The XC2S200-6FGG631C is a powerful Field Programmable Gate Array from AMD (formerly Xilinx) Spartan-II family. This 200K system gate FPGA delivers exceptional performance and flexibility for demanding digital design applications. Built on advanced 0.18μm CMOS technology with 2.5V core voltage, this programmable logic device serves as a superior alternative to traditional mask-programmed ASICs.
Engineers worldwide trust the Spartan-II platform for its proven reliability, comprehensive I/O support, and cost-effective implementation in industrial, telecommunications, and embedded system designs.
XC2S200-6FGG631C Key Features and Benefits
The XC2S200-6FGG631C combines advanced programmable logic architecture with industrial-grade performance specifications. This FPGA chip offers unlimited reprogrammability, enabling design upgrades in the field without hardware replacement.
Comprehensive Logic Resources
The Spartan-II XC2S200 device provides substantial logic capacity for complex digital implementations:
- 200,000 System Gates for high-density logic designs
- 5,292 Logic Cells enabling versatile function implementation
- 1,176 Configurable Logic Blocks (CLBs) arranged in an optimized array structure
- Four Logic Cells per CLB with dedicated carry logic for arithmetic functions
- 16-bit Look-Up Tables (LUTs) supporting distributed RAM configuration
High-Speed Performance Characteristics
The -6 speed grade designation indicates optimized timing parameters for demanding applications:
- Up to 263MHz internal clock frequency
- Four Delay-Locked Loops (DLLs) for advanced clock management
- Zero hold time simplifying system timing design
- Low-skew global clock distribution across four primary networks
- Clock mirroring capability for board-level synchronization
XC2S200-6FGG631C Technical Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLBs |
1,176 |
| Block RAM Bits |
57,344 |
| Distributed RAM Bits |
38,304 |
| Maximum User I/Os |
284 |
| DLLs |
4 |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V |
| Process Technology |
0.18μm CMOS |
| Package Type |
Fine-Pitch BGA (FBGA) |
| Pin Count |
631 |
| Speed Grade |
-6 (Commercial) |
| Temperature Range |
Commercial (0°C to +85°C) |
Block RAM and Memory Architecture
The XC2S200-6FGG631C incorporates a hierarchical SelectRAM memory system providing flexible storage options for various application requirements.
Dedicated Block RAM Features
Each block RAM cell delivers fully synchronous dual-ported operation:
- 4,096-bit Block RAM cells with independent control signals
- Configurable port widths supporting asymmetric data access
- Two Block RAM columns positioned along vertical edges
- 56Kb total Block RAM capacity for data buffering
- Fast interfaces optimized for external RAM connectivity
Distributed RAM Capabilities
The LUT-based distributed memory enables fine-grained storage:
- 16 bits per LUT for small memory implementations
- Synchronous RAM configuration options (16×2-bit or 32×1-bit)
- Cascade chain support for wide-input function implementation
- 38Kb total distributed RAM across the device
I/O Standards and Interface Support
The XC2S200-6FGG631C provides comprehensive I/O flexibility through its versatile Input/Output Block architecture. Each IOB supports multiple signaling standards for seamless system integration.
Supported I/O Standards
This Xilinx FPGA supports 16 high-performance interface standards:
- LVTTL – Low-Voltage Transistor-Transistor Logic (3.3V, 5V tolerant)
- LVCMOS – Low-Voltage CMOS (2.5V with 5V tolerance)
- PCI – Peripheral Component Interconnect compliant
- GTL/GTL+ – Gunning Transceiver Logic
- HSTL – High-Speed Transceiver Logic (Class I, II, III, IV)
- SSTL – Stub Series Terminated Logic (2 and 3)
- CTT – Center Tap Terminated
I/O Bank Configuration
The device organizes I/Os into independent banks for voltage flexibility:
- Eight independent VCCO supplies in FBGA packages
- Separate VREF pins per bank for differential signaling
- Hot-swap Compact PCI friendly operation
- Independent configuration for each bank voltage level
Configurable Logic Block Architecture
The XC2S200-6FGG631C CLB structure derives from the proven Virtex FPGA architecture, delivering efficient logic implementation with comprehensive routing resources.
CLB Internal Organization
Each Configurable Logic Block contains:
- Four Logic Cells (LCs) organized in two slices
- Two 4-input LUTs per slice implementing any function
- Dedicated carry logic for high-speed arithmetic
- F5/F6 multiplexers enabling 6-input functions
- Four direct feedthrough paths for local routing
Register and Flip-Flop Resources
Abundant sequential elements support complex state machines:
- Registers/latches with enable, set, and reset controls
- Edge-triggered D-type flip-flops in each Logic Cell
- Level-sensitive latch mode option
- Independent clock enable (CE) per register
Configuration and Programming Options
The XC2S200-6FGG631C supports multiple configuration modes for flexible system integration and production programming requirements.
