The XC2S200-6FGG606C is a high-performance field-programmable gate array (FPGA) from AMD’s Spartan-II family, engineered to deliver exceptional programmable logic capabilities for demanding industrial and commercial applications. This comprehensive guide covers everything you need to know about the XC2S200-6FGG606C specifications, features, and applications.

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Overview of the XC2S200-6FGG606C FPGA

The XC2S200-6FGG606C represents the pinnacle of the Spartan-II FPGA family, offering 200,000 system gates combined with advanced on-chip features. As a Xilinx FPGA solution now under AMD’s portfolio, this device provides engineers with a cost-effective platform for implementing complex digital designs without the lengthy development cycles associated with traditional ASICs.

Built on proven 0.18-micron CMOS technology, the XC2S200-6FGG606C delivers reliable performance while maintaining low power consumption. The “-6” speed grade designation indicates higher performance operation, making this variant ideal for applications requiring faster clock speeds and reduced propagation delays.

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Key Specifications and Technical Parameters

Logic Resources and System Gates

The XC2S200-6FGG606C incorporates 5,292 logic cells organized in a 28 × 42 configurable logic block (CLB) array. Each CLB contains four logic cells with 4-input look-up tables (LUTs), providing exceptional flexibility for implementing combinational and sequential logic functions.

Memory Architecture

The dual-tier memory architecture of the XC2S200-6FGG606C includes both block RAM and distributed RAM options. The 14 dedicated block RAM modules support true dual-port operation with independent read and write clocks, enabling efficient data buffering and FIFO implementations.

Electrical Characteristics

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Package Information: FGG606 Fine-Pitch BGA

The XC2S200-6FGG606C utilizes a fine-pitch ball grid array (FBGA) package with 606 solder balls. The “FGG” designation indicates a lead-free (Pb-free) package compliant with RoHS environmental directives. This package type offers several advantages for high-density PCB designs.

Package Characteristics

• Package Type: Fine-Pitch Ball Grid Array (FBGA)
• Pin Count: 606 balls
• Ball Pitch: 1.0 mm
• Environmental Compliance: RoHS / Pb-Free
• Temperature Range: Commercial (0°C to +85°C)

The compact footprint of the FGG606 package makes the XC2S200-6FGG606C suitable for space-constrained applications while maintaining excellent signal integrity and thermal performance.

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Advanced On-Chip Features

Delay-Locked Loop (DLL) Technology

The XC2S200-6FGG606C includes four dedicated delay-locked loops providing advanced clock management capabilities. These DLLs eliminate clock distribution delay and support clock multiplication (2×) and division (up to 16×). Each DLL generates multiple clock phases (0°, 90°, 180°, 270°) for precise timing control.

Configurable I/O Standards

The versatile I/O architecture supports 16 different signaling standards, enabling seamless integration with various system interfaces.

Boundary Scan Support

Full IEEE 1149.1 (JTAG) boundary scan compliance enables comprehensive board-level testing and in-system programming. The dedicated test access port (TAP) supports EXTEST, SAMPLE/PRELOAD, BYPASS, and IDCODE instructions.

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Configuration Options

The XC2S200-6FGG606C supports multiple configuration modes for maximum flexibility in system design.

Supported Configuration Modes

The configuration bitstream size for the XC2S200-6FGG606C is 1,335,840 bits, which can be stored in standard serial PROMs or loaded dynamically from a microprocessor or other system controller.

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Application Areas for the XC2S200-6FGG606C

Industrial Control Systems

The high logic density and reliable operation of the XC2S200-6FGG606C make it ideal for industrial automation applications including motor control, process monitoring, and programmable logic controller (PLC) implementations.

Digital Signal Processing

With dedicated carry logic and efficient multiplier support, the XC2S200-6FGG606C excels in DSP applications such as filtering, signal conditioning, and real-time data processing. The block RAM provides efficient coefficient storage for FIR and IIR filter implementations.

Communications Infrastructure

The multiple I/O standards and DLL-based clock management enable implementation of various communication protocols and interfaces, from legacy parallel buses to high-speed serial links.

Prototyping and Development

As a superior alternative to mask-programmed ASICs, the XC2S200-6FGG606C provides unlimited reprogrammability for rapid prototyping and iterative design development. Field upgrades can be performed without hardware replacement.

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Development Tools and Software Support

The XC2S200-6FGG606C is fully supported by the Xilinx ISE Design Suite, providing a complete development environment for FPGA design.

Supported Tools

• Xilinx ISE WebPACK: Free synthesis and implementation tools
• ModelSim: Functional and timing simulation
• ChipScope Pro: In-system logic analysis
• FPGA Editor: Low-level design viewing and editing

The unified library contains over 400 primitives and macros, from basic logic gates to complex arithmetic functions, accelerating design development.

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Ordering Information and Part Number Breakdown

Understanding the XC2S200-6FGG606C part number helps identify the exact device specifications:

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Design Considerations and Best Practices

Power Supply Requirements

Proper decoupling is essential for reliable operation. Place multiple bypass capacitors near the VCCINT and VCCO pins, using a combination of bulk (10 µF) and high-frequency (0.1 µF, 0.01 µF) capacitors.

PCB Layout Guidelines

• Maintain controlled impedance routing for high-speed signals
• Provide adequate ground planes for signal integrity
• Follow manufacturer recommendations for BGA land pattern design
• Consider thermal management requirements for the package

Clock Distribution

Utilize the dedicated global clock resources and DLLs for optimal clock distribution. The four primary global clock nets provide low-skew clock delivery to all synchronous elements.

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Comparison with Alternative FPGA Solutions

The XC2S200-6FGG606C occupies a unique position in the programmable logic market, offering a balance of performance, logic density, and cost-effectiveness.

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Conclusion

The XC2S200-6FGG606C AMD Xilinx Spartan-II FPGA delivers robust programmable logic capabilities for a wide range of applications. With 200,000 system gates, 56K block RAM, four DLLs, and support for 16 I/O standards, this device provides the flexibility and performance required for modern digital design challenges. The lead-free FGG606 package ensures environmental compliance while enabling high-density PCB implementations.

Whether you’re developing industrial control systems, implementing DSP algorithms, or prototyping next-generation products, the XC2S200-6FGG606C offers a proven, cost-effective solution backed by comprehensive development tools and documentation.