Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.
  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.
Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.

Electronic Components Sourcing

Sourcing high-quality electronic components is essential to create quality products for your brand. Choosing the right parts ensures that your products are functional and useful for end users.

Our prototype runs are often a mix of large BGAs and tiny 0201 components, and we’ve had issues with other assembers on yield. PCBsync’s assembly team delivered a perfect first-run success. The board was pristine, the solder joints were impeccable under the microscope, and everything worked straight out of the box. Their attention to detail in the assembly process saved us weeks of debug time. They are now our go-to for critical prototype assembly.

Scaling from hundreds to tens of thousands of units for our smart home device presented huge supply chain and manufacturing challenges. PCBsync’s full electronic manufacturing service was the solution. They didn’t just build the PCB; they managed the entire box-build, sourced all components (even during shortages), and implemented a rigorous quality control system that drastically reduced our field failure rate. They act as a true extension of our own production team.

XC2S200-6FGG602C: High-Performance AMD Spartan-II FPGA for Industrial Applications

Product Details

The XC2S200-6FGG602C is a powerful Field Programmable Gate Array (FPGA) from AMD’s acclaimed Spartan-II family, engineered to deliver exceptional performance and reliability for demanding digital design applications. This versatile programmable logic device combines 200,000 system gates with advanced on-chip features, making it an ideal solution for engineers seeking cost-effective ASIC replacement technology with unlimited reprogrammability.

Whether you’re developing communication systems, industrial automation equipment, or medical devices, the XC2S200-6FGG602C offers the perfect balance of logic capacity, memory resources, and I/O flexibility. Browse our complete selection of Xilinx FPGA products to find the right programmable logic solution for your project.


XC2S200-6FGG602C Key Features and Benefits

Advanced FPGA Architecture

The XC2S200-6FGG602C utilizes second-generation ASIC replacement technology based on the proven Virtex FPGA architecture. This device features a streamlined design optimized for high-volume applications where cost-effectiveness and reliability are paramount.

High Logic Density and Gate Count

With 200,000 system gates and 5,292 logic cells, the XC2S200-6FGG602C provides substantial logic capacity for implementing complex digital designs. The 28 x 42 CLB (Configurable Logic Block) array offers flexible routing resources and efficient logic utilization.

SelectRAM Hierarchical Memory System

The XC2S200-6FGG602C incorporates AMD’s SelectRAM technology, providing:

  • 75,264 bits of distributed RAM (16 bits per LUT)
  • 56 Kbits of dedicated Block RAM in configurable 4K-bit blocks
  • Dual-port RAM capability for simultaneous read/write operations
  • Flexible memory configuration for various application requirements

XC2S200-6FGG602C Technical Specifications

Parameter Specification
Manufacturer AMD (formerly Xilinx)
FPGA Family Spartan-II
System Gates 200,000
Logic Cells 5,292
CLB Array 28 x 42
Total CLBs 1,176
Maximum User I/O 284
Distributed RAM 75,264 bits
Block RAM 56 Kbits
Delay-Locked Loops (DLLs) 4
Maximum Clock Frequency 263 MHz
Process Technology 0.18 µm CMOS
Core Voltage 2.5V
I/O Voltage 3.3V
Package Type FGG602 Fine-Pitch Ball Grid Array
Pin Count 602
Speed Grade -6 (Highest Performance)
Temperature Range Commercial (0°C to +85°C)
RoHS Compliance Pb-free (G designation)

XC2S200-6FGG602C Package Information

FGG602 Ball Grid Array Package

The XC2S200-6FGG602C comes in a 602-ball Fine-Pitch Ball Grid Array (FBGA) package, offering maximum I/O connectivity for complex system designs. The “G” designation indicates lead-free (Pb-free) packaging compliant with RoHS environmental regulations.

Pin Configuration and I/O Standards

The XC2S200-6FGG602C supports multiple I/O standards including:

  • LVTTL (Low Voltage TTL)
  • LVCMOS (Low Voltage CMOS)
  • PCI-compliant interfaces
  • SSTL and GTL standards
  • Differential signaling support

XC2S200-6FGG602C Speed Grade Explained

-6 Speed Grade Performance

The -6 speed grade designation indicates the highest performance tier available for Spartan-II devices. This grade is exclusively offered in the commercial temperature range and delivers:

  • Fastest propagation delays
  • Highest clock frequencies up to 263 MHz
  • Optimized timing for high-speed digital designs
  • Ideal for performance-critical applications

XC2S200-6FGG602C Clock Management

Four Delay-Locked Loops (DLLs)

The XC2S200-6FGG602C features four dedicated Delay-Locked Loops positioned at each corner of the die, providing:

  • Clock deskewing and distribution
  • Zero-delay clock buffering
  • Board-level clock synchronization
  • Frequency synthesis capabilities
  • Elimination of clock insertion delays

