to 380 MHz (LVDS) |
Power Supply Requirements
Proper power supply design ensures optimal XC2S200-6FGG636C operation.
Voltage Rails
| Supply |
Voltage |
Tolerance |
| VCCINT (Core) |
2.5V |
±5% |
| VCCO (I/O) |
1.5V to 3.3V |
Bank-dependent |
| VREF (Reference) |
Standard-dependent |
Per I/O standard |
Power Consumption Guidelines
- Static power consumption varies with junction temperature
- Dynamic power scales with operating frequency and toggle rates
- Power estimation tools available through AMD Vivado/ISE Design Suite
Target Applications
The XC2S200-6FGG636C excels in numerous application domains where programmable logic provides design flexibility.
Industrial Applications
- Programmable Logic Controllers (PLCs)
- Industrial automation systems
- Motor control interfaces
- Sensor data acquisition
Communications Applications
- Protocol conversion bridges
- Data packet processing
- Interface bridging (UART, SPI, I2C)
- Network switching fabrics
Consumer Electronics
- Display controllers
- Audio processing systems
- Video signal processing
- Gaming peripherals
Embedded Systems
- Microcontroller coprocessors
- Custom peripheral interfaces
- Hardware acceleration engines
- System management controllers
Development Tool Support
Engineers developing with the XC2S200-6FGG636C have access to comprehensive design tools.
Design Software
| Tool |
Purpose |
| ISE Design Suite |
Full development environment |
| Vivado (IP support) |
IP core integration |
| ModelSim/ISim |
HDL simulation |
| ChipScope |
On-chip debugging |
Design Entry Methods
- VHDL hardware description
- Verilog HDL
- Schematic capture
- IP core integration
Ordering Information
When sourcing the XC2S200-6FGG636C, verify the complete part number to ensure correct device selection.
Part Number Format
XC2S200-6FGG636C
- XC2S200: Spartan-II, 200K gates
- -6: Standard speed grade
- FG: Fine-pitch BGA package
- G636: 636-ball configuration
- C: Commercial temperature range
Quality and Compliance
- RoHS compliant options available
- Lead-free packaging available
- Manufactured to ISO 9001 standards
Why Choose XC2S200-6FGG636C
The XC2S200-6FGG636C delivers compelling advantages for design engineers seeking reliable FPGA solutions.
Cost Efficiency
This device provides excellent gate density per dollar, making it ideal for high-volume production where bill-of-materials cost is critical.
Proven Reliability
As part of the mature Spartan-II family, the XC2S200-6FGG636C benefits from years of field-proven reliability across millions of deployed units.
Design Flexibility
With 410 user I/Os and comprehensive I/O standard support, designers gain maximum flexibility in system architecture decisions.
Legacy Support
Extensive documentation, reference designs, and community support ensure long-term project sustainability.
Related FPGA Products
For projects requiring different specifications, explore the complete Xilinx FPGA product family, including alternative Spartan-II configurations and newer generation devices offering enhanced capabilities.
Technical Documentation Summary
| Document |
Description |
| DS001 |
Spartan-II Family Data Sheet |
| UG002 |
Spartan-II User Guide |
| XAPP151 |
Virtex-II PCB Design Guide |
| AN-POWER |
Power Estimation Guidelines |
Conclusion
The XC2S200-6FGG636C represents an excellent choice for engineers requiring a reliable, cost-effective FPGA solution with substantial logic resources and extensive I/O capabilities. Its proven Spartan-II architecture, combined with comprehensive development tool support, ensures successful implementation across industrial, communications, consumer, and embedded applications. The 636-ball BGA package maximizes available I/O while maintaining manageable board design complexity.