Configuration Modes
- Master Serial Mode – Self-loading from serial PROM
- Slave Serial Mode – External controller driven
- Master SelectMAP Mode – Parallel byte-wide interface
- Slave SelectMAP Mode – External parallel configuration
- JTAG/Boundary Scan Mode – IEEE 1149.1 compliant
Configuration Features
- Unlimited reprogramming cycles with no wear-out
- In-system reconfiguration during operation
- Full readback capability for verification
- CRC checking for configuration integrity
- Daisy-chain support for multi-device systems
Development Tools and Software Support
The XC2S200-6FGG631C receives comprehensive support from the Xilinx ISE development system, providing professional-grade design tools for implementation.
Xilinx ISE Design Suite
- Fully automatic mapping, placement, and routing
- Timing-driven optimization for performance closure
- Hierarchical design support for complex projects
- Simulation integration with industry-standard tools
- Constraint editor for timing and placement control
Third-Party Tool Compatibility
- Synopsys Synplify synthesis support
- Mentor Graphics ModelSim simulation
- Cadence design flow integration
- ChipScope Pro on-chip debugging
Package Information and Mechanical Specifications
The FGG631C package provides a robust ball grid array configuration suitable for high-reliability applications.
Package Characteristics
| Specification |
Value |
| Package Type |
Fine-Pitch Ball Grid Array |
| Total Pins |
631 |
| Ball Pitch |
1.0mm |
| RoHS Compliance |
Pb-free options available |
| Moisture Sensitivity |
MSL-3 |
Thermal Specifications
- Commercial temperature range (0°C to +85°C junction)
- Industrial variants available for extended temperature
- Thermal characterization parameters per datasheet
XC2S200-6FGG631C Application Examples
The Spartan-II XC2S200-6FGG631C serves diverse application domains requiring reliable programmable logic implementation.
Industrial Control Systems
- Programmable Logic Controller (PLC) implementations
- Motor control and drive systems
- Process automation interfaces
- Industrial networking gateways
Telecommunications Equipment
- Protocol conversion bridges
- Data multiplexing systems
- Interface adaptation logic
- Timing and synchronization circuits
Embedded Systems
- Co-processor implementations
- Custom peripheral interfaces
- Real-time signal processing
- ASIC prototyping platforms
Consumer Electronics
- Video processing pipelines
- Audio codec interfaces
- Display controller logic
- USB and serial interfaces
Ordering Information and Part Number Breakdown
Understanding the XC2S200-6FGG631C part number structure ensures correct device selection.
Part Number Decode
| Segment |
Meaning |
| XC2S |
Spartan-II family designator |
| 200 |
200K system gate density |
| -6 |
Speed grade (highest performance) |
| FG |
Fine-pitch BGA package |
| G |
Pb-free (RoHS compliant) |
| 631 |
Pin count |
| C |
Commercial temperature range |
Alternative Speed Grades
- -5 Speed Grade – Standard performance, commercial/industrial
- -6 Speed Grade – High performance, commercial only
Design Considerations and Best Practices
Successful XC2S200-6FGG631C implementation requires attention to power supply, decoupling, and signal integrity guidelines.
Power Supply Requirements
- VCCINT (Core) – 2.375V to 2.625V (nominal 2.5V)
- VCCO (I/O Banks) – 1.5V, 2.5V, or 3.3V per bank
- Adequate decoupling with bulk and high-frequency capacitors
- Power sequencing considerations for multi-rail systems
PCB Layout Guidelines
- Controlled impedance traces for high-speed signals
- Reference plane integrity under signal routes
- Proper via placement for BGA breakout
- Thermal relief for power connections
Why Choose the XC2S200-6FGG631C FPGA
The XC2S200-6FGG631C delivers compelling advantages for cost-sensitive applications requiring proven technology and long-term availability.
Cost-Effective Implementation
Compared to mask-programmed ASICs, this FPGA eliminates NRE costs, reduces development cycles, and permits field upgrades impossible with fixed-function devices.
Proven Architecture
Based on the established Virtex architecture, Spartan-II devices benefit from mature design tools, extensive documentation, and worldwide engineering experience.
Flexible System Integration
With support for 16 I/O standards, flexible voltage banking, and multiple configuration modes, the XC2S200-6FGG631C adapts to diverse system requirements without compromise.
Related Documentation and Resources
- DS001 – Spartan-II FPGA Family Data Sheet
- UG331 – Spartan-II Design Guide
- XAPP151 – Virtex Series Configuration Architecture
- XAPP098 – Serial Configuration of Spartan FPGAs
