Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

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Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG609C AMD Xilinx Spartan-II FPGA | High-Performance Programmable Gate Array

Product Details

The XC2S200-6FGG609C is a high-performance Field Programmable Gate Array (FPGA) from AMD Xilinx’s renowned Spartan-II family. Designed for cost-effective, high-speed digital applications, this 200,000 system gate FPGA delivers exceptional performance at 263MHz while offering unlimited reprogrammability. Whether you’re developing telecommunications equipment, industrial control systems, or embedded computing solutions, the XC2S200-6FGG609C provides the flexibility and reliability your projects demand.


XC2S200-6FGG609C Key Features and Benefits

The XC2S200-6FGG609C stands out as a superior alternative to traditional mask-programmed ASICs. Unlike conventional ASICs, this Xilinx FPGA eliminates lengthy development cycles, reduces initial costs, and removes the inherent risks associated with fixed-function devices.

Advanced Architecture Specifications

Built on AMD Xilinx’s proven 0.18-micron process technology, the XC2S200-6FGG609C integrates advanced features that make it ideal for demanding applications:

  • 200,000 System Gates for complex digital logic implementation
  • 5,292 Logic Cells providing extensive design flexibility
  • 1,176 Configurable Logic Blocks (CLBs) arranged in a 28 × 42 array
  • Up to 284 User I/O Pins supporting diverse interface requirements
  • Speed Grade -6 for higher performance applications

Integrated Memory Resources

The XC2S200-6FGG609C offers a hierarchical memory architecture that sets it apart from competing solutions:

Memory Type Capacity Description
Block RAM 56 Kbits 14 dedicated 4096-bit blocks
Distributed RAM 75,264 bits 16 bits per LUT for flexible storage
Total RAM 131,264 bits Combined on-chip memory resources

XC2S200-6FGG609C Technical Specifications

Electrical Characteristics

Parameter Specification
Core Voltage (VCCINT) 2.5V
I/O Voltage (VCCO) 1.5V / 2.5V / 3.3V
Maximum Operating Frequency 263 MHz
Process Technology 0.18 μm CMOS
Package Type FGG609 Fine-Pitch BGA (Pb-Free)
Temperature Range 0°C to +85°C (Commercial)

Clock Management with Four DLLs

The XC2S200-6FGG609C incorporates four dedicated Delay-Locked Loops (DLLs) for advanced clock management:

  • Zero Clock Delay through automatic delay compensation
  • Clock Multiplication up to 2× source frequency
  • Clock Division by 1.5, 2, 2.5, 3, 4, 5, 8, or 16
  • Four Quadrature Phase Outputs (0°, 90°, 180°, 270°)
  • Low-Skew Global Clock Distribution across all logic resources

XC2S200-6FGG609C I/O Standards and Interfaces

Versatile I/O Capabilities

One of the most significant advantages of the XC2S200-6FGG609C is its support for 16 high-performance I/O signaling standards. This versatility ensures seamless integration with virtually any system architecture.

Supported I/O Standards

Standard VREF VCCO Application
LVTTL (2-24mA) N/A 3.3V General purpose logic
LVCMOS2 N/A 2.5V Low-voltage CMOS
PCI (33/66 MHz) N/A 3.3V Computer bus interface
GTL/GTL+ 0.8V/1.0V N/A High-speed bus
HSTL Class I/III/IV 0.75V-0.9V 1.5V Memory interfaces
SSTL2/SSTL3 1.25V-1.5V 2.5V-3.3V DDR/SDRAM memory
AGP-2X 1.32V 3.3V Graphics interfaces

Fully PCI Compliant Design

The XC2S200-6FGG609C is fully compliant with PCI Local Bus specifications, supporting both 3.3V and 5V signaling at 33 MHz and 66 MHz operation. This makes it an excellent choice for PCI-based expansion cards and embedded systems.


