The XC2S200-6FGG610C is a high-density field-programmable gate array (FPGA) from AMD’s proven Spartan-II family. This powerful programmable logic device delivers exceptional performance for demanding digital design applications, offering engineers a cost-effective alternative to traditional mask-programmed ASICs.
XC2S200-6FGG610C Key Features and Benefits
The XC2S200-6FGG610C combines robust architecture with advanced programmable capabilities, making it ideal for complex embedded systems and signal processing applications.
Superior Logic Density and System Gates
The XC2S200-6FGG610C provides 200,000 system gates with 5,292 logic cells, enabling implementation of sophisticated digital designs. The device features a 28 × 42 CLB array comprising 1,176 configurable logic blocks (CLBs), delivering ample resources for even the most demanding applications.
Advanced Memory Architecture
This Spartan-II FPGA offers a hierarchical SelectRAM™ memory system:
- Distributed RAM: 75,264 bits (16 bits per LUT)
- Block RAM: 56 Kbits of dual-ported synchronous RAM
- Flexible Configuration: Single-port RAM, dual-port RAM, or ROM modes
High-Speed Performance Specifications
The -6 speed grade designation indicates this is the highest performance variant in the Spartan-II family:
- Maximum System Frequency: Up to 263 MHz
- Fast Predictable Interconnect: Ensures timing consistency across design iterations
- Four Delay-Locked Loops (DLLs): For precise clock management and deskewing
XC2S200-6FGG610C Technical Specifications
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/Os |
284 |
| Distributed RAM |
75,264 bits |
| Block RAM |
56 Kbits |
| DLLs |
4 |
| Process Technology |
0.18µm |
| Core Voltage |
2.5V |
| Speed Grade |
-6 (Fastest) |
| Package |
FGG (Fine-Pitch BGA, Pb-Free) |
| Temperature Range |
Commercial (0°C to +85°C) |
XC2S200-6FGG610C Package Information
The FGG610 package offers a fine-pitch ball grid array (BGA) configuration with Pb-free (lead-free) construction, indicated by the “G” designation in the part number. This RoHS-compliant packaging ensures environmental compliance while maintaining excellent thermal performance and signal integrity.
Package Benefits
- High Pin Count: Maximum I/O availability for complex designs
- Fine-Pitch BGA: Optimized PCB space utilization
- Lead-Free Construction: RoHS and WEEE compliant
- Excellent Thermal Performance: Efficient heat dissipation
XC2S200-6FGG610C Architecture Overview
Configurable Logic Blocks (CLBs)
Each CLB in the XC2S200-6FGG610C contains four logic cells (LCs), serving as the fundamental building blocks. Every logic cell comprises:
- 4-input function generator (Look-Up Table)
- Storage element (flip-flop or latch)
- Dedicated carry logic for arithmetic operations
- Direct feedthrough paths for additional routing flexibility
Input/Output Blocks (IOBs)
The XC2S200-6FGG610C IOBs support 16 selectable I/O standards, including:
- LVTTL and LVCMOS (3.3V, 2.5V, 1.5V)
- PCI Local Bus compliant
- GTL and GTL+
- SSTL and HSTL
- 5V tolerant inputs
Each IOB features three registers configurable as D-type flip-flops or level-sensitive latches, with independent clock enable signals.
Block RAM Structure
The dual-ported 4096-bit block RAM cells offer:
- Independent port configurations
- Synchronous operation
- Configurable data widths per port
- Column-based organization for efficient routing
XC2S200-6FGG610C Application Areas
The XC2S200-6FGG610C excels in numerous industrial and commercial applications:
Digital Signal Processing (DSP)
- Audio and video processing
- Communications signal processing
- Data acquisition systems
Embedded Systems
- Industrial control systems
- Motor drive controllers
- Process automation
Communications
- Protocol conversion
- Interface bridging
- Network processing
Prototyping and Development
- ASIC prototyping
- Algorithm verification
- Hardware-software co-design
XC2S200-6FGG610C vs. ASIC: Key Advantages
The XC2S200-6FGG610C offers significant benefits over traditional ASIC implementations:
- No NRE Costs: Eliminates expensive mask charges
- Rapid Prototyping: Immediate hardware verification
- Field Upgradability: In-system reprogramming capability
- Reduced Time-to-Market: Faster development cycles
- Lower Risk: Design changes without hardware replacement
XC2S200-6FGG610C Development Tools and Support
Design Software Compatibility
The XC2S200-6FGG610C is supported by the Xilinx ISE Design Suite, offering:
- Automatic place and route
- Timing analysis and optimization
- Simulation and verification tools
- Configuration file generation
Configuration Options
Multiple configuration modes support various system architectures:
- Master Serial Mode (with external PROM)
- Slave Serial Mode
- Slave Parallel Mode
- Boundary Scan (JTAG) configuration
Where to Buy XC2S200-6FGG610C FPGA Components
For engineers seeking reliable Spartan-II FPGA solutions, authorized distributors offer competitive pricing and technical support. Browse our complete Xilinx FPGA selection for additional high-performance programmable logic options.
XC2S200-6FGG610C Ordering Information
Part Number Breakdown
XC2S200-6FGG610C decodes as:
- XC2S: Spartan-II family identifier
- 200: 200,000 system gates
- -6: Speed grade (highest performance)
- FGG: Fine-pitch BGA, Pb-free package
- 610: Pin count
- C: Commercial temperature range
XC2S200-6FGG610C: Conclusion
The XC2S200-6FGG610C represents an excellent choice for engineers requiring a high-density, high-performance FPGA solution. With its 200,000 system gates, 5,292 logic cells, and comprehensive I/O support, this Spartan-II device delivers the programmable logic resources needed for demanding industrial applications—all backed by AMD’s proven reliability and extensive design ecosystem.
Whether developing digital signal processing systems, embedded controllers, or communication interfaces, the XC2S200-6FGG610C provides the flexibility, performance, and cost-effectiveness that modern electronic designs demand.
