Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG618C: High-Performance Spartan-II FPGA for Advanced Digital Design

Product Details

The XC2S200-6FGG618C is a powerful Field Programmable Gate Array (FPGA) from AMD’s renowned Spartan-II family, delivering exceptional performance for demanding digital design applications. This high-density programmable logic device combines 200,000 system gates with advanced 0.18-micron CMOS technology, offering engineers a cost-effective and versatile solution for complex embedded systems, telecommunications equipment, and industrial control applications.

XC2S200-6FGG618C Key Features and Specifications

The XC2S200-6FGG618C stands out in the programmable logic market with its impressive combination of logic density, speed performance, and flexible I/O capabilities.

Core Architecture Specifications

Parameter Specification
Device Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 × 42
Total CLBs 1,176
Maximum User I/O 284
Speed Grade -6 (Higher Performance)
Package Type FGG618 (Fine-Pitch BGA)
Process Technology 0.18μm CMOS
Core Voltage (VCCINT) 2.5V

Memory Resources

Memory Type Capacity
Distributed RAM 75,264 bits
Block RAM 56K bits (14 blocks × 4K bits)
SelectRAM Configuration 16 bits/LUT

XC2S200-6FGG618C Speed Grade Performance

The -6 speed grade designation indicates this device operates at higher performance levels compared to standard variants. Engineers selecting the XC2S200-6FGG618C benefit from:

  • Maximum System Frequency: Up to 263 MHz internal clock rates
  • Enhanced Timing Performance: Optimized for time-critical applications
  • Commercial Temperature Range: 0°C to +85°C (TJ)

Advanced I/O Capabilities of the XC2S200-6FGG618C

The XC2S200-6FGG618C features versatile input/output blocks supporting 16 high-performance interface standards, making it ideal for multi-protocol system designs.

Supported I/O Standards

  • LVTTL (2-24 mA drive strength)
  • LVCMOS2 (2.5V CMOS)
  • PCI (3V/5V, 33 MHz/66 MHz compliant)
  • GTL/GTL+ (Gunning Transceiver Logic)
  • HSTL Class I/III/IV (High-Speed Transceiver Logic)
  • SSTL2/SSTL3 Class I and II (Stub Series Terminated Logic)
  • CTT (Center Tap Terminated)
  • AGP-2X (Accelerated Graphics Port)

I/O Banking Structure

The XC2S200-6FGG618C organizes I/O resources into eight independent banks, enabling mixed-voltage designs with flexible VCCO and VREF configurations. This architecture supports simultaneous operation of multiple I/O standards within a single design.

XC2S200-6FGG618C Functional Block Description

Configurable Logic Blocks (CLBs)

Each CLB contains four Logic Cells (LCs) organized in two slices. The XC2S200-6FGG618C provides:

  • 4-input Look-Up Tables (LUTs): Implement any Boolean function
  • Dedicated Carry Logic: High-speed arithmetic operations
  • Cascade Chains: Wide-input function implementation
  • Storage Elements: Edge-triggered D-type flip-flops or level-sensitive latches
  • F5/F6 Multiplexers: 5-input and 6-input function generators

Block RAM Architecture

The XC2S200-6FGG618C includes 14 dedicated 4,096-bit block RAM modules featuring:

  • Dual-Port Operation: Independent read/write access
  • Flexible Aspect Ratios: 4096×1 to 256×16 configurations
  • Synchronous Operation: Full clock synchronization
  • Built-in Bus Width Conversion: Automatic data width matching

Clock Management with DLLs

Four Delay-Locked Loops (DLLs) provide sophisticated clock management:

  • Zero propagation delay clock distribution
  • Clock multiplication (2×) and division (÷1.5 to ÷16)
  • Four quadrature phase outputs (0°, 90°, 180°, 270°)
  • Duty cycle correction
  • Board-level clock deskewing capability

XC2S200-6FGG618C Configuration Options

The XC2S200-6FGG618C supports multiple configuration modes for flexible system integration:

Configuration Modes

Mode CCLK Direction Data Width
Master Serial Output 1-bit
Slave Serial Input 1-bit
Slave Parallel Input 8-bit
Boundary Scan (JTAG) N/A 1-bit

Configuration File Size

The XC2S200-6FGG618C requires 1,335,840 bits of configuration data, compatible with various external storage options including serial PROMs, parallel Flash, and processor-controlled loading.

Target Applications for XC2S200-6FGG618C

The XC2S200-6FGG618C excels in numerous application domains:

Telecommunications Infrastructure

  • Base station signal processing
  • Network routing and switching
  • Protocol conversion bridges
  • Channel coding/decoding

Industrial Control Systems

  • Motor drive controllers
  • PLC co-processors
  • Sensor interface modules
  • Real-time control algorithms

Consumer Electronics

  • Video processing pipelines
  • Audio codec implementation
  • Display controllers
  • Gaming peripherals

Data Communications

  • Ethernet MAC implementation
  • UART/SPI/I2C interfaces
  • FIFO buffer management
  • Protocol analyzers

XC2S200-6FGG618C Design Advantages

Superior ASIC Alternative

The XC2S200-6FGG618C eliminates traditional ASIC limitations:

  • No NRE Costs: Zero initial development investment
  • Rapid Prototyping: Immediate design verification
  • Field Upgradability: In-system reprogramming capability
  • Risk Mitigation: Unlimited design iterations

Development Tool Support

Fully supported by Xilinx ISE Design Suite featuring:

  • Automatic mapping, placement, and routing
  • Timing-driven implementation
  • Comprehensive simulation capabilities
  • Over 400 library primitives and macros

XC2S200-6FGG618C Ordering Information

When ordering the XC2S200-6FGG618C, the part number decodes as follows:

  • XC2S200: Spartan-II 200K gate device
  • -6: Higher performance speed grade
  • FGG: Fine-pitch BGA, Pb-free package
  • 618: 618-pin package
  • C: Commercial temperature range (0°C to +85°C)

Why Choose the XC2S200-6FGG618C for Your Next Project?

The XC2S200-6FGG618C delivers an optimal balance of performance, density, and cost-effectiveness for mid-range FPGA applications. Its combination of 200,000 system gates, 56K bits of block RAM, and support for 16 I/O standards makes it an excellent choice for designs requiring high integration density without the complexity of larger device families.

For engineers seeking reliable Xilinx FPGA solutions with proven silicon maturity, the XC2S200-6FGG618C offers a stable platform backed by comprehensive documentation and development tools.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.