XC2S200-6FGG609C Configuration Options

Multiple Configuration Modes

The XC2S200-6FGG609C supports four distinct configuration modes, providing maximum flexibility for system designers:

  1. Master Serial Mode – FPGA controls configuration clock, drives external PROM
  2. Slave Serial Mode – External controller provides configuration data and clock
  3. Slave Parallel Mode – Fastest configuration via 8-bit parallel interface
  4. Boundary-Scan Mode – IEEE 1149.1 JTAG configuration for in-system programming

Configuration File Specifications

Parameter Value
Configuration File Size 1,335,840 bits
Maximum CCLK Frequency 66 MHz
Slave Parallel Speed Up to 50 MHz (no handshake)

XC2S200-6FGG609C Applications

The XC2S200-6FGG609C excels across multiple industry sectors, offering reliable performance for demanding applications.

Telecommunications and Networking

  • Base station equipment
  • Routers and switches
  • Protocol converters
  • SDH/SONET interfaces

Industrial Control Systems

  • Motor control units
  • Process automation
  • Sensor data processing
  • Real-time monitoring systems

Consumer Electronics

  • Digital video processing
  • Audio equipment
  • Gaming hardware
  • Display controllers

Embedded Computing

  • Custom processors
  • Hardware accelerators
  • Interface bridges
  • Co-processing units

XC2S200-6FGG609C Development Support

Xilinx ISE Design Suite Compatibility

AMD Xilinx provides comprehensive development support for the XC2S200-6FGG609C through the ISE Design Suite. This integrated development environment offers:

  • Automatic Mapping, Placement, and Routing for rapid development
  • Timing-Driven Implementation to meet performance targets
  • Hierarchical Design Support for managing complex projects
  • EDIF Interface for third-party synthesis tool integration

Comprehensive Library Support

Designers benefit from a unified library containing over 400 primitives and macros, including:

  • Boolean functions and multiplexers
  • Arithmetic functions and comparators
  • Counters and shift registers
  • I/O functions and data registers

XC2S200-6FGG609C Ordering Information

Part Number Breakdown

Component Meaning
XC2S200 Spartan-II 200K System Gates
-6 Speed Grade (Higher Performance)
FGG Fine-Pitch BGA, Pb-Free
609 609-Ball Package
C Commercial Temperature (0°C to +85°C)

Why Choose the XC2S200-6FGG609C?

The XC2S200-6FGG609C represents an ideal solution for engineers seeking high-performance programmable logic without the expense and risk of custom ASIC development. Here are the key reasons to select this FPGA:

Cost-Effective Development

Unlike mask-programmed ASICs that require significant upfront investment, the XC2S200-6FGG609C enables cost-effective prototyping and production. You can modify designs without hardware changes, reducing time-to-market and development costs.

Unlimited Reprogrammability

Based on SRAM configuration technology, the XC2S200-6FGG609C supports unlimited reprogramming cycles. This means you can update designs in the field, fix bugs, and add features without replacing hardware.

Future-Proof Investment

With field-upgrade capability, your investment in the XC2S200-6FGG609C remains valuable even as requirements evolve. Design modifications can be implemented through software updates, extending product lifecycles.


XC2S200-6FGG609C Compliance and Quality

Environmental Standards

  • Pb-Free Package – RoHS compliant manufacturing
  • Lead-Free Soldering Compatible – Meets environmental regulations

Industry Standards

  • IEEE 1149.1 Boundary Scan – Full JTAG compliance for testing
  • PCI Local Bus – Certified compliance for PCI applications

Summary

The XC2S200-6FGG609C AMD Xilinx Spartan-II FPGA delivers an exceptional combination of performance, flexibility, and value. With 200,000 system gates, 56Kbits of block RAM, four DLLs, and support for 16 I/O standards, this programmable logic device meets the demands of modern digital design. Its -6 speed grade ensures higher performance operation at up to 263MHz, while the Pb-free FGG609 package supports environmentally responsible manufacturing.

For engineers requiring a reliable, reprogrammable alternative to ASICs, the XC2S200-6FGG609C provides the perfect balance of capability and cost-effectiveness.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.