The XC2S200-6FGG595C is a high-performance Field Programmable Gate Array (FPGA) from AMD’s Spartan-II family, delivering exceptional programmable logic capabilities for cost-sensitive applications. This 595-pin Fine-Pitch BGA package device offers 200,000 system gates, making it an ideal solution for telecommunications, industrial automation, and embedded system designs requiring flexible digital logic implementation.

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Key Features of the XC2S200-6FGG595C FPGA

The XC2S200-6FGG595C combines advanced programmable architecture with robust I/O capabilities, providing engineers with a powerful platform for complex digital designs.

High-Density Logic Resources

The XC2S200-6FGG595C features 5,292 logic cells organized in a 28 × 42 Configurable Logic Block (CLB) array. Each CLB contains four Logic Cells (LCs), with each LC including a 4-input Look-Up Table (LUT), dedicated carry logic, and a storage element that can function as either an edge-triggered D-type flip-flop or level-sensitive latch.

Advanced Memory Architecture

The XC2S200-6FGG595C incorporates a hierarchical SelectRAM memory system. The distributed RAM utilizes LUTs for shallow memory structures, while 14 dedicated block RAM modules provide 56K bits of synchronous dual-port memory. Each 4,096-bit block RAM supports independent read/write operations with configurable aspect ratios ranging from 4096×1 to 256×16.

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XC2S200-6FGG595C Technical Specifications

Electrical Characteristics

The -6 speed grade designation indicates this XC2S200-6FGG595C variant delivers higher performance compared to standard -5 speed grade devices, supporting system clock rates up to 200 MHz for demanding applications.

Supported I/O Standards

The XC2S200-6FGG595C supports 16 high-performance interface standards, enabling seamless integration with diverse system architectures:

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Clock Management and DLL Features

The XC2S200-6FGG595C integrates four Delay-Locked Loop (DLL) circuits positioned at each corner of the die, providing advanced clock management capabilities essential for high-speed digital designs.

DLL Capabilities

Each DLL in the XC2S200-6FGG595C offers:

• Zero propagation delay clock distribution
• Four quadrature phase outputs (0°, 90°, 180°, 270°)
• Clock doubling (2×) functionality
• Clock division ratios: 1.5, 2, 2.5, 3, 4, 5, 8, and 16
• Board-level clock deskewing through mirror mode

The four dedicated global clock networks ensure minimal clock skew across all flip-flops, supporting system frequencies up to 200 MHz while maintaining signal integrity throughout the device.

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Package Information: 595-Pin Fine-Pitch BGA

FGG595C Package Specifications

The “G” designation in XC2S200-6FGG595C indicates Pb-free packaging, ensuring compliance with RoHS environmental regulations. This package option provides excellent thermal performance and reliable solder joint formation for high-volume manufacturing.

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Configuration Options for XC2S200-6FGG595C

Supported Configuration Modes

The XC2S200-6FGG595C requires approximately 1.34 Mb (1,335,840 bits) of configuration data. The device supports unlimited reprogramming cycles through its SRAM-based configuration architecture, enabling field upgrades without hardware replacement.

IEEE 1149.1 Boundary Scan Support

Full JTAG compliance allows the XC2S200-6FGG595C to integrate seamlessly into boundary-scan test chains, supporting EXTEST, SAMPLE/PRELOAD, BYPASS, and configuration instructions for in-system programming and debugging.

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Applications for the XC2S200-6FGG595C

The XC2S200-6FGG595C serves as a cost-effective alternative to mask-programmed ASICs, eliminating NRE costs and lengthy development cycles while maintaining production-ready performance.

Target Applications

The XC2S200-6FGG595C’s combination of high-density logic, abundant I/O, and fast multiply-accumulate structures makes it particularly suitable for digital signal processing applications requiring real-time performance.

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Development Tools and Software Support

The XC2S200-6FGG595C is fully supported by Xilinx ISE development tools, providing a comprehensive design environment for implementation and verification.

Design Flow Features

The ISE toolchain includes over 400 library primitives and macros, from basic logic gates to 16-bit accumulators, accelerating design development for the XC2S200-6FGG595C platform.

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Ordering Information

Part Number Breakdown: XC2S200-6FGG595C

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Why Choose the XC2S200-6FGG595C?

The XC2S200-6FGG595C delivers compelling advantages for volume production and rapid prototyping environments. Its SRAM-based architecture enables unlimited design iterations, while the optimized 0.18 µm process technology ensures competitive pricing without sacrificing performance.

For engineers seeking reliable programmable logic solutions, the XC2S200-6FGG595C offers proven Spartan-II architecture combined with modern Pb-free packaging for environmentally conscious manufacturing. Explore our complete selection of Xilinx FPGA devices to find the optimal solution for your application requirements.

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Related Resources

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The XC2S200-6FGG595C represents AMD’s commitment to delivering high-value programmable logic solutions. As a member of the Spartan-II FPGA family, this device continues to serve applications demanding reliable, cost-effective digital logic implementation with industry-leading development tool support.