The XC2S200-6FGG628C is a powerful field-programmable gate array (FPGA) from the AMD (formerly Xilinx) Spartan-II family. This advanced programmable logic device delivers exceptional performance, reliability, and flexibility for demanding digital design applications. Engineers seeking a cost-effective ASIC alternative will find the XC2S200-6FGG628C provides the ideal balance of gate density, I/O capability, and processing speed.
XC2S200-6FGG628C Overview and Key Features
The Spartan-II XC2S200-6FGG628C represents a superior alternative to traditional mask-programmed ASICs. This FPGA eliminates the initial cost, lengthy development cycles, and inherent risk associated with conventional ASIC designs. The device’s programmability permits design upgrades in the field without hardware replacement—a capability impossible with fixed-function ASICs.
Core Architecture Specifications
| Parameter |
Specification |
| Device Family |
Spartan-II |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 28 (784 CLBs) |
| Max Clock Frequency |
263 MHz |
| Process Technology |
0.18µm CMOS |
| Core Voltage |
2.5V |
| Package Type |
628-Pin FBGA (Fine-Pitch BGA) |
| Speed Grade |
-6 (Commercial) |
| Temperature Range |
Commercial (0°C to +85°C) |
XC2S200-6FGG628C Technical Specifications
Memory Resources
The XC2S200-6FGG628C integrates substantial on-chip memory resources that support complex data processing applications:
| Memory Type |
Capacity |
Configuration |
| Block RAM |
56 Kbits |
Fourteen 4,096-bit dual-port blocks |
| Distributed RAM |
75,264 bits |
Configurable within CLBs |
| Total SelectRAM |
131,264 bits |
Combined block and distributed |
Each block RAM cell functions as a fully synchronous dual-ported 4,096-bit RAM with independent control signals for each port. Engineers can configure the data widths of both ports independently, providing built-in flexibility for various memory architectures.
Configurable Logic Block (CLB) Architecture
The XC2S200-6FGG628C CLB architecture delivers the building blocks for implementing complex digital logic:
| CLB Feature |
Specification |
| Logic Cells per CLB |
4 |
| 4-Input LUTs |
3,136 |
| Flip-Flops |
3,136 |
| Function Generators |
4 per CLB |
| Direct Feedthrough Paths |
4 per CLB |
Each logic cell comprises a 4-input function generator, storage element, and dedicated carry logic. This architecture supports efficient implementation of both combinatorial and sequential logic functions.
Clock Management
| Clock Feature |
Specification |
| Delay-Locked Loops (DLLs) |
4 |
| Global Clock Networks |
4 primary |
| Clock Deskew |
Supported |
| Clock Mirroring |
Board-level synchronization |
The four DLLs positioned at each corner of the die provide precise clock management, deskew capabilities, and frequency synthesis for multi-clock domain designs.
XC2S200-6FGG628C I/O Capabilities
User I/O Configuration
The 628-pin FBGA package maximizes available I/O resources for high-connectivity applications:
| I/O Parameter |
Specification |
| Maximum User I/Os |
284+ |
| I/O Banks |
4 |
| Global Clock Inputs |
4 (usable as additional I/O) |
| SelectI/O Standards |
16+ |
Supported I/O Standards
The XC2S200-6FGG628C supports a comprehensive range of I/O signaling standards:
| Standard Category |
Supported Standards |
| Single-Ended |
LVTTL, LVCMOS (3.3V, 2.5V, 1.8V) |
| Differential |
LVDS, BLVDS, LVPECL |
| Memory Interface |
SSTL3 (Class I & II), GTL, GTL+ |
| High-Speed |
HSTL (Class I, II, III, IV) |
Each I/O bank supports independent VCCO voltage selection, enabling seamless interfacing with mixed-voltage systems.
XC2S200-6FGG628C Package Information
FGG628 Package Specifications
| Package Parameter |
Specification |
| Package Type |
Fine-Pitch Ball Grid Array |
| Total Pins |
628 |
| Ball Pitch |
1.0 mm |
| Pb-Free |
Yes (indicated by “G” in part number) |
| Thermal Resistance (θJA) |
Application-dependent |
The “G” designation in the part number indicates RoHS-compliant Pb-free (lead-free) packaging, meeting environmental regulations for electronic components.