XC2S200-6FGG602C Applications

Industrial Automation and Control

The XC2S200-6FGG602C excels in industrial applications requiring:

  • Motor control systems
  • Process automation
  • PLC (Programmable Logic Controller) replacement
  • Machine vision processing
  • Sensor interfacing

Telecommunications and Networking

Ideal for communication equipment including:

  • Network routers and switches
  • Protocol converters
  • Data transmission systems
  • Baseband processing
  • Interface bridging

Medical and Healthcare Electronics

Suitable for medical device applications such as:

  • Diagnostic imaging systems
  • Patient monitoring equipment
  • Laboratory instruments
  • Medical signal processing

Consumer Electronics

Perfect for consumer products requiring:

  • Video processing
  • Audio systems
  • Display controllers
  • Gaming peripherals

XC2S200-6FGG602C Design Resources

Development Tools and Software

The XC2S200-6FGG602C is supported by AMD’s ISE Design Suite, offering:

  • Schematic and HDL design entry
  • Synthesis and implementation tools
  • Timing analysis and simulation
  • In-system debugging capabilities
  • JTAG programming interface

Configuration Options

The XC2S200-6FGG602C supports multiple configuration modes:

  • Master Serial mode
  • Slave Serial mode
  • Master Parallel mode
  • Slave Parallel mode
  • JTAG Boundary Scan programming

XC2S200-6FGG602C vs ASIC Solutions

Cost-Effective Alternative to Mask-Programmed ASICs

The XC2S200-6FGG602C offers significant advantages over traditional ASIC solutions:

Factor XC2S200-6FGG602C FPGA Mask-Programmed ASIC
Initial Cost Low Very High (NRE costs)
Development Time Weeks Months to Years
Design Risk Minimal Significant
Field Upgrades Yes (In-system reprogrammable) Impossible
Prototype Cost Minimal Extremely High
Time-to-Market Fast Slow

XC2S200-6FGG602C Ordering Information

Part Number Breakdown

XC2S200-6FGG602C decodes as follows:

  • XC2S200: Spartan-II 200K gate device
  • -6: Speed grade 6 (highest performance)
  • FG: Fine-pitch Ball Grid Array
  • G: Pb-free (RoHS compliant)
  • 602: 602-ball package
  • C: Commercial temperature range (0°C to +85°C)

Frequently Asked Questions About XC2S200-6FGG602C

What is the XC2S200-6FGG602C used for?

The XC2S200-6FGG602C is used for implementing custom digital logic designs in applications such as industrial automation, telecommunications, medical devices, and consumer electronics. Its programmable nature allows engineers to create tailored solutions without the cost and time associated with custom ASIC development.

Is the XC2S200-6FGG602C still available?

Yes, the XC2S200-6FGG602C remains available through authorized AMD distributors and electronic component suppliers. While it’s a mature product, it continues to be used in maintenance, repair, and legacy system applications.

What voltage does the XC2S200-6FGG602C require?

The XC2S200-6FGG602C requires a 2.5V core supply voltage (VCCINT) and 3.3V I/O supply voltage (VCCO) for standard operation.

Can the XC2S200-6FGG602C be reprogrammed in-circuit?

Yes, the XC2S200-6FGG602C supports in-system programmability via JTAG interface, allowing field upgrades without hardware replacement.

What development tools support the XC2S200-6FGG602C?

AMD’s ISE Design Suite provides complete support for the XC2S200-6FGG602C, including design entry, synthesis, implementation, simulation, and programming tools.


XC2S200-6FGG602C Summary

The XC2S200-6FGG602C represents an excellent choice for engineers requiring a reliable, high-performance FPGA solution with proven architecture and extensive design resources. With 200,000 system gates, 5,292 logic cells, and comprehensive memory resources, this Spartan-II device delivers outstanding value for digital design applications across multiple industries.

For more information about programmable logic solutions and related components, explore our complete range of FPGA products and technical resources.

Contact Sales & After-Sales Service

Contact & Quotation

  • Inquire: Call 0086-755-23203480, or reach out via the form below/your sales contact to discuss our design, manufacturing, and assembly capabilities.

  • Quote: Email your PCB files to Sales@pcbsync.com (Preferred for large files) or submit online. We will contact you promptly. Please ensure your email is correct.

Drag & Drop Files, Choose Files to Upload You can upload up to 3 files.

Notes:
For PCB fabrication, we require PCB design file in Gerber RS-274X format (most preferred), *.PCB/DDB (Protel, inform your program version) format or *.BRD (Eagle) format. For PCB assembly, we require PCB design file in above mentioned format, drilling file and BOM. Click to download BOM template To avoid file missing, please include all files into one folder and compress it into .zip or .rar format.