The XC2S200-6FGG630C is a high-performance Field Programmable Gate Array (FPGA) from AMD’s renowned Spartan-II family. This versatile programmable logic device delivers exceptional performance, abundant logic resources, and a comprehensive feature set at a competitive price point. Designed for demanding industrial and commercial applications, the XC2S200-6FGG630C offers engineers a reliable solution for complex digital design implementations.
Key Features of the XC2S200-6FGG630C FPGA
The XC2S200-6FGG630C combines advanced programmable logic capabilities with cost-effective implementation, making it an ideal choice for engineers seeking robust digital signal processing and control system solutions.
System Gate Capacity and Logic Resources
The XC2S200-6FGG630C features 200,000 system gates with 5,292 logic cells, providing substantial programmable resources for implementing complex digital designs. Each Configurable Logic Block (CLB) contains four Logic Cells (LCs), with each logic cell comprising a 4-input function generator, storage element, and dedicated carry logic. This architecture enables designers to implement sophisticated algorithms and control systems efficiently.
Speed Grade -6 Performance Specifications
With the -6 speed grade designation, this device represents the highest performance option in the Spartan-II family, supporting system performance up to 263 MHz. The -6 speed grade offers the fastest signal propagation delays and enhanced timing characteristics, making it suitable for time-critical applications requiring maximum throughput.
630-Pin Fine-Pitch BGA Package
The XC2S200-6FGG630C comes in a 630-pin Fine-pitch Ball Grid Array (FBGA) package, providing up to 284 user I/O pins for flexible connectivity options. The “G” designation indicates RoHS-compliant, Pb-free packaging suitable for environmentally conscious manufacturing processes.
Technical Specifications Overview
| Specification |
Value |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLBs |
1,176 |
| Maximum Block RAM |
56 Kbits (14 blocks) |
| Distributed RAM |
Up to 75,264 bits |
| DLLs |
4 |
| Maximum User I/O |
284 |
| I/O Standards Supported |
16 |
| Process Technology |
0.18µm |
| Core Voltage |
2.5V |
| Maximum Frequency |
263 MHz |
| Package Type |
FGG630 (Fine-pitch BGA) |
| Speed Grade |
-6 (Fastest) |
Block RAM Architecture and Memory Features
The XC2S200-6FGG630C incorporates 56 Kbits of dedicated Block RAM organized in 14 memory blocks. Each block RAM cell is a fully synchronous dual-ported 4,096-bit RAM with independent control signals for each port. The memory blocks support configurable port aspect ratios, allowing designers to optimize memory organization for specific applications.
Block RAM Port Configurations
| Width |
Depth |
Address Bus |
Data Bus |
| 1 |
4,096 |
ADDR[11:0] |
DATA[0] |
| 2 |
2,048 |
ADDR[10:0] |
DATA[1:0] |
| 4 |
1,024 |
ADDR[9:0] |
DATA[3:0] |
| 8 |
512 |
ADDR[8:0] |
DATA[7:0] |
| 16 |
256 |
ADDR[7:0] |
DATA[15:0] |
Distributed RAM Capabilities
In addition to Block RAM, the XC2S200-6FGG630C provides up to 75,264 bits of distributed RAM using the Look-Up Tables (LUTs) within the CLB structure. This distributed memory offers flexible, low-latency storage options for register files, FIFOs, and small data buffers.
Delay Locked Loop (DLL) Technology
The XC2S200-6FGG630C features four Delay Locked Loops (DLLs) that provide advanced clock management capabilities. These DLLs eliminate clock distribution delay, enabling zero propagation delay between external clock input and internal clock distribution. Key DLL functions include clock deskewing, frequency synthesis, and clock mirroring for improved system timing.
Flexible I/O Standards Support
The Spartan-II architecture supports 16 different I/O signaling standards, enabling seamless integration with various system components and interface requirements.
Supported I/O Standards
- LVTTL (Low Voltage TTL)
- LVCMOS (Low Voltage CMOS) – 3.3V, 2.5V
- PCI (Peripheral Component Interconnect) – 3.3V, 5V
- GTL and GTL+ (Gunning Transceiver Logic)
- HSTL (High-Speed Transceiver Logic) – Class I, II, III, IV
- SSTL (Stub Series Terminated Logic) – 2.5V, 3.3V
- CTT (Center Tap Terminated)
- AGP (Accelerated Graphics Port) – 2X
- LVDS (Low Voltage Differential Signaling)
- LVPECL (Low Voltage Positive ECL)
Applications and Use Cases
The XC2S200-6FGG630C is ideally suited for a wide range of applications requiring programmable logic solutions.
Industrial Control Systems
High-reliability industrial automation, motor control, and process monitoring systems benefit from the FPGA’s programmable architecture and wide operating temperature range.
Telecommunications Equipment
Network interface cards, protocol converters, and communication controllers leverage the device’s high-speed I/O capabilities and abundant logic resources.
Digital Signal Processing
Audio processing, video encoding, and data acquisition systems utilize the Block RAM and fast arithmetic capabilities for efficient DSP implementations.
Embedded Systems and Prototyping
Rapid prototyping platforms and embedded computing applications take advantage of in-system reprogrammability and field upgrade capabilities.
Development Tools and Design Resources
The XC2S200-6FGG630C is fully supported by comprehensive development tools and design resources from Xilinx FPGA development ecosystem.
ISE Design Suite Support
The ISE Design Suite provides complete design entry, synthesis, implementation, and verification capabilities for Spartan-II devices. VHDL and Verilog HDL support enables efficient design capture and simulation.
Configuration Options
Multiple configuration modes support flexible system architectures, including Master Serial, Slave Serial, Master Parallel, Slave Parallel, and JTAG boundary scan modes. In-system reconfiguration enables field upgrades without hardware replacement.
Why Choose the XC2S200-6FGG630C
Cost-Effective ASIC Alternative
The XC2S200-6FGG630C offers a superior alternative to mask-programmed ASICs, avoiding initial costs, lengthy development cycles, and inherent risks of conventional ASIC development. The programmable architecture permits design upgrades in the field with no hardware replacement necessary.
Proven Technology and Reliability
Built on mature 0.18µm CMOS process technology, the Spartan-II family delivers proven reliability for production applications. The device meets stringent quality standards for industrial and commercial deployments.
Fast Time-to-Market
Programmable logic architecture eliminates NRE costs and reduces development time compared to traditional ASIC flows. Design iterations can be implemented and verified rapidly without lengthy manufacturing cycles.
Ordering Information
The XC2S200-6FGG630C part number follows the standard Xilinx/AMD ordering code format:
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade (fastest performance tier)
- FGG: Fine-pitch Ball Grid Array, Pb-free
- 630: Pin count
- C: Commercial temperature range (0°C to +85°C)
Industrial temperature grade variants (-40°C to +100°C) are available with “I” suffix for applications requiring extended operating conditions.
Summary
The XC2S200-6FGG630C represents an excellent balance of performance, features, and cost-effectiveness for FPGA-based designs. With 200,000 system gates, 56 Kbits of Block RAM, four DLLs, and support for 16 I/O standards, this Spartan-II device provides engineers with a versatile platform for implementing complex digital systems. The -6 speed grade ensures maximum performance up to 263 MHz, while the 630-pin FBGA package offers abundant I/O resources for demanding interface requirements.
Whether developing industrial control systems, telecommunications equipment, or embedded computing platforms, the XC2S200-6FGG630C delivers the programmable logic capabilities needed for successful product development and deployment.