XC2S200-6FGG628C Ordering Information Decoder
Understanding the XC2S200-6FGG628C part number structure:
| Code Segment |
Meaning |
| XC2S |
Spartan-II family identifier |
| 200 |
200,000 system gates |
| -6 |
Speed grade 6 (fastest commercial) |
| FG |
Fine-pitch BGA package |
| G |
Pb-free (Green) packaging |
| 628 |
Pin count |
| C |
Commercial temperature range |
XC2S200-6FGG628C Applications
The XC2S200-6FGG628C excels in applications requiring high-speed processing, flexible I/O, and cost-effective implementation:
Industrial Automation
- Programmable logic controllers (PLCs)
- Motor drive control systems
- Factory automation equipment
- Sensor data acquisition and processing
Telecommunications
- Protocol conversion bridges
- Data packet processing
- Base station infrastructure
- Network switching equipment
Consumer Electronics
- Display controllers
- Audio/video processing
- Gaming peripherals
- Set-top box designs
Embedded Systems
- Custom processor interfaces
- Peripheral expansion
- Real-time control systems
- Hardware acceleration modules
XC2S200-6FGG628C Development Tools and Resources
Software Development Environment
The XC2S200-6FGG628C is fully supported by the AMD (Xilinx) ISE Design Suite, providing comprehensive design capabilities:
| Tool Category |
Features |
| Design Entry |
Schematic capture, HDL (VHDL/Verilog) |
| Synthesis |
XST integrated synthesis |
| Implementation |
Place and route optimization |
| Simulation |
Behavioral and timing simulation |
| Verification |
ChipScope Pro debugging |
Configuration Options
| Configuration Mode |
Description |
| Master Serial |
FPGA controls PROM timing |
| Slave Serial |
External controller provides clock |
| Slave Parallel |
8-bit data interface |
| JTAG |
Boundary scan configuration |
XC2S200-6FGG628C vs. ASIC: Cost-Benefit Analysis
Advantages Over Traditional ASICs
| Factor |
FPGA Advantage |
| Development Time |
Weeks vs. months |
| NRE Costs |
Minimal vs. substantial |
| Design Risk |
Low—field-reprogrammable |
| Time-to-Market |
Significantly faster |
| Volume Flexibility |
Economical at any volume |
| Field Upgrades |
Supported without hardware changes |
XC2S200-6FGG628C Quality and Compliance
Standards Compliance
| Standard |
Status |
| RoHS |
Compliant (Pb-free package) |
| REACH |
Compliant |
| ISO 9001 |
Manufacturing certified |
Reliability Data
The Spartan-II family undergoes rigorous qualification testing to ensure long-term reliability in demanding applications.
Technical Documentation
Engineers working with the XC2S200-6FGG628C should reference the following documentation:
| Document |
Description |
| DS001 |
Spartan-II FPGA Family Data Sheet |
| UG002 |
Spartan-II Development Kit User Guide |
| XAPP098 |
Low-Cost Serial Configuration |
| XAPP138 |
Spartan-II Configuration Guide |
Related Products and Alternatives
For engineers evaluating the XC2S200-6FGG628C, consider these related Xilinx FPGA options based on your specific requirements:
| Part Number |
Gates |
Package |
Key Difference |
| XC2S200-5FGG456C |
200K |
456-FBGA |
Slower speed grade, fewer pins |
| XC2S150-6FGG456C |
150K |
456-FBGA |
Lower gate count |
| XC2S300-6FGG456C |
300K |
456-FBGA |
Higher gate count |
Summary: Why Choose the XC2S200-6FGG628C
The XC2S200-6FGG628C delivers an optimal combination of features for mid-range FPGA applications:
- 200,000 system gates provide substantial logic resources
- 5,292 logic cells enable complex design implementation
- 263 MHz operation supports high-speed processing requirements
- 628-pin FBGA package maximizes I/O connectivity
- 56 Kbit block RAM plus distributed RAM for flexible memory architectures
- Four DLLs ensure precise clock management
- RoHS-compliant Pb-free packaging meets environmental standards
- Commercial temperature range suits industrial applications
The XC2S200-6FGG628C represents a proven, reliable solution for engineers requiring programmable logic in a feature-rich package. Its combination of gate density, memory resources, I/O capability, and development tool support makes it an excellent choice for industrial, telecommunications, and embedded applications.
