The XC2S200-6FGG613C is a powerful field-programmable gate array (FPGA) from AMD’s proven Spartan-II family. This versatile programmable logic device delivers exceptional performance and reliability for demanding industrial, telecommunications, and commercial applications. Featuring 200,000 system gates and the fastest -6 speed grade, the XC2S200-6FGG613C provides engineers with a cost-effective solution for complex digital designs without the lengthy development cycles of traditional ASICs.

XC2S200-6FGG613C Technical Specifications

The XC2S200-6FGG613C combines advanced programmable logic capabilities with comprehensive I/O support, making it ideal for high-density applications requiring maximum pin connectivity.

Core Architecture Specifications

Package and Performance Details

Key Features of the XC2S200-6FGG613C Spartan-II FPGA

Advanced Programmable Logic Architecture

The XC2S200-6FGG613C utilizes AMD’s proven Spartan-II architecture, featuring a regular and flexible structure of Configurable Logic Blocks surrounded by programmable Input/Output Blocks (IOBs). Each CLB contains four Logic Cells (LCs), providing the building blocks for implementing complex digital functions including registers, arithmetic operations, and combinatorial logic.

High-Capacity On-Chip Memory Resources

This Xilinx FPGA includes two types of on-chip memory to meet diverse application requirements. The distributed RAM (75,264 bits) enables fast, local storage within the CLB array, while the dedicated Block RAM (56 Kbits across 14 blocks) provides larger, dual-port memory structures ideal for FIFO buffers, data caching, and signal processing applications.

Superior Clock Management with Four DLLs

The XC2S200-6FGG613C integrates four Delay-Locked Loops (DLLs), one at each corner of the die, providing advanced clock management capabilities. These DLLs eliminate clock distribution delays, multiply or divide incoming clock frequencies, and enable precise phase shifting for optimal system timing. The DLL architecture also supports clock mirroring for board-level clock deskewing across multiple FPGA devices.

Comprehensive I/O Standard Support

The XC2S200-6FGG613C supports 16 different I/O standards, providing maximum interface flexibility:

• LVTTL – Low-Voltage TTL (5V tolerant)
• LVCMOS – Low-Voltage CMOS (1.8V, 2.5V, 3.3V)
• PCI33_5 – PCI Local Bus (5V tolerant)
• GTL/GTL+ – Gunning Transceiver Logic
• HSTL – High-Speed Transceiver Logic (Class I, II, III, IV)
• SSTL – Stub Series Terminated Logic (2.5V, 3.3V)
• CTT – Center-Tapped Terminated
• AGP – Accelerated Graphics Port

XC2S200-6FGG613C FPGA Applications

Telecommunications Equipment

The high-speed performance and extensive I/O capabilities of the XC2S200-6FGG613C make it ideal for telecommunications infrastructure, including network switches, routers, base station controllers, and broadband access equipment.

Industrial Automation and Control Systems

With its robust architecture and commercial temperature rating, the XC2S200-6FGG613C excels in industrial control applications such as motor drives, PLC implementations, process automation, and machine vision systems.

Digital Signal Processing

The combination of fast logic cells, dedicated Block RAM, and DLL-based clock management enables efficient implementation of DSP algorithms including FIR/IIR filters, FFT processors, and real-time data acquisition systems.

Consumer Electronics and Embedded Systems

The XC2S200-6FGG613C provides cost-effective programmable logic for high-volume consumer applications including video processing, display controllers, audio systems, and smart device interfaces.

Prototyping and ASIC Replacement

As a superior alternative to mask-programmed ASICs, the XC2S200-6FGG613C eliminates initial NRE costs, reduces development cycles, and enables in-field upgrades without hardware replacement.

XC2S200-6FGG613C Ordering Information

Part Number Breakdown

Speed Grade Selection Guide

The -6 speed grade designation indicates the highest performance variant available for the XC2S200 device family. This speed grade is exclusively offered in the commercial temperature range, providing optimal performance for applications where maximum clock speeds and minimum propagation delays are critical.

Development Tools and Support

Compatible Design Software

The XC2S200-6FGG613C is fully supported by AMD Xilinx ISE Design Suite, providing comprehensive design entry, synthesis, implementation, and verification capabilities. Engineers can leverage VHDL, Verilog, or schematic capture for design entry, with advanced place-and-route algorithms ensuring optimal timing closure.

Configuration Options

Multiple configuration modes are supported including:

• Master Serial Mode – Self-loading from serial PROM
• Slave Serial Mode – Daisy-chain configuration
• Slave Parallel Mode – 8-bit processor interface
• JTAG/Boundary Scan – IEEE 1149.1 compliant programming

Available Documentation

• Complete datasheet (DS001)
• Pinout tables and package drawings
• Application notes for common design patterns
• Configuration and readback guides
• PCB design guidelines

Why Choose the XC2S200-6FGG613C FPGA

The XC2S200-6FGG613C represents an optimal balance of performance, I/O density, and cost-effectiveness for mid-range FPGA applications. Key advantages include:

• Maximum I/O Connectivity – 613-pin BGA package with 284 user I/Os
• Fastest Speed Grade – -6 designation for highest performance
• Lead-Free Packaging – RoHS compliant, environmentally responsible
• Proven Architecture – Billions of units deployed in field applications
• In-System Programmability – JTAG interface for convenient updates
• 5V Tolerance – Direct interface to legacy 5V logic systems
• Cost-Effective – Superior alternative to custom ASIC development

XC2S200-6FGG613C Availability and Procurement

For current pricing, stock availability, and volume discount information on the XC2S200-6FGG613C, contact authorized AMD distributors. Design engineers can request evaluation samples and development kits to accelerate product development timelines.