The XC2S200-6FGG601C is a powerful Field Programmable Gate Array (FPGA) from AMD’s renowned Spartan-II family. This high-density programmable logic device delivers exceptional performance with 200,000 system gates, making it an ideal solution for digital signal processing, telecommunications, and industrial control systems.
XC2S200-6FGG601C Technical Overview
The XC2S200-6FGG601C represents the flagship device in the Spartan-II FPGA family, combining high logic density with cost-effective implementation. Built on advanced 0.18-micron CMOS technology, this Xilinx FPGA delivers reliable performance for demanding embedded applications.
Key Specifications at a Glance
| Parameter |
Specification |
| System Gates |
200,000 |
| Logic Cells |
5,292 |
| CLB Array |
28 × 42 |
| Total CLBs |
1,176 |
| Maximum User I/O |
284 |
| Block RAM |
56 Kbits (14 blocks) |
| Distributed RAM |
75,264 bits |
| DLLs |
4 |
| Core Voltage (VCCINT) |
2.5V |
| I/O Voltage (VCCO) |
1.5V / 2.5V / 3.3V |
| Process Technology |
0.18µm CMOS |
| Package Type |
Fine-Pitch BGA (Pb-Free) |
| Speed Grade |
-6 (High Performance) |
| Temperature Range |
Commercial (0°C to +85°C) |
| Maximum Frequency |
Up to 263 MHz |
Understanding the XC2S200-6FGG601C Part Number
Breaking down the part number helps engineers understand the exact device specifications:
Part Number Nomenclature
- XC2S200: Spartan-II device with 200K system gates
- -6: Speed grade 6 (highest performance tier)
- FGG: Fine-pitch Ball Grid Array, Pb-free (RoHS compliant)
- 601: Pin count designation
- C: Commercial temperature range (0°C to +85°C)
XC2S200-6FGG601C Architecture and Features
Configurable Logic Block (CLB) Structure
The XC2S200-6FGG601C features an advanced CLB architecture organized in a 28 × 42 array, providing 1,176 total CLBs. Each CLB contains:
- Four Logic Cells (LCs): Organized in two slices for maximum flexibility
- 4-Input Look-Up Tables (LUTs): Implementing any Boolean function
- Dedicated Carry Logic: Enabling high-speed arithmetic operations
- Storage Elements: Edge-triggered D-type flip-flops or level-sensitive latches
SelectRAM Hierarchical Memory System
The XC2S200-6FGG601C incorporates AMD’s SelectRAM technology:
Block RAM Specifications
- Total Capacity: 56 Kbits across 14 dedicated blocks
- Block Size: 4,096 bits per block
- Port Configuration: True dual-port capability
- Aspect Ratios: 4096×1, 2048×2, 1024×4, 512×8, or 256×16
Distributed RAM Features
- Total Capacity: 75,264 bits
- Implementation: 16 bits per LUT
- Configuration Options: Single-port, dual-port, or shift register modes
Delay-Locked Loop (DLL) Clock Management
The XC2S200-6FGG601C includes four dedicated DLLs providing:
- Zero propagation delay clock distribution
- Clock multiplication (2×) and division (÷1.5 to ÷16)
- Four-phase clock outputs (0°, 90°, 180°, 270°)
- Board-level clock deskewing capability
- Automatic delay compensation
I/O Capabilities of XC2S200-6FGG601C
Supported I/O Standards
The XC2S200-6FGG601C supports 16 high-performance interface standards:
| Standard |
Reference Voltage |
Output Voltage |
| LVTTL |
N/A |
3.3V |
| LVCMOS2 |
N/A |
2.5V |
| PCI (33/66 MHz) |
N/A |
3.3V |
| GTL |
0.8V |
N/A |
| GTL+ |
1.0V |
N/A |
| HSTL Class I |
0.75V |
1.5V |
| HSTL Class III/IV |
0.9V |
1.5V |
| SSTL2 Class I/II |
1.25V |
2.5V |
| SSTL3 Class I/II |
1.5V |
3.3V |
| CTT |
1.5V |
3.3V |
| AGP-2X |
1.32V |
3.3V |
I/O Banking Architecture
The device features eight independent I/O banks enabling:
- Mixed voltage operation across different interfaces
- Flexible pin assignment for complex system designs
- Hot-swap Compact PCI compliance
- Zero hold time for simplified system timing
