The XC2S200-6FGG619C is a powerful field-programmable gate array (FPGA) from the acclaimed Spartan-II family. Originally developed by Xilinx and now part of AMD’s extensive semiconductor portfolio, this device delivers exceptional performance for cost-sensitive applications. Engineers and designers worldwide trust the XC2S200-6FGG619C for its reliability, flexibility, and robust feature set.

This FPGA belongs to the second generation of the Spartan series. It offers an optimal balance between logic density and power consumption. The device targets applications where performance matters without breaking the budget. From telecommunications equipment to industrial automation systems, the XC2S200-6FGG619C proves its versatility across multiple sectors.

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Key Features and Specifications of XC2S200-6FGG619C

Logic Resources and System Gates

The XC2S200-6FGG619C incorporates 200,000 system gates within its architecture. This substantial gate count enables complex digital logic implementations. The device contains 5,292 logic cells organized in a highly efficient CLB (Configurable Logic Block) array.

Each CLB comprises multiple slices containing look-up tables (LUTs) and flip-flops. This architecture allows designers to implement both combinational and sequential logic efficiently. The CLB array supports various design methodologies including RTL synthesis and schematic capture.

Memory Architecture

Memory resources in the XC2S200-6FGG619C include both distributed and block RAM options:

Block RAM operates as dedicated memory resources. These blocks support synchronous read and write operations. Distributed RAM utilizes LUT resources for smaller memory requirements. Both memory types offer true dual-port capabilities for simultaneous access.

Clock Management with Digital DLLs

The XC2S200-6FGG619C features four Digital Locked Loops (DLLs) for advanced clock management. These DLLs provide:

• Clock deskew and distribution
• Frequency synthesis (multiply/divide)
• Phase shifting capabilities
• Duty cycle correction

Clock management ensures signal integrity across the entire device. The DLLs eliminate clock skew between different regions of the FPGA. This feature proves essential for high-speed synchronous designs.

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Package Information: FGG619C Fine-Pitch BGA

Physical Characteristics

The “FGG619C” designation indicates the package type for this Xilinx FPGA. Here is what each component means:

• FG: Fine-pitch Ball Grid Array (FBGA)
• G: Lead-free (RoHS compliant)
• 619: Total ball count
• C: Commercial temperature grade (0°C to +85°C)

This BGA package offers excellent thermal performance and signal integrity. The fine-pitch ball arrangement enables high pin density in a compact footprint. Lead-free construction ensures compliance with environmental regulations.

Pin Configuration and I/O Banks

The XC2S200-6FGG619C organizes its I/O resources into multiple banks. Each bank supports independent voltage levels. This banking structure enables interfacing with multiple voltage domains simultaneously.

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Speed Grade and Performance Metrics

Understanding the -6 Speed Grade

The “-6” in XC2S200-6FGG619C denotes the speed grade classification. Speed grades indicate relative performance levels within the same device family. The -6 grade represents the standard speed option in the Spartan-II lineup.

Performance specifications for the -6 speed grade include:

Timing Advantages

The XC2S200-6FGG619C delivers consistent timing performance across temperature ranges. Its architecture minimizes routing delays through optimized interconnect structures. Designers can achieve predictable timing closure even in complex designs.

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Supported I/O Standards for XC2S200-6FGG619C

Single-Ended Standards

The XC2S200-6FGG619C supports numerous single-ended I/O standards:

• LVTTL: Low-Voltage TTL (3.3V)
• LVCMOS: Low-Voltage CMOS (2.5V, 3.3V)
• PCI: Peripheral Component Interconnect (3.3V, 5V tolerant)
• GTL/GTL+: Gunning Transceiver Logic

High-Speed Interface Standards

For demanding high-speed applications, the device supports:

• SSTL: Stub Series Terminated Logic (Class I and II)
• HSTL: High-Speed Transceiver Logic (Class I, II, III, IV)
• CTT: Center-Tapped Termination
• AGP: Accelerated Graphics Port (1X, 2X modes)

This comprehensive I/O support enables seamless integration with DDR memory, high-speed buses, and various peripheral devices.

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Typical Applications for XC2S200-6FGG619C FPGA

Telecommunications Equipment

The XC2S200-6FGG619C excels in telecom applications requiring signal processing capabilities. Common implementations include:

• Base station controllers
• Network switches and routers
• Protocol converters
• Framing and multiplexing circuits

Industrial Automation

Manufacturing and industrial systems benefit from this FPGA’s reliability:

• Motor control units
• PLC (Programmable Logic Controller) implementations
• Sensor interface modules
• Real-time monitoring systems

Consumer Electronics

Cost-effective solutions for consumer markets include:

• Set-top boxes
• Digital video processing
• Audio equipment
• Gaming peripherals

Embedded Systems

The XC2S200-6FGG619C serves embedded applications requiring:

• Custom peripheral interfaces
• Hardware acceleration
• Protocol bridging
• System-on-chip prototyping

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Configuration and Programming Options

Configuration Modes

The XC2S200-6FGG619C supports multiple configuration modes for flexibility:

Configuration Storage

External configuration memory options include:

• Xilinx Platform Flash PROMs
• Standard serial EEPROMs
• Microcontroller-based loading
• JTAG boundary scan programming

Configuration data remains volatile in the FPGA. Therefore, external storage ensures reliable boot-up after power cycles.

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Design Tools and Development Support

Software Ecosystem

Designers working with the XC2S200-6FGG619C can utilize comprehensive development tools:

• ISE Design Suite: Complete FPGA design environment
• Vivado (for newer projects with migration path)
• ModelSim: Functional simulation
• ChipScope Pro: On-chip debugging

IP Core Availability

Pre-verified IP cores accelerate development:

• UART, SPI, I2C interfaces
• Memory controllers
• DSP building blocks
• Bus interfaces (PCI, Wishbone)

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Ordering Information and Part Number Breakdown

Decoding XC2S200-6FGG619C

Understanding the complete part number helps procurement:

Availability and Sourcing

The XC2S200-6FGG619C remains available through authorized distributors and specialized component suppliers. When sourcing this device, verify authenticity through proper channels. Counterfeit components pose risks to product reliability and safety.

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Technical Specifications Summary

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Why Choose XC2S200-6FGG619C for Your Next Project?

The XC2S200-6FGG619C delivers proven performance backed by decades of field deployment. Its mature architecture ensures stable, reliable operation in demanding environments. The extensive ecosystem of design tools and IP cores reduces development time significantly.

Cost-effectiveness makes this device attractive for volume production. The Spartan-II family has established itself as an industry workhorse. Many legacy designs continue to rely on these devices for their consistent performance.

Whether upgrading existing systems or developing new products, the XC2S200-6FGG619C offers a solid foundation. Its combination of logic density, memory resources, and I/O flexibility addresses diverse application requirements efficiently.

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Conclusion

The XC2S200-6FGG619C represents a reliable choice for engineers requiring proven FPGA technology. Its 200,000 system gates, 5,292 logic cells, and comprehensive I/O support enable versatile implementations. The commercial temperature grade and lead-free package ensure modern compliance standards.

From telecommunications to industrial automation, this Spartan-II FPGA continues serving critical applications worldwide. Its mature ecosystem and established supply chain provide confidence for long-term product planning.