Configuration Options for XC2S200-6FGG601C
Configuration Modes
| Mode |
CCLK Direction |
Data Width |
Description |
| Master Serial |
Output |
1-bit |
FPGA controls configuration from PROM |
| Slave Serial |
Input |
1-bit |
External controller provides data |
| Slave Parallel |
Input |
8-bit |
Fastest configuration option |
| Boundary Scan (JTAG) |
N/A |
1-bit |
IEEE 1149.1 compliant |
Configuration File Requirements
- Bitstream Size: 1,335,840 bits
- Configuration Clock: Up to 66 MHz
- Unlimited Reprogrammability: SRAM-based architecture
XC2S200-6FGG601C Application Areas
Ideal Use Cases
The XC2S200-6FGG601C excels in numerous applications:
Digital Signal Processing
- FIR/IIR filter implementation
- FFT acceleration
- Image processing pipelines
Telecommunications
- Protocol conversion bridges
- Data encoding/decoding
- Network interface controllers
Industrial Control
- Motor control systems
- PLC implementations
- Sensor interface processing
Consumer Electronics
- Video processing systems
- Audio codec interfaces
- Display controllers
Advantages Over Mask-Programmed ASICs
The XC2S200-6FGG601C offers significant benefits compared to traditional ASICs:
Development Benefits
- Eliminated NRE Costs: No mask tooling expenses
- Reduced Time-to-Market: Immediate prototyping capability
- Design Flexibility: In-system reprogrammability
- Risk Mitigation: Field-upgradeable designs
Operational Advantages
- Inventory Management: Single part number for multiple designs
- Future-Proofing: Easy design modifications and enhancements
- Cost-Effective: Ideal for low-to-medium volume production
Design Tool Support
Development Environment
The XC2S200-6FGG601C is fully supported by:
- ISE Design Suite: Complete synthesis, implementation, and verification
- HDL Support: VHDL and Verilog design entry
- IP Core Library: 400+ pre-verified primitives and macros
- Timing Analysis: Integrated static timing verification
Available IP Functions
- Arithmetic functions and multipliers
- Counters and shift registers
- Memory controllers
- I/O interface modules
- DSP building blocks
XC2S200-6FGG601C Electrical Specifications
Absolute Maximum Ratings
| Parameter |
Rating |
| VCCINT |
-0.5V to +3.0V |
| VCCO |
-0.5V to +4.0V |
| Input Voltage |
-0.5V to VCCO + 0.5V |
| Storage Temperature |
-65°C to +150°C |
Recommended Operating Conditions
| Parameter |
Minimum |
Typical |
Maximum |
| VCCINT |
2.375V |
2.5V |
2.625V |
| VCCO (3.3V) |
3.0V |
3.3V |
3.6V |
| VCCO (2.5V) |
2.375V |
2.5V |
2.625V |
| Junction Temperature |
0°C |
— |
+85°C |
Boundary Scan (JTAG) Support
The XC2S200-6FGG601C includes full IEEE 1149.1 compliance:
Supported Instructions
- EXTEST: External interconnect testing
- SAMPLE/PRELOAD: Capture and preload operations
- BYPASS: Single-bit bypass register
- IDCODE: Device identification
- USERCODE: User-defined code access
- CFG_IN/CFG_OUT: Configuration and readback
Ordering Information Summary
Device Nomenclature
XC2S200-6FGG601C
- High-performance speed grade (-6)
- Pb-free, RoHS-compliant packaging
- Commercial temperature operation
- Full 284 user I/O availability
Conclusion
The XC2S200-6FGG601C delivers an optimal balance of logic density, memory resources, and I/O flexibility for cost-sensitive applications requiring high performance. With 200,000 system gates, 56 Kbits of block RAM, and support for 16 I/O standards, this Spartan-II FPGA provides a robust platform for industrial, telecommunications, and embedded system designs.
Whether upgrading legacy designs or developing new products, the XC2S200-6FGG601C offers the reliability and programmability that modern electronic systems demand